Abstract: The present invention provides a method and apparatus for testing semiconductor wafers that is simple and allows testing prior to dicing so that the need to temporarily package individual dies for testing is eliminated. As a result, the number of manufacturing steps is reduced, thus increasing first pass yields. In addition, manufacturing time is decreased, thereby improving cycle times and avoiding additional costs. After testing, the wafer is diced into the individual circuits, eliminating the need for additional packaging. One form of the present invention provides an interposer substrate made of a ceramic material that has an upper and a lower surface. There are one or more first electrical contacts on the lower surface and one or more second electrical contacts on the upper surface. There are also one or more electrical pathways that connect the first and second electrical contacts.

Abstract: A communication tool (100) for communicating hydraulic fluid through a tubing retrievable safety valve (50) is disclosed. The tool (100) has a first section (102) and a second section (132) that are initially coupled together. A set of axial locating keys (112) is operably attached to the first section (102) and is engagably positionable within a profile (62). A radial cutting device (148) is radially extendable through a window (152) of the second section (132). A circumferential locating key (140) is operably attached to the second section (132) and is engagably positionable within a pocket (66) of the safety valve (50) when the first and second sections (102, 132) are decoupled, thereby circumferentially aligning the radial cutting device (148) with the non annular hydraulic chamber (60).

Abstract: A system and method for packaging shaped charges (12) for transportation is disclosed. Each shaped charge (12) includes a housing (14) and a liner (16) having a high explosive disposed therebetween. A jet spoiler (20) is positioned proximate the liner (16) of each of the shaped charges (12) to prevent the formation of a jet in the event of an inadvertent initiation of a shaped charge (12). The shaped charges (12) are then oriented in first and second layers such that the jet spoilers (20) positioned proximate the liners (16) of the shaped charges (12) in the first and second layers oppose one another. A shielding panel (22) is disposed between the shaped charges (12) of the first and second layers. The shaped charges (12) including the jet spoilers (20) and the shielding panel (22) are placed within an expandable bag (32) which is in turn enclosed within a transportation container (34).

Abstract: An apparatus (38) and method for sequentially packing an interval of a wellbore (32) is disclosed. The apparatus (38) comprises a cross-over assembly (40) having first and second exit ports (58, 62). The cross-over assembly (40) has a fracturing configuration wherein the first exit port (58) is open and the second exit port (62) is closed and a gravel packing configuration wherein the first exit port (58) is closed and the second exit port (62) is open. The apparatus (38) also includes a gravel packing assembly (42) that has an inlet that receives the gravel packing slurry from the second exit port (62) and a plurality of outlets (72) that allow for the delivery the gravel slurry to a plurality of locations along the length of a sand control screen (52).

Abstract: An apparatus (38) and method for progressively gravel packing an interval of a wellbore (32) is disclosed. The apparatus (38) comprises a sand control screen (52) that is positioned within the wellbore (32) and a tubular member (42) that is disposed within the wellbore (32) forming a first annulus (56) with the sand control screen (52) and a second annulus (58) with the wellbore (32). The tubular member (42) initially prevents fluid communication between the first annulus (56) and the second annulus (58). Once the gravel packing operation begins, however, the tubular member (42) selectively allows fluid communication from the first annulus (56) to the second annulus (58) by progressively establishing fluid communication between the first annulus (56) and the second annulus (58) from a first end of the interval (48) to a second end of the interval (48).

Abstract: A screen assembly (60) comprises a base pipe (62) having perforated and nonperforated sections (66, 68), ribs (70) circumferentially spaced therearound and a filter medium (84) positioned around the ribs (70) having voids (92, 94) therethrough. The screen assembly (60) includes a slurry passageway (98) defined by the nonperforated section (68) of the base pipe (62), two of the ribs (70) and the portion (100) of the filter medium (84) that is circumferentially aligned with the nonperforated section (68). This portion (100) of the filter medium (84) has a filler material (96) disposed within the voids (92, 94) to create a fluid tight seal for a fluid slurry. The fluid slurry is discharged from the screen assembly (60) to a plurality of levels of the interval through exit ports (106) in a plurality of manifolds (102) when the screen assembly (60) is in an operable position.

