Patents Represented by Attorney L. H. Birnbaum
  • Patent number: 6034405
    Abstract: The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by deposition of a layer of aluminum. The structure is preferably annealed to form titanium silicide and titanium-aluminum interface layers. The component is then bonded to the aluminum layer.
    Type: Grant
    Filed: July 22, 1997
    Date of Patent: March 7, 2000
    Assignee: Lucent Technologies, Inc.
    Inventors: Michael Francis Brady, Mindaugas Fernand Dautartas, James F. Dormer, Sailesh Mansinh Merchant, Casimir Roman Nijander, John William Osenbach
  • Patent number: 5933437
    Abstract: The invention in one aspect is an optical fiber laser which includes a core having two different dopants. Pump signals having different wavelengths are introduced into the core through the cladding so that each dopant absorbs a different wavelength. In another aspect, the invention is an optical fiber amplifier which is pumped by at least one fiber laser having the two dopants.
    Type: Grant
    Filed: March 28, 1997
    Date of Patent: August 3, 1999
    Assignee: Lucent Technologies Inc.
    Inventor: Jean-Marc Pierre Delavaux
  • Patent number: 5925876
    Abstract: The invention is a circuit for eliminating or reducing unwanted components from an optical output signal. The circuit employs a photodetector for converting a portion of the output signal to an electrical signal, and a feedback loop which passes only the second harmonic band or the frequency difference band for combining with the input biasing signal.
    Type: Grant
    Filed: September 18, 1997
    Date of Patent: July 20, 1999
    Assignee: Lucent Technologies Inc.
    Inventors: Scott L. Broutin, James Kevin Plourde
  • Patent number: 5838859
    Abstract: An optical transceiver assembly for use in a bidirectional system includes a beam splitter to direct an incoming signal to a photodiode. An outgoing signal from a laser diode is partially transmitted and partially reflected by the splitter. The reflected signal, which may reach the photodiode, constitutes crosstalk which is reduced by orienting the polarization direction of the splitter essentially parallel to that of the outgoing signal from the laser diode. In another embodiment, which enhances coupling efficiency, a single element asphere lens is positioned between the laser diode and the splitter.
    Type: Grant
    Filed: November 25, 1996
    Date of Patent: November 17, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Timothy Butrie, Shigemasa Enoeda, Joseph Edward Riska, Stephen James Salko, Thomas Stanley Stakelon, Alka Swanson, Toshimichi Yasuda
  • Patent number: 5215602
    Abstract: Disclosed is a water-soluble solder flux and a method of fabricating circuit boards which does not adversely affect the insulation resistance of the boards. The flux applied to the board comprises a vehicle including at least two random copolymers of polyalkylene glycol with various amounts of ethylene oxide and propylene oxide. The flux also exhibits a low viscosity for improved copper coverage.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: June 1, 1993
    Assignees: AT&T Bell Laboratories, London Chemical Company
    Inventors: Mir K. Ali, Chia C. Chang
  • Patent number: 5175662
    Abstract: Disclosed is a device which includes a Maintenance Termination Unit (MTU) and surge protector in a single 5-pin package. In accordance with one embodiment, a base includes an array of spring contacts, including a grounding element, in which are inserted both a surge protector module and an edge of a circuit board including the MTU.
    Type: Grant
    Filed: August 30, 1991
    Date of Patent: December 29, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: George A. DeBalko, Rajendra S. Rana, Warren J. Rhines
  • Patent number: 5150277
    Abstract: Disclosed is an apparatus for cooling unvented cabinets housing electronic equipment. A fanning unit at a bottom portion of the cabinet draws air down through the spaces between printed circuit boards which include the electronic components. A plate installed on the inside of the cabinet door creates a duct to cause cooling of the air at the door surface as it flows upward for recirculation. A heat exchange element may also be provided in the space between the equipment mounted on both sides of the cabinet.
    Type: Grant
    Filed: July 6, 1991
    Date of Patent: September 22, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: Gary D. Bainbridge, Stephen J. Palaszewski
  • Patent number: 5146079
    Abstract: A broadband optical receiver which exhibits low noise and distortion characteristics. An active bias feedback circuit stabilizes the quiescent operating currents of a low noise amplifier coupled to the receiver photodetector. A transformer matches the impedance of the amplifier to an attenuator.
    Type: Grant
    Filed: November 1, 1990
    Date of Patent: September 8, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: Richard J. Lisco
  • Patent number: 5136121
    Abstract: Disclosed is a cable terminal with improved features. Drop wires are sealed by a flexible sheet with an array of slits provided on a major surface of a pair of plates. The slits are positioned and oriented so that when the plates are in a closed position, the sheet will overlap to produce a pair of angled slits at each drop wire location. The housing forming the terminal block enclosure and a portion of the cable housing is made from a single molded piece with holes for mounting different types of terminal blocks. The terminal block enclosure is covered by a door which provides moisture protection when closed. A spring attached to the door keeps it in an opened position while a craftsperson is working on the blocks. The cable housing includes end pieces which accommodate a number of different sealing options for the cable.
