Abstract: In one embodiment, a bipolar cell (31) includes a cell boundary (32) that defines a cell active area (33), a first array of bipolar transistors (41) is formed within the cell active area (33) and configured for a first function. The bipolar transistors (42) within the first array (41) are parallel to each other. The bipolar cell (31) further includes a second array of bipolar transistors (61) formed within the cell active area (33) and configured for a second function that is different than the first function. The bipolar transistors (62) within the second array (61) are parallel to each other and oriented in a different direction than the transistors (42) in the first array (41).

Abstract: A semiconductor package (101) has a die (1), a leadframe (4), a bond pad (6), an encapsulation (3) and a wire bond ball (2). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (7), and remainder of the bond wire is removed. Locations (23) for attaching the wire bond ball are recorded with reference to fiducials (5) on the lead frame. The encapsulation covers the die, deposits and die attach flag (24) of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings (17) for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.