Abstract: A thermally conductive silicone rubber composition comprised of (A) 100 parts by weight of an organopolysiloxane that contains at least two silicon-bonded alkenyl groups per molecule, (B) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms molecule, (C) 0.1 to 10 parts by weight of organosiloxane that contains at least one silicon-bonded alkoxy group per silicon-bonded hydroxyl per molecule, (D) 300 to 1200 parts by weight of fine alumina powder comprised of (i) 5 to 95 wt % of spherical or nonspherical fine powder of an average particle diameter of up to 10 .mu.m and of (ii) 95 to 5 wt % of spherical or nonspherical fine alumina powder of an average particle diameter of 10 to 50 .mu.m, and (E) a catalytic quantity a hydrosilylation reaction catalyst.

Abstract: Polyorganosiloxane gels are prepared using compositions curable by a platinum catalyzed hydrosilation reaction that are characterized by the presence of a non-functional silicone fluid. The gel may contain additional components and may also be formulated into a multi-part system.

Abstract: A silicone gel composition comprising: (A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a viscosity of 0.01 to 100 Pa.s at 25.degree. C.; (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.001 to 10 Pa.s at 25.degree. C. in an amount sufficient to provide from 0.2 to 5 moles of silicon-bonded hydrogen atoms per one mole of alkenyl groups in component (A); (C) 0.01 to 15 parts by weight of a silica powder having a specific surface area of at least 50 m.sup.2 /g; (D) 0.0001 to 1.0 part by weight of a diamine compound represented by the following general formula: R.sup.1.sub.2 N--R.sup.2 --NR.sup.1.sub.2 wherein each R.sup.1 is independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.

Abstract: The present invention provides a silicone gel composition for use in sealing and filling of electrical and electronic parts, which are characterized by the fact that when said composition is cured, said composition forms a silicone gel in which the loss elastic modulus at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and in which the complex elastic modulus is 1.0.times.10.sup.5 Pa or less, and a silicone gel which is characterized by the fact that in a silicone gel which seals or fills electrical or electronic parts, the loss elastic modulus of this silicone gel at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and the complex elastic modulus is 1.0.times.10.sup.5 Pa or less.

Abstract: A composition comprising (A) at least one mercapto-functional organosilicon compound having an average of a least two mercapto groups per molecule and (B) a cure initiator. The mercapto-functional organosilicon compound may include mercapto-functional organosilanes, mercapto-functional organosiloxanes, and mercapto-functional copolymers. The compositions of the present invention polymerize or cure to form compositions comprising reaction products of components (A) and (B). The cure initiator is a metal salt that produces a uniform cure throughout the composition, regardless of the amount of oxygen present. The cured products range in properties from soft gels to though elastomers to hard resins and are useful as molded articles, electrical encapsulants, and sealants.

Abstract: A method for fabricating a semiconductor device, comprising the steps of coating the surface of a semiconductor element with a curable silicone composition comprising a curable silicone polymer and a filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95, wherein the filler is selected from the group consisting of powders of organic resins, hollow forms of organic resin powders, hollow inorganic powders, intrinsically electrically conductive fillers, and fillers having a surface that is electrically conductive; allowing sufficient time to elapse for the filler in the part of the curable silicone composition adjoining the element to migrate into the part of the curable silicone composition remote from the element; and curing the curable silicone composition.

Abstract: Foamable organosiloxane compositions which yield, upon cure, silicone foams having low density and decreased friability, comprising a siloxane base polymer having an average of at least two hydroxyl groups per molecule, a silicon-containing crosslinker for the siloxane base polymer, wherein the crosslinker contains at least two --SiH groups per molecule; a platinum group catalyst; a silicone resin copolymer; and optionally, a blowing agent; and silicone foams prepared therefrom. A method of weather-stripping a door or window using a silicone foam so prepared.

Abstract: A silicone die attach adhesive comprising a silicone composition that cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysiloxane and silicon-bonded hydrogen-functional organopolysiloxane.Also, a fabrication method characterized bymounting a semiconductor chip on a substrate or in a package with the aforesaid silicone die attach adhesive sandwiched between the semiconductor chip and substrate or package,then inducing the free radical reaction of the acrylic functional groups by exposing the die attach adhesive to high-energy radiation, and thereaftercuring the die attach adhesive by the hydrosilylation reaction.A semiconductor device characterized in that it has been fabricated by the above-described method.

Abstract: A silicone composition curable to a silicone bonding agent that is suitable for use in manufacturing an optical memory element comprises:(A) 100 parts by weight of an organopolysiloxane having an average of at least two silicon-bonded alkoxy groups per molecule and an average of at least two silicon-bonded alkenyl groups per molecule, wherein the alkoxy groups and the alkenyl groups are in the same molecule;(B) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, wherein the molar ratio of silicon-bonded hydrogen atoms in component (B) to silicon-bonded alkenyl groups in component (A) is from 0.3:1 to 20:1;(C) 0.01 to 20 parts by weight of a metal condensation reaction catalyst wherein the metal of said metal condensation reaction catalyst is selected from the group consisting of titanium, zirconium and aluminum; and(D) a catalytic amount of a hydrosilylation reaction catalyst. The composition is cured by an addition reaction and a condensation reaction.

