Abstract: The invention is a semiconductor laser including a grating which is formed by regions of high impurity concentration surrounded by material having a lesser impurity concentration. The use of variations in doping concentration rather than different materials to provide reflection in the grating should simplify device fabrication.

Abstract: The invention is a photodetector device and a lightguide circuit incorporating the device. The photodetector device includes a semiconductor region for absorbing light which is incident on an edge surface of the device. The region above the absorbing region is narrow at the edge and fans out in the direction of light propagation in the device.

Abstract: The invention is a laser assembly with reduced distortion ripple. The assembly includes a spherical lens for collimating light emitted from the laser. The lens is made of a material which attenuates scattered light which is the source of ripple without appreciably affecting the main beam.

Abstract: Disclosed is a method for fabricating devices so that several devices at a time can be tested and sorted. The devices are placed in a carrier so that each device occupies a discrete position. The carrier includes an identification marker, and each device is identified by its position in the carrier. The carrier is sent to multiple assembly and/or testing stations, and data for each device is collected and stored in a central data base according to its position in the carrier. Each device may then be sorted according to the collected data and its position in the carrier.

Abstract: The invention is a method of fabricating a device which includes the step of etching a layer of tantalum oxide or niobium oxide. A material comprising chlorine and a material comprising oxygen are applied to the layer and energy is added to the layer in the form of heat or ion bombardment.

Abstract: The invention is a transceiver package with reduced overall width and optical pitch. Separate circuit boards are provided for the laser with its associated circuitry and the photodetector with its associated circuitry. The boards are mounted to the sidewalls of the package housing so that they are essentially perpendicular to the base of the package and to the major surface of the mother board.

Abstract: The invention disclosed is a method and apparatus for cleaving semiconductor material without physical contact. Tick marks are formed in a major surface of the material where cleaving is desired. A fulcrum member is moved with respect to the material until a tick mark is in alignment with the fulcrum member. A gas jet, also aligned with the fulcrum member, is applied to the surface of the material to form the cleave.

Abstract: A power supply module package suitable for both high packaged power density and cost effective manufacture. In an exemplary embodiment, the power supply module includes: (1) at least one printed circuit board containing conductors for interconnecting components of the power supply, (2) a thermally conductive baseplate or case operable for transferring heat generated inside the module to the outside environment, wherein the external package dimensions are of a sufficiently small size to allow the user the greatest flexibility in the design of the overall circuit assembly, (3) at least one power magnetic device operable for providing electrical isolation between the input and the output of the power module, and (4) a set of electrical leads to facilitate communication and power flow between the module and circuitry being powered.

Abstract: The invention disclosed is a circuit for regulating optical power levels. Electrooptic attenuators are used to control optical output intensity by means of feedback loops from the outputs of the attenuators to the electrodes of the attenuators which determine the amount of light going to the outputs. The attenuators may be used in combination with an optical switch array in a wavelength division multiplexing system.

Abstract: The invention is an assembly and method for bonding an optical component to a base member. The component is mounted to a block which includes a centerline extending between two opposing surfaces. A pair of stop members are included on the surface of the base member, and these members serve to pin the centerline during heating and cooling of the assembly so that the position of the component is controlled.

Abstract: The invention is a circuit which permits spare circuit packs to replace operational circuit packs while keeping peripheral circuitry apprised of the status of the packs. The circuit receives signals from a first conductor and returns the signals to the conductor so that a spare circuit pack can be removed without affecting the signals to the peripheral circuits. The circuit also detects the signals on a second conductor and applies the same signals when a circuit pack including the circuit is reconnected. The circuit also includes elements which prevent loading down the conductors while power from the circuit is cut off or during power up.

Abstract: The invention is a laser with improved turn-on time for digital applications. The low bias capacitance effect of the laser is reduced by use of a buffer region formed between the substrate and the active region, the buffer region having a lower dopant concentration than the substrate.

Abstract: The invention is a circuit for monitoring the wavelength of a laser device such as a semiconductor laser. A piezoelectric resonator is positioned in the path of the light beam so as to form a Fabry-Perot cavity. The changes in the reflectivity of the cavity are detected as the resonator is driven by an oscillator circuit, and an error signal is produced in response thereto when the wavelength of the laser device strays from a desired value.

Abstract: Proposed is a technique for determining the suitability of use of a material for an electroless plating operation. A solution including the material is subject to an anodic linear sweep voltammetric measurement. The resulting anodic peak is compared with that of a control solution in order to evaluate the potential of the material for poisoning a factory plating bath.

Abstract: Disclosed is a method of fabricating electronic components on a semiconductor substrate by etching features in the substrate through a mask including apertures which are separated by a prescribed spacing. Etching is continued until the etched features merge into a single channel. This technique can be used to form channels having nonuniform shapes, or could be used to monitor the end point of an etching operation.

Abstract: The invention is a method for handling material which may be in the form of semiconductor wafers, bars, and/or chips. The material is mounted to a flexible film which is heated so as to result in an adhesion strength sufficient to hold the material in place, but low enough so that the material can be removed easily when desired.

Abstract: The invention is an optical amplifier which maintains the polarization of the signals being amplified. A polarization independent, polarization maintaining optical isolator is coupled to polarization maintaining optical fibers so that signals having polarization components in more than one direction can propagate therethrough.

Abstract: Disclosed is an optical and/or microelectronics hermetic package which includes a member for absorbing hydrogen from the internal package ambient. The member includes a first layer which forms a hydride and, formed thereover, a second layer which forms solvated hydrogen upon exposure to molecular hydrogen in the package. The second layer acts as a one way valve for transporting hydrogen to the first layer which locks up the hydrogen.

Abstract: A bidirectional optoelectronic transceiver assembly comprises a pair of interconnectable modules. One module houses a laser diode and a lens; the other a photodiode, a beam splitter and a fiber pigtail.