Abstract: Disclosed is an output buffer which utilizes CMOS components to convert from CMOS to ECL voltages. The circuit includes a field effect transistor and an external resistor for providing both high and low voltages by applying to the gate of the field effect transistor appropriate control voltages.

Abstract: A high amperage underwater magnetic switch for A.C. electrical current. The magnetic switch circuit is incorporated into one of the three electrical conductors passing through an underwater electrical cable. The magnetic switch circuit has a triac and a magnetic reed switch in it. The magnetic switch circuit is located inside a tubular sleeve that has been filled with epoxy resin to make it waterproof. The switch may be manually operated externally by a magnet mounted on a sliding collar that surrounds the tubular sleeve.

Abstract: Disclosed is a circuit for the automatic testing of channel units such as found in subscriber loop carrier (SLC.RTM.) systems. The circuit is included as part of the remote terminal of the system and performs type tests, power-up tests and routine verification tests. The circuit also monitors the subscriber channel, and connects the subscriber in the event of a ringing signal or an off-hook during a test. The results of the test are sent to a display unit which can be located at the remote terminal and/or the central office.

Abstract: Disclosed is an integral connector unit for use primarily as a network interface. The unit combines a connection to customer premises equipment either in the form of screws or self-strip terminals, an RJ11 plug, and a strain relief member for the plug. Latching means are also included for snapping the circuit into the chassis of a terminal housing.

Abstract: An input analog signal having a prescribed component is coverted into an n bit digital signal using low resolution circuitry. An m>n bit digial signal representative of the prescribed component is generated from stored information and past samples of the digital output signal and transformed into a coarsely quanitized analog signal. The prescribed component representative analog signal is subtracted from the input analog signal to form a difference representative signal which is converted into an n-m bit digital signal and them bit digital signal is combined with the n-m bit difference representative signal to produce an n bit digtial signal corresponding to the input analog signal.

Abstract: Described is a method for assembling multi-fiber array connectors. V-grooved silicon chips are placed in a holder which allows the chips to "float" with respect to each other and adjust to varying fiber diameters. Once the fibers are inserted, the chips are clamped and cemented together with the fibers fixed in the grooves.

Abstract: A communication system for exchanging digital signals over a transmission link has at least one terminal that simultaneously applies an analog signal corresponding to a first digital stream to the link and converts an analog signal from the link into a second digital stream. The analog signal received from the link has a near end echo component related to the first digital stream.

Abstract: Disclosed is a terminal block for providing electrical connection to insulated wire pairs. An entrance port of the block includes a blade for separating the wires as they are inserted therein. The wires are then positioned above a respective one of a pair of insulation displacement contacts. Pressure applied to the top of the block, as by screwing, drives each wire into its associated contact thereby causing penetration of the insulation for electrical connection. Posts may also be molded into the block to provide strain relief for the wires.

Abstract: Disclosed is a cable seal for use primarily in aerial closures and terminals. The seal includes a pair of compliant elements with their major surfaces in contact. Each element includes a series of rings attached by a thin web of material so that rings can be removed to accommodate different cable sizes. A slit extends radially from the center ring to permit installation of the elements over the cable. The slits of the two elements are arranged out of alignment to ensure that no gaps in the seal exist at the slits.

Abstract: Disclosed is a method for selective soldering of components by inductive heating. A ferromagnetic material is provided as part of the components so that an applied electromagnetic field will create sufficient heat to melt the solder. The Curie temperature of the material is chosen to be just above the melting temperature of the solder to regulate the amount of heating.

Abstract: In an arrangement for simultaneously exchanging digital symbols between terminals over a bidirectional transmission path, near term interference in the signal received from the transmission path is canceled by storing the sequence of successive digital symbols 1, 2, . . . , N applied to the transmission path, forming a replica of the interference from the stored digital symbols and subtracting the replica from the received signal. A signal representative of a replica of the interference occurring subsequent to the Nth digital symbol of the successive digital symbols 1, 2, . . . , N is then generated and combined with the signal having the interference corresponding to the stored symbol sequence removed to cancel the subsequent interference in the received signal.