    Type: Grant
    Filed: March 29, 1991
    Date of Patent: August 4, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: Theodore E. Kluska, Arnold R. Smith
  • Patent number: 5129030
    Abstract: Disclosed is an optical fiber distribution frame which comprises trays including panels of optical connectors. Each tray is slidably mounted in the frame and can be pivoted downward to provide front access to the fibers and connectors in the frame.
    Type: Grant
    Filed: May 30, 1991
    Date of Patent: July 7, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: Alexander Petrunia
  • Patent number: 5121290
    Abstract: Disclosed is an apparatus for providing forced air cooling of components mounted on circuit boards in a stacked configuration. A plurality of perforations is provided in the circuit boards so that air flow in the channel between boards causes air to be sucked through the perforations to eliminate stagnant areas between components and provide local jet impingement cooling.
    Type: Grant
    Filed: June 25, 1990
    Date of Patent: June 9, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: Kaveh Azar
  • Patent number: 5116718
    Abstract: Disclosed is a method for increasing the resolution in contact printing operations by ensuring an intimate contact between the mask and photoresist. A flow of air is directed at the underside of the workpiece being printed while the mask is in place to provide pressure for the necessary contact.
    Type: Grant
    Filed: June 14, 1991
    Date of Patent: May 26, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: William F. Dalton, Henry B. Micks, Jr.
  • Patent number: 5112238
    Abstract: Disclosed is a backplane connector with shorting contacts for providing re-routing of signals when a circuit pack is withdrawn from its shelf. Shorting contacts are mounted on a block which is attached to the inside of an insulating shroud surrounding the contact pins. The shorting contacts make electrical contact between pins when a circuit pack is removed, but are otherwise electrically isolated from the pins.
    Type: Grant
    Filed: July 12, 1991
    Date of Patent: May 12, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: Miguel Cizin
  • Patent number: 5110036
    Abstract: Disclosed is a method and apparatus for fabricating workpieces such as printed circuit boards which include blowing excess solder off the board by a hot air solder leveling technique. A converging/diverging airknife design creates a shock wave, causing a high pressure, low velocity flow pattern which removes solder from the through-holes in the board while leaving sufficient solder on the surface mount features. Additionally, a Mach number of the fluid of less than 0.8 is created.
    Type: Grant
    Filed: December 17, 1990
    Date of Patent: May 5, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: John L. Parker, Jr.
  • Patent number: 5107323
    Abstract: A semi-insulating layer is formed over a high voltage device in order to protect the device substrate from charge buildup. A layer comprising silicon oxynitride is deposited over the semi-insulating layer in order to prevent arcing between device electrodes and provide corrosion resistance.
    Type: Grant
    Filed: May 16, 1991
    Date of Patent: April 21, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: William R. Knolle, John W. Osenbach
  • Patent number: 5103374
    Abstract: Disclosed is a fluid-cooled circuit pack which includes heat generating components on a front surface of a circuit board and another surface opposite to the front surface to create a channel for the flow of cooling fluid over the components. An array of rods, or turbulators, are provided on the surface opposite the printed circuit board front surface to create disturbances in the fluid flow and enhance heat transfer.
    Type: Grant
    Filed: May 23, 1990
    Date of Patent: April 7, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: Kaveh Azar
  • Patent number: 5100518
    Abstract: Disclosed is a method and apparatus for achieving a uniform coating of metal, such as copper, on an insulating strip, such as polyimide. After activating the surface, the strip is passed through a plating cell which includes a pumped solution mixed with a gas to achieve frothing. A high current is supplied to the cathode, so a cooled cathode construction is provided to prevent burning of the strip. Further features of the apparatus include a means for splicing strips, and a cantilever beam cathode contact for improving the physical contact with the strip.
    Type: Grant
    Filed: December 20, 1990
    Date of Patent: March 31, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: Harold E. Fuchs, Robert E. McAnany
  • Patent number: 5080722
    Abstract: Disclosed is a method for cleaning solder flux connectors. A first solution comprising a monobasic ester is applied to the connectors. A second solution, which can include a solvent for a lubricant, is then applied to displace the first solvent.
    Type: Grant
    Filed: February 26, 1991
    Date of Patent: January 14, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: Paul J. Englert, Peter H. Read
  • Patent number: 5067047
    Abstract: Disclosed is a means for cooling heat generating components mounted on the front surface of printed circuit boards. A conduit member is attached to the back surface of the board to form a sealed plenum and to provide direction of cooling fluid toward the components. Holes in the board establish cooling jets directed at the components from the plenum.
    Type: Grant
    Filed: May 11, 1990
    Date of Patent: November 19, 1991
    Assignee: AT&T Bell Laboratories
    Inventor: Kaveh Azar
  • Patent number: 5048747
    Abstract: Disclosed is an apparatus, method, and resulting product involving soldering of components, such as the soldering of flexible circuits to printed circuit boards. Holes are provided in the areas of one component which are to be soldered to pads on the other component. Precise amounts of solder are provided to each pad, preferably by means of a shuttle element which carries solder paste in cavities corresponding to the pads and which deposits the solder on the pads when the solder is melted. The holes in the component are aligned with the pads, and the solder is reflowed so that a visible solder fillet is formed above the holes to permit inspection of the solder joint.
    Type: Grant
    Filed: July 31, 1990
    Date of Patent: September 17, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: William A. Clark, Michael A. Oien, Walter Pelosi