Abstract: A semiconductor test system that includes a tester, a material handling unit and a manipulator that positions the tester relative to the material handling unit. The manipulator is in the form of a cart that can be wheeled to the material handling unit. The cart is attached to the mateiral handling unit to provide course positioning of the tester relative to the handling unit. Major motion of the test head is constrained to an axis perpendicular to the mating interface of the material handling unit. However, compliant motion, with up to six degrees of freedom, is possible in a complaint zone near the handler. In this way, alignment units on the tester and material handling unit can accurately control the final positioning of the tester relative to the material handling unit.

Abstract: A system for depositing materials on a surface of a wafer or removing materials from the surface of a wafer includes an electrode, a shaping plate, a liquid solution contained between the electrode and the wafer surface, and electrical contact members contacting selected locations on the wafer surface. The shaping plate is supported between the electrode and the wafer surface such that an upper surface of the shaping plate faces the wafer surface. The shaping plate can have a plurality of channels where each puts the wafer surface in a fluid communication with the electrode. The electrical contact members contact the selected locations on the wafer surface through a recessed edge of the shaping plate such that when the wafer is rotated, the selected contact locations move over the shaping plate and are plated under an applied potential. Advantages of the invention include substantially full surface treatment of the wafer.

Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Abstract: The present invention relates to methods for repairing defects on a semiconductor substrate. This is accomplished by selectively depositing the conductive material in defective portions in the cavities while removing residual portions from the field regions of the substrate. Another method according to the present invention includes forming a uniform conductive material overburden on a top surface of the substrate. The present invention also discloses a method for depositing a second conductive material on the first conductive material of the substrate.

Abstract: The present invention provides apparatus and methods for detecting removal of a material in a chemical mechanical polishing process that uses a solution and operates upon a top layer made of a material that is disposed over another layer on a multi-layer workpiece. When the top layer from the workpiece is removed using chemical mechanical polishing with the solution, a flow of used solution results, with the flow of used solution containing therein the material removed from the top layer. While removing the top layer, a beam of light is transmitted on the flow of used solution to obtain an output beam of light that is altered due to absorption by the material, and a change in a characteristic of the output beam of light from the beam of light indicative of a change in an amount of the material within the flow of used solution is detected.

Abstract: An electrical connector for transferring a plurality of differential signals between electrical components. The connector is made of modules that have a plurality of pairs of signal conductors with a first signal path and a second signal path. Each signal path has a pair of contact portions, and an interim section extending between the contact portions. For each pair of signal conductors, a first distance between the interim sections is less than a second distance between the pair of signal conductors and any other pair of signal conductors of the plurality. Embodiments are shown that increase routability.

Abstract: An electro-optical connector is described that provides a separable electrical interface for connecting to a circuit board. The optical connection between the fiber and the connector are semi-permanent. Also described is an electro-optical system that transfers signals between two circuit board over an optical fiber where the separable interface within the system is electrical rather than optical. Further described is a fixture with pivoting actuation and retraction for connecting a z-axis pressure mount connector to a circuit board.

Abstract: An automatic test system for microwave components. The test system includes internally switchable calibration references. As part of a calibration routine, incident power from a source is measured. During the measurement, calibration references are switched to change the amount of power reflected back to the source. Changes in the incident power are measured continuously while this change occurs. The resulting measurements allow the source match term to be determined. Correction is made to the source amplitude to adjust for the source match.

Abstract: A system for inspecting potentially warped printed circuit board assemblies is disclosed. The system includes an inspection head with an axial, centrally located camera, and a laser disposed at an angle off the central axis. The central camera and the angled laser can be used during an initial scan of a printed circuit board assembly to measure and compensate for warp in the assembly, thereby making a subsequent inspection of the assembly more accurate.

Abstract: An apparatus and method for inspecting a printed circuit board, whereby a list of windows encompassing respective regions of the printed circuit board are generated. The windows are then scanned, and data representing the respective regions is captured and stored. The captured data includes data relating to a plurality of pixels for each window. Next, data relating to a plurality of adjacent pixels is retrieved, and values of the adjacent pixels are summed. Finally, either the data relating to the plurality of adjacent pixels or the sum of adjacent pixel values is selected for use in subsequent processing. The apparatus and method is especially useful for determining an average brightness level for each window.

Abstract: A tooling pin assembly used with a receiver in a printed circuit board tester is disclosed. The tooling pin assembly includes a locating pin with a core threaded to receive a screw, and a bushing for supporting and guiding the locating pin relative to the receiver. When the screw is rotated in one direction, the locating pin moves out of the bushing and passes through a hole in the receiver for engaging a test fixture. When the screw is rotated in the opposite direction, the locating pin retracts into the bushing until it is below the plane of the receiver. The ability to extend and retract the locating pin is especially useful when the tooling pin assembly is used with a receiver designed to hold test fixtures of various sizes.

Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.

Abstract: A probe interface device is disclosed that includes a plurality of coaxial contact probe assemblies disposed in an insulative base. Each coaxial contact probe assembly includes a solid tubular shield with a coaxial signal contact probe, which is isolated from the shield by an insulative retainer; and, a solid tubular reference with another coaxial contact probe. The shield and the reference are soldered together at their respective ends. Further, the insulative base includes an upper retainer and a lower retainer attached to a hollow frame. The upper and lower retainers are provided with the same number of holes for engaging a plurality of coaxial contact probe assemblies. The probe interface device can be used for testing mixed-signal devices and is easy to manufacture.