Abstract: Disclosed in a compact and inexpensive coaxial connector and jack assembly. The spring member which makes the ground connection to the coaxial cable is designed with sufficient rigidity so that the standard sleeve member surrounding the spring is eliminated.

Abstract: A method and apparatus are disclosed for removal of defective semiconductor chips from hybrid integrated circuits. The apparatus includes a jet nozzle which directs at least four high pressure water jet streams to the area surrounding the defective chip. The nozzle is also provided with a fixture for sealing off this area from the rest of the circuit by making contact to the encapsulant on the circuit. The jet streams bore through the encapsulant within the area defined by the fixture and are deflected by the ceramic substrate to an area under the chip thereby lifting off the chip. The invention therefore provides relatively fast removal of the defective chips without damaging the ceramic substrates or other components of the circuit.

Abstract: A metallization scheme for providing an ohmic contact to n-type III-V semiconductors is described. A metallurgical combination including germanium and palladium is formed on the semiconductor surface either in the form of an alloy or discrete layers. The structure is then heated so that the metallic and semiconductor components interdiffuse to establish the ohmic contact without melting of the metal. One advantage of such a solid state process is the high degree of dimensional control of the contact which is attainable.

Abstract: Disclosed is a bonding and packaging scheme for semiconductor device chips with particular application to semiconductor monolithic display chips. The display chip is bonded face down in a recess formed in a transparent substrate. In one embodiment, the metallization on the chip is aligned and made coplanar with the auxiliary metallization on the substrate, and the gap between the metallizations is bridged by a conductive material. This can be accomplished, for example, by solder reflow or epoxy bonding techniques. In an alternative embodiment, the metallization is formed after the chip is bonded to the substrate utilizing a coating which fills the gap between the chip and the substrate. The substrate may be dyed to act as a contrast filter, and a magnifying lens may be molded thereon in further processing.

Abstract: An electrolytic process for etching Group III - Group V semiconductive compounds, especially gallium-containing compound semiconductors. The sample to be etched is made the anode in an electrolytic cell wherein the electrolyte includes nitrate or chloride ions. Etching rates may be easily controlled according to the current supplied to the system.

Abstract: A method and apparatus is described for determining the presence and quantity of micro-organisms, such as bacteria, fungue and yeast, in a given sample. The apparatus includes two sealed containers, a portion of which may be penetrated by a sharp instrument, as for example, glass vials with flexible septum tops. One container includes a radioactive nutrient medium which is capable of s supporting the life process of the micro-organism whose presence is being tested. The second container includes a liquid scintillation solution which absorbs the product of metabolism of the organisms. The sample is introduced into the first sealed container, for example, by means of a standard syringe. Any micro-organisms present will consume the radioactive nutrient and as a result produce radioactive waste. Means are then applied to penetrate the containers and allow the flow of the radioactive metabolic product from the first container to the second container while preventing any contamination from the ambient.

Abstract: Charge transfer devices of either the charge coupled or bucket brigade type are described which allow movement of charge carriers in two noncollinear directions in the surface plane of the device. One level of metallization is utilized to provide the appropriate surface potential for charge transfer in the storage medium.The electrode pattern comprises charge transfer electrodes which are coupled diagonally to one of a plurality of conduction paths. Directionally is aided by asymmetric potentials under each electrode which may be formed by localized regions of fixed charge at the surface of the storage medium. Horizontal or vertical transfer is determined by the sequence of biasing the conductive paths. In one embodiment, the electrode pattern is formed by strips of conductive material shaped in the form of diagonally overlapping quadrilateral members and positioned so as to form an array resembling the normal two-dimensional array of discrete transfer electrodes.

Abstract: A variable gap device which comprises a suitable material with a cavity formed therein mounted over a body. Elements are formed on the surface of the body and on the top surface of the cavity. In one embodiment, the elements are electrodes of a variable capacitance device, and in another embodiment the elements are partial or total reflectors of incident light from an optical fiber. The surface of the cavity opposite the body is preferably flat and of the order of microns from the body.The device is fabricated by forming a removable layer over a temporary substrate. An appropriate element pattern is formed over the removable layer and the layer is etched in a configuration which will define the cavity. The deformable material is encapsulated over this structure and then removed from the substrate with the element remaining in the cavity. Any removable material remaining in the cavity can then be etched away.