Abstract: An apparatus and method for gravel packing an interval of a wellbore is disclosed. The apparatus comprises an outer tubular (110) forming a first annulus with the wellbore and an inner tubular (114) disposed within the outer tubular (110) forming a second annulus therebetween. The second annulus includes an axially extending slurry passageway (194) and an axially extending production pathway (190). The portion of the outer tubular (110) adjacent the slurry passageway (194) has an outlet (128). The portion of both the outer and inner tubulars (110, 114) adjacent the production pathway (190) has a plurality of openings (122, 146). The slurry passageway (194) is in fluid isolation from the production pathway (190) such that when a fluid slurry containing gravel is injected through the slurry passageway (194), the fluid slurry exits through the outlet (128) leaving gravel in the first annulus, thereby gravel packing the interval.

Abstract: A lift fluid driven downhole electrical generator and method for generating and controlling the electrical output from the electrical generator is disclosed. The electrical generator comprises a housing having a lift fluid port in a sidewall portion thereof for allowing the flow of lift fluids therethrough. A rotor is rotatably disposed within the housing. The rotor converts lift fluid pressure to rotary motion when the lift fluid travels through the lift fluid port and impinges the rotor. The electrical generator also includes an electromagnetic assembly having a first portion that is rotatable with the rotor and a second portion that is stationary with the housing. The electromagnetic assembly converts the rotary motion to electricity as the first portion of an electromagnetic assembly rotates relative to the second portion of the electromagnetic assembly.

Abstract: A matched set of integrated circuit chips (74, 78) and a method for assembling such integrated circuit chips (74, 78) into a matched set are disclosed. A first semiconductor wafer (62) having a plurality of integrated circuit chips (74) of a first type and a second semiconductor wafer (64) having a plurality of integrated circuit chips (78) of a second type are electrically and mechanically coupled to an interposer (52) to form a wafer-interposer assembly (50). The integrated circuit chips (74, 78) of the first and second wafers (62, 64) are then tested together. The wafer-interposer assembly (52) is then diced into a plurality of chip assemblies having chips (74) of the first type and a plurality of chip assemblies having chips (78) of the second type. Based upon the testing, at least one of the chip assemblies having chips (74) of the first type and at least one of the chip assemblies having chips (78) of the second type are selected for inclusion in the matched set.

Abstract: The present invention provides a wafer interposer for electrical testing and assembly into a conventional package. The present invention provides an interposer comprising a support having an upper and a lower surface. One or more solder bumps are on the lower surface. One or more first electrical terminals are on the upper surface, substantially corresponding to the position of the solder bumps, and forming a pattern. One or more first electrical pathways pass through the surface of the support and connect the solder bumps to the first electrical terminals. One or more second electrical terminals are on the upper surface of the support. The second electrical terminals are larger in size and pitch than the first electrical terminals, and they are located within the pattern formed by the first electrical terminals. One or more second electrical pathways connect the first electrical pathways to the second electrical pathway.

Abstract: A communication tool (100) for communicating hydraulic fluid through a tubing retrievable safety valve (50) is disclosed. The tool (100) has a first section (102) and a second section (132) that are initially coupled together. A set of axial locating keys (112) is operably attached to the first section (102) and is engagably positionable within a profile (62). A radial cutting device (148) is radially extendable through a window (152) of the second section (132). A circumferential locating key (140) is operably attached to the second section (132) and is engagably positionable within a pocket (66) of the safety valve (50) when the first and second sections (102, 132) are decoupled, thereby circumferentially aligning the radial cutting device (148) with the non annular hydraulic chamber (60).

Abstract: The present invention provides a method, apparatus and system for building a wafer-interposer assembly. The method includes the steps of forming a redistribution layer (RDL) pad on a semiconductor wafer. The semiconductor wafer has a semiconductor die and the RDL pad has an electrical connection to the semiconductor die. A layer of epoxy is placed on the semiconductor wafer and on the RDL pad. The epoxy is then leveled generally parallel to the surface of the semiconductor wafer and removed from a portion of the RDL pad. An interposer pad is formed on the RDL pad where the epoxy was removed.

Abstract: An apparatus (60) and method for gravel packing an interval of a wellbore is disclosed. The apparatus (60) comprises a sand control screen (78) positioned within the wellbore and a tubular member (62) disposed within the wellbore forming a first annulus with the sand control screen (78) and a second annulus with the wellbore. The tubular member (62) has an axially extending production section (64) with a plurality of openings (66) and an axially extending nonproduction section (68) with a plurality of outlets (70). A channel (72) is disposed within the first annulus such that the channel (72) is substantially circumferentially aligned with the nonproduction section (68) of the tubular member (62) forming a slurry passageway (74) therewith.

