Abstract: A microprocessor comprising a bus state controller and for use in a personal computer or the like. The bus state controller includes control registers such as wait controllers, and in parallel controls the interfaces of various semiconductor memories (ROM, burst ROM, SRAM, PSRAM, DRAM and synchronous RAM) and PC cards (memory and I/O cards). Also included in the bus state controller is a control register for controlling the time to set up PC card start signals where a synchronous DRAM(s) is configured. The address space of an external bus of the microprocessor is divided into a predetermined number of areas to which the semiconductor memories and PC cards are fixedly assigned. The microprocessor further comprises a memory management unit for converting an internally prepared logical address to a physical address.

Abstract: Color measuring systems and methods are disclosed. Perimeter receiver fiber optics are spaced apart from a central source fiber optic and receive light reflected from the surface of the object being measured. Light from the perimeter fiber optics pass to a variety of filters. The system utilizes the perimeter receiver fiber optics to determine information regarding the height and angle of the probe with respect to the object being measured. Under processor control, the color measurement may be made at a predetermined height and angle. Various color spectral photometer arrangements are disclosed. Translucency, fluorescence and/or surface texture data also may be obtained. Audio feedback may be provided to guide operator use of the system. The probe may have a removable or shielded tip for contamination prevention.

Abstract: A vector point of an exception handler related to TLB miss exception events is obtained by reading a vector base address of a register VBR one time, and by adding a vector offset (H'400) thereto. A vector point of an exception handler related to exception events other than the TLB miss exception events is obtained by adding a vector offset to a value (vector base address) of the register VBR, and an exception code which is an address offset obtained by reading a value of the register EXPEVT or INTEVT one time is added to the vector point that is obtained. Thus, the processing is branched to a required exception handler to execute the exception event processing related to exception events other than the TLB miss exception events.

Abstract: Gas-phase methods and systems for reducing NOx emissions and other contaminants in exhaust gases, and industrial processes using the same, are disclosed. In accordance with the present invention, hydrocarbon(s) autoignite and autothermally heat an exhaust gas from an industrial process so that NH.sub.3, HNCO or a combination thereof are effective for selectively reducing NOx autocatalytically. Preferably, the reduction of NOx is initiated/driven by the autoignition of hydrocarbon(s) in the exhaust gas. Within the temperature range of about 900-1600.degree. F., the introduced hydrocarbon(s) autoignite spontaneously under fuel-lean conditions of about 2-18% O.sub.2 in the exhaust gas. Once ignited, the reactions proceed autocatalytically, heating the exhaust gas autothermally.

Abstract: A semiconductor package comprises a semiconductor chip having bonding pads in the center area of surface thereof; a plurality of leads disposed on and attached to the upper surface of the chip by an attaching means. The attaching means covers all but the bonding pads of the chip. The leads have a bonding tip which is disposed on the side thereof and electrically connected to the bonding pads by bonding wires, and are arranged horizontally along the surface of the chip thereby providing large contact areas to the chip. A molding compound hermetically encloses the chip and the attaching means, and exposes the leads. The semicoductor package can be used in combination with an electrical circuit board having improved heat dissipation capability. The electrical circuit board includes a substrate comprised of a dielectric material, a circuit wiring formed on the substrate, and a plurality of heat dissipation pins disposed on the substrate in a pattern corresponding to leads of the semiconductor package.

Abstract: Optical characteristic measuring systems and methods such as for determining the color or other optical characteristics of an object are disclosed. Perimeter receiver fiber optics are spaced apart from a source fiber optic and receive light from the surface of the object being measured. Light from the perimeter fiber optics pass to a variety of filters. The system utilizes the perimeter receiver fiber optics to determine information regarding the height and angle of the probe with respect to the object being measured. Under processor control, the optical characteristics measurement may be made at a predetermined height and angle. Various color spectral photometer arrangements are disclosed. Translucency, fluorescence, gloss and/or surface texture data also may be obtained. Audio feedback may be provided to guide operator use of the system. The probe may have a removable or shielded tip for contamination prevention. A method of producing prostheses based on measured data also is disclosed.

Abstract: A picture frame and accompany audio message circuit is provided such that one or more desired audio messages stored in audio message circuit associated with one or more display pictures can be played upon the touching of the pictures or the frame, or in response to a speech recognition device sensing an audio command associated with the particular audio message and/or pictures. When audio message playback is desired, a switch on the frame or under a protective cover for the picture is activated by touching, or a position sensitive device may be used to sense whether a particular position on the picture has been touched. Digital or analog information representing the desired audio message is retrieved from a memory device, which is subsequently transmitted to a speaker which produces the desired audio message perceptible to a human.

Abstract: A programmable semiconductor element having an antifuse structure is disclosed. A first insulation film is formed on a silicon substrate. First and second conductors are formed on the first insulation film. The first and second conductors are spaced apart at a contact hole region. A second insulation film is formed on the first insulation film and the first and second conductors. The second insulation film includes a contact hole at a portion corresponding to the contact hole region. The second insulation film includes a recess adjacent to the contact hole. A conductor link is formed in the recess in the second insulation film. A third insulation film is formed over the conductor link.

