Abstract: An organohydrogenpoly siloxane resin having the formula (I): (R1R32SiO½)w(R32SiO½)x(R1SiO3/2)y(SiO4/2)z, wherein R1 is C1 to C10 hydrocarbyl or C1 to C10 halogen-substituted hydrocarbyl, both free of aliphatic unsaturation, R3 is R1 or an organosilylalkyl group having at least one siliconbonded hydrogen atom, w is from 0 to 0.8, x is from 0 to 0.6, y is from 0 to 0.99, z is from 0 to 0.35, w+x+y+z=1, y+z/(w+x+y+z) is from 0.2 to 0.99, w+x/(w+x+y+z) is from 0.01 to 0.8, and at least 50 mol % of the groups R3 are organosilylalkyl; a silicone composition containing the resin, and a cured silicone resin prepared by curing the silicone composition.

Abstract: A silicone resin containing boron, aluminum, and/or titanium, and having silicon-bonded branched alkoxy groups; a silicone composition containing a silicone resin; and a method of preparing a coated substrate comprising applying a silicone composition on a substrate to form a film and pyrolyzing the silicone resin of the film.

Abstract: A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a hydrosilylation-curable silicone composition comprising a silicone resin and a photoactivated hydrosilylation catalyst; and exposing the impregnated fiber reinforcement to radiation having a wavelength of from 150 to 800 nm at a dosage sufficient to cure the silicone resin; wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 ?m; and a reinforced silicone resin film prepared according to the method.

Abstract: Coated substrates containing at least one barrier layer comprising hydrogenated silicon oxycarbide having a density of at least 1.6 g/cm3 and at least one barrier layer selected from aluminum, aluminum oxide, aluminum nitride, aluminum oxynitride, titanium, titanium oxide, titanium nitride, and titanium oxynitride.

Abstract: A method of preparing a planar optical waveguide assembly, comprising the steps of: (i) applying a silicone composition to a surface of a substrate to form a silicone film; (ii) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (iii) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (iv) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23° C. for light having a wavelength of 589 nm; wherein the substrate has a refractive index less than the refractive index of the silicone core. A planar optical waveguide assembly prepared according to the method of the invention.

Abstract: A method of preparing a planar optical waveguide assembly, comprising the steps of (i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23° C. for light having a wavelength of 589 nm; wherein the lower clad layer has a refractive index less than the refractive index of the silicone core.

Abstract: An organopolysiloxane copolymer, comprising (i) R1SiO3/2 units, (ii) random R22SiO2/2 units, and (iii) linear (R32SiO)n units, wherein R1 is independently hydrocarbyl or halogen-substituted hydrocarbyl, R2 and R3 are independently R1 or H, n has an average value of from 5 to 500, the mole ratio of R1SiO3/2 units to R22SiO2/2 units is from 1 to 30, and the mole ratio of R1SiO3/2 units and R22SiO2/2 units combined to (R32SiO)n units is from 3 to 600 when the copolymer contains aliphatic unsaturation or from 1 to 600 when the copolymer is free of aliphatic unsaturation; and a method of preparing the organopolysiloxane copolymer.

Abstract: This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and a miscible reactive diluent selected from specified organic vinyl ether compounds, epoxy functional compounds, or compounds having the formula R8Xb, wherein R8 is a non-silicon containing organic group, X is an organic group containing at-least one acrylate functional group, and b has a value of 1-3. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.

Abstract: This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and a miscible reactive diluent selected from specified organic vinyl ether compounds or compounds having the formula R8Xb, wherein R8 is a non-silicon containing organic group, X is an organic group containing at-least one acrylate functional group, and b has a value of 1-3. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.

Abstract: A semiconductor device having a semiconductor chip; a semiconductor chip attachment element facing the semiconductor chip, at least one interconnect on the surface of the semiconductor chip attachment element; and at least one member consisting of a metal or metal alloy that electrically connects the semiconductor chip with the interconnects; wherein the semiconductor chip is bonded to the semiconductor chip attachment element by an adhesive and at least a portion of at least one member that electrically connects the semiconductor chip with at least one interconnect is sealed or imbedded with a sealant/filling agent, and the complex modulus of at least one of the adhesive and the sealant/filling agent is not greater than 1×108 Pa at −65° C. and a shear frequency of 10 Hz.

Abstract: A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.

Abstract: A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials.

Abstract: An aqueous coating agent for forming lubricating films comprising a hydrophilic resin; a solid lubricating agent comprising MoS2 and at least one antimony sulfide selected from the group consisting of Sb2S3 and Sb2S5, where a weight ratio of MoS2 to antimony sulfides is from 1;0.05 to 1:12; and water and wherein the weight ratio of the solid lubricating agent to the hydrophilic resin is from 0.7:1 to 3:1.

Abstract: A silicone composition for preparing a silicone adhesive, the composition prepared by mixing (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule; (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R2nSiX4−n wherein each R2 is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is —OR2 or —OCH2CH2OR2; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii); (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound hav

Abstract: A paste dispensing container comprising a cylindrical container having positioned therein a piston slidable along the walls of the container, a first end closed with a cap to seal paste within the container, a connecting portion at a second end of the container for connection with a pressurized fluid supply, and a leakage preventing cover having an air orifice covering the second end of the container. The paste dispensing container can be vacuum packaged in a gas-impermeable film for shipping and storage to prevent exposure of the paste contained therein to air.

Abstract: A silicone composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, (C) an effective amount of a titanium or zirconium compound having at least one aliphatic carbon-carbon multiple bond, and (D) a catalytic amount of a hydrosilylation catalyst; and a cured silicone product formed from the composition.

Abstract: An elastomer delustering method comprising impregnating the surface of an elastomer with an organic compound having air-oxidizable curable unsaturated groups.

Abstract: A silicone resin composition, comprising (A) 100 parts by weight of an organopolysiloxane resin containing an average of greater than two alkenyl groups per molecule and having less than 1.5 mole % percent of silicon-bonded hydroxy groups, (B) an organohydrogensilane in an amount sufficient to cure the composition, (C) an effective amount of an inorganic filler; and (D) a catalytic amount of a hydrosilylation catalyst. The present invention is further directed to a cured silicone product comprising a reaction product of the above-described composition. A cured silicone product comprising a reaction product of the silicone resin composition and a multi-part silicone composition comprising components (A) through (D) in two or more parts, provided components (A), (B), and (D) are not present in the same part.

Abstract: A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer. A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a mixture of a hot melt adhesive and a spacer, wherein the adhesive is selected from a silicone-modified epoxy resin adhesive, a silicone adhesive, and a silicone-modified polyimide adhesive, and the spacer has the form of particles.

Abstract: A silicone composition prepared by mixing (A) 100 parts by weight of an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, (C) 0.5 to 50 parts by weight of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group and at least one aliphatic carbon-carbon multiple bond per molecule, (D) 1 to 10 parts by weight of a titanium chelate, and (E) a catalytic amount of a hydrosilylation catalyst; and a cured product formed from the composition.