Abstract: An apparatus (60) and method for gravel packing an interval of a wellbore is disclosed. The apparatus (60) comprises a sand control screen (78) that is positioned within the wellbore and a tube and manifold system (62) positioned between the sand control screen (78) and the wellbore. The tube and manifold system (62) delivers a fluid slurry to a plurality of levels within the interval when the apparatus (60) is in an operable position. The tubes (64, 70, 76) of the tube and manifold system (62) have first and second ends which are open such that the fluid slurry may enter one end, travel through the entire length of the tube (64, 70, 76) and exit the other end. The manifolds (66, 72) of the tube and manifold system (62) each have at least one exit port (68, 74) for the discharge of the fluid slurry from the tube and manifold system (62).

Abstract: A shaped charge perforating apparatus (50) for perforating a subterranean well is disclosed. The shaped charge perforating apparatus (50) comprises a support member (62) having a plurality of shaped charge mounting locations each having shaped charge (56) positioned therein. Each of the shaped charges (56) has an initiation end and a discharge end. The initiation end of each shaped charge (56) is coupled to a detonator cord (70) The shaped charges (56) are enclosed in a carrier (52) having a plurality of recesses (54) spaced on an exterior surface thereof and having contoured bottom surfaces (80). Each of the recesses (54) is longitudinally and radially aligned with the discharge end of one of the shaped charges (56).

Abstract: A chip assembly (162) with integrated power distribution between an integrated circuit chip (164) and a section of wafer interposer (166) is disclosed. The wafer interposer section (166) has first (80, 82) and second (86, 88) sets of contact pads that are electrically and mechanically coupled to first and second sets of contact pads of the integrated circuit chip (164). The wafer interposer section (166) has first (32) and second (36) supply voltage terminals that are respectively coupled to the first (80, 82) and second (86, 88) sets of contact pads of the wafer interposer section (166) that provide first and second supply voltages to the first and second sets of contact pads of the integrated circuit chip (164), thereby integrating power distribution between the integrated circuit chip (164) and the wafer interposer section (166).

Abstract: A matched set of integrated circuit chips (74, 78) and a method for assembling such integrated circuit chips (74, 78) into a matched set are disclosed. A first semiconductor wafer (62) having a plurality of integrated circuit chips (74) of a first type and a second semiconductor wafer (64) having a plurality of integrated circuit chips (78) of a second type are electrically and mechanically coupled to a pair of interposers (52, 53) to form a pair of wafer-interposer assemblies (50, 51). The integrated circuit chips (74, 78) of the first and second wafers (62, 64) are then tested together. The wafer-interposer assemblies (52, 53) are then diced into a plurality of chip assemblies having chips (74) of the first type and a plurality of chip assemblies having chips (78) of the second type. Based upon the testing, at least one of the chip assemblies having chips (74) of the first type and at least one of the chip assemblies having chips (78) of the second type are selected for inclusion in the matched set.

Abstract: An apparatus (10) and method for selectively monitoring radar signals impinging on a vehicle is disclosed. The apparatus (10) comprises a speed determination circuit (20) that determines vehicle speed and provides a speed signal representative thereof to a comparator (22) that compares the speed signal to a preselected speed and provides an on signal when the vehicle speed exceeds the preselected speed and an off signal when the vehicle speed is at or below the preselected speed. When the comparator (22) provides the on signal, a radar detecting circuit (14) is powered to detect incoming radar signals and provide a radar detected signal to an alarm (18) that provides an alert in response to the radar detected signal. When the comparator (22) provides the off signal, the radar detecting circuit (14) is not powered and does not detect incoming radar signals.

Abstract: A system and method for packaging shaped charges (12) for transportation is disclosed. Each shaped charge (12) includes a housing (14) and a liner (16) having a high explosive disposed therebetween. A jet spoiler (20) is positioned proximate the liner (16) of each of the shaped charges (12) to prevent the formation of a jet in the event of an inadvertent initiation of a shaped charge (12). The shaped charges (12) are then oriented in first and second layers such that the jet spoilers (20) positioned proximate the liners (16) of the shaped charges (12) in the first and second layers oppose one another. A shielding panel (22) is disposed between the shaped charges (12) of the first and second layers. The shaped charges (12) including the jet spoilers (20) and the shielding panel (22) are placed within an expandable bag (32) which is in turn enclosed within a transportation container (34).