Abstract: A vacuum dispensable silicone composition comprising (A) a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organopolysiloxane resin consisting essentially of (a) R.sup.3.sub.2 (CH.sub.2 .dbd.CH)SiO.sub.1/2 siloxane units, (b) R.sup.3.sub.3 SiO.sub.1/2 siloxane units, and (c) SiO.sub.4/2 siloxane units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, the mole ratio of the combination of (a) and (b) units to (c) units is from 0.6 to 1.

Abstract: An electrical part containing an electrical element, a cured silicone resin which has been treated with ultraviolet light, a cured sealing resin which has been integrally bonded to the UV treated silicone resin. The cured silicone resin is prepared from an addition reaction curable silicone composition which is a mixture or reaction mixture of (a) an organosiloxane which has silanol groups and (b) an alkoxysilane which has epoxy groups, and/or (c) an organosiloxane which can be expressed by the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwherein R.sup.1 is an epoxy group containing monovalent organic group R.sup.2 is monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group with 1 to 4 carbon atoms, a, b and d are>0 and c is.gtoreq.0.

Abstract: A silatrane derivative having the formula: ##STR1## wherein each R.sup.1 is independently a hydrogen atom or an alkyl group; each R.sup.2 is independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkenyloxyalkyl group having the general formula:--R.sup.4 --O--R.sup.5wherein R.sup.4 is an alkylene group and R.sup.5 is an alkenyl group, with the proviso that at least one R.sup.2 is an alkenyloxyalkyl group; and each R.sup.3 is independently selected from the group consisting of a monovalent hydrocarbon group, a C.sub.1 to C.sub.10 alkoxy group, a glycidoxyalkyl group, an oxiranylalkyl group, an acyloxyalkyl group, a haloalkyl group, and an aminoalkyl group.

Abstract: A composite molding comprising a silicone gel molding and a peelable film which does not suffer from the problems of adhesion of dirt and dust, adhesion of moldings to each other or deformation of moldings, and which has improved handling characteristics. The invention also covers a method for manufacturing such a composite molding.

Abstract: Compounds containing a tetradecachlorocyclohexasilane dianion are prepared by contacting trichlorosilane with a reagent composition comprising a tertiary polyamine. The compound ?pedeta.SiH.sub.2 Cl.sup.+1 !.sub.2 ?Si.sub.6 Cl.sub.14.sup.-2 ! wherein pedeta is N,N,N',N",N"-pentaethyldiethylenetriamine is prepared by contacting trichlorosilane with pedeta. The compound ?Ph.sub.4 P.sup.+1 !.sub.2 ?Si.sub.6 Cl.sub.14.sup.-2 ! is prepared by contacting trichlorosilane with a mixture of N,N,N',N'-tetraethylethylenediamine and triphenylphosphonium chloride. The tetradecachlorocyclohexasilane dianion can be chemically reduced to cyclohexasilane, a compound useful in the deposition of amorphous silicon films. The tetradecachlorcyclohexasilane dianion can also be contacted with a Grignard reagent to form a dodecaorganocyclohexasilane.

Abstract: A silatrane derivative having the formula: ##STR1## wherein each R.sup.1 is independently a hydrogen atom or an alkyl group; each R.sup.2 is independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxysilyl-containing organic group having the general formula:--R.sup.4 --Si(OR.sup.5).sub.x R.sup.6.sub.(3-x)wherein R.sup.4 is a divalent organic group, R.sup.5 is a C.sub.1 to C.sub.10 alkyl group, R.sup.6 is a monovalent hydrocarbon group, and x is 1, 2, or 3, with the proviso that at least one R.sup.2 is the alkoxysilyl-containing organic group; and each R.sup.3 is independently selected from the group consisting of a monovalent hydrocarbon group, a C.sub.1 to C.sub.10 alkoxy group, a glycidoxyalkyl group, an oxiranylalkyl group, an acyloxyalkyl group, a haloalkyl group, and an aminoalkyl group.

Abstract: A release agent comprising a mixture of (A) a dimethylpolysiloxane and (B) an organopolysiloxane with phenolic hydroxyl groups, said mixture having an average phenol equivalent within the range of 10,000 to 5,000,000 and a dimethylsiloxane oligomer with less than 20 silicon atoms in an amount of less than 5,000 ppm, said agent having a viscosity within the range of 5.times.10.sup.-5 to 1.times.10.sup.-1 m.sup.2 /s at 25.degree. C. The release agent of the present invention possesses excellent heat-resistant and release properties, and suppresses formation of formaldehyde under the effect of thermal decomposition.

Abstract: A heat resistant grease composition containing a fluorosilicone base oil, a fluororesin thickener and an additive, that has a reduced gelling, reduced base oil evaporation, and stable heat resistance.

Abstract: A curable epoxy resin composition comprising (A) a curable epoxy resin and (B) an organopolysiloxane prepared by equilibrium polymerization and having the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.din which R.sup.1 is an epoxy-functional monovalent organic group, R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group having no more than 4 carbon atoms, a>0, b>0, d>0 and c.gtoreq.0.

Abstract: A curable composition which contains an alkenyl group containing polyorganosiloxane, an organosilicon compound having two silicon-bonded hydrogen atoms, a hydrosilylation reaction catalyst, and a glass frit, which is suitable, upon cure, for use as a firewall sealant.

Abstract: A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group-containing organopolysiloxane such that when the composition is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the composition, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.