Abstract: An apparatus and method are described for a radio frequency document control system that enables the location of documents, such as office files, to be automatically and rapidly identified. A host transceiver, controlled via a PC, transmits a coded RF signal, at a first frequency, to individually addressable, low cost, local exciters/transceivers located on shelves and/or in drawers. The local exciters, which may be sequentially addressed, retransmit the coded RF signal at a second frequency via an antenna. A passive radio frequency identification tag, containing the same code as that transmitted by the local exciter and attached to a document, such as a file folder, when in the vicinity of the antenna of the local exciter, is energized by the RF field and modulates the second frequency signal from the local exciter. The second frequency signal modulated by the energized tag is then directly received by the host transceiver.

Abstract: A viscous fluid discharging apparatus is provided for removing air bubbles introduced during the passing of the viscous fluid before being supplied to the substrate. A viscous fluid discharging apparatus according to the present invention includes a viscous fluid storing container, a viscous fluid supplying pump, a viscous fluid filter, and a viscous fluid discharging mechanism provided with a final air bubble filtering means. The fluid material discharging mechanism includes a connecting portion formed on an end of a temperature adjusting mechanism connected to an outlet of the fluid material supplying pump, and a discharging gun. The discharging gun has a sealed joining portion for being sealed and joined to the connecting portion, an air bubble capturing portion for capturing air bubbles from within the viscous fluid, and a viscous fluid path for moving the viscous fluid to an outlet in a sealed state.

Abstract: Two up-counters and two down-counters having a time difference corresponding to a dead time are provided to realize an up-down symmetric count, such that the up-counters and the down-counters are made to count the lower limit and the upper limit (a 1/2 period+the dead time), the up-counter for counting a relatively large value and the down-counter for counting a relatively large value are made to contact at the upper limit, the up-counter for counting a relatively small value and the down-counter for counting a relatively small value are made to intersect at a count value corresponding to the 1/2 period, the up-counter for counting the relatively large value and the down-counter for counting the relatively large value are made to intersect at the count value corresponding to the dead time, and the up-counter for counting the relatively small value and the down-counter for counting the relatively small value are made to contact at the lower limit.

Abstract: A single-chip microcomputer comprising: a first bus having a central processing unit and a cache memory connected therewith; a second bus having a dynamic memory access control circuit and an external bus interface connected therewith; a break controller for connecting the first bus and the second bus selectively; a third bus having a peripheral module connected therewith and having a lower-speed bus cycle than the bus cycles of the first and second buses; and a bus state controller for effecting a data transfer and a synchronization between the second bus and the third bus. The single-chip microcomputer has the three divided internal buses to reduce the load capacity upon the signal transmission paths so that the signal transmission can be accomplished at a high speed. Moreover, the peripheral module required to have no operation speed is isolated so that the power dissipation can be reduced.

Abstract: The invention provides a semiconductor integrated circuit device, which minimizes an increase in the physical and logical size, allows data transfers invoked by a large number of interrupts, and improves the processing efficiency. This semiconductor integrated circuit device is applied to a single chip microcomputer and includes function blocks such as CPU, data transfer controller DTC, ROM, RAMI, RAMP, timer, pulse output circuit, serial communication interface SCI, A/D converter, IOP0-11, interrupt controller, and bus controller BSC. The internal address bus IAB and the internal data bus IDB are connected to CPU, ROM, RAMI and BSC. The internal address bus PAB and the internal data bus PDB are connected to BSC, RAMP, timer, pulse output circuit, SCI, A/D converter, interrupt controller, and IOP0-11. Further, PDB is connected to DTC.

Abstract: Optical characteristic measuring systems and methods such as for determining the color or other optical characteristics of an object are disclosed. Perimeter receiver fiber optics are spaced apart from a source fiber optic and receive light from the surface of the object being measured. Light from the perimeter fiber optics pass to a variety of filters. The system utilizes the perimeter receiver fiber optics to determine information regarding the height and angle of the probe with respect to the object being measured. Under processor control, the optical characteristics measurement may be made at a predetermined height and angle. Various color spectral photometer arrangements are disclosed. Translucency, fluorescence, gloss and/or surface texture data also may be obtained. Audio feedback may be provided to guide operator use of the system. The probe may have a removable or shielded tip for contamination prevention. A method of producing prostheses based on measured data also is disclosed.

Abstract: A semiconductor memory device including a semiconductor substrate having a trench; a dielectric film formed on the substrate; a storage node electrode formed on the dielectric film; a first insulating film formed on the storage node electrode corresponding to the trench; a gate electrode formed on the first insulating film; a second insulating film formed on the gate electrode; a gate insulating film formed on at least one the side of gate electrode; a semiconductor layer formed on the at least one side of the first and second insulating films; and impurity regions formed in the semiconductor layer at the sides of the first and second insulating films.

Abstract: A MOSFET and method of manufacture thereof is disclosed in which an ion implantation layer formed in the channel region is isolated from the source and drain regions. The source and drain regions are of a lightly doped drain or "LDD" structure. According to this MOSFET and method, short channel effects are decreased by the channel implant, yet hot carrier and doping compensation effects are decreased, junction capacitance is decreased, and mobility of the carriers also may be improved.

Abstract: A video signal clamping circuit for maintaining a constant clamping output level is disclosed including a clamper for generating a clamping output level in response to a reference voltage by use of an external condenser receiving a video signal and a plurality of transistors, a level variation detector for sensing a variation the clamping output level of the clamper and generating a level variation signal corresponding to the variation in the clamping output level, and a reference voltage compensator connected to the level variation detector, for receiving the level variation signal and compensating for the reference voltage of the clamper.

Abstract: An image processing apparatus coupling at least two image processing systems connected to a network. The network couples image information to each system, and each system displays at least one image. Each system includes a communication unit and a control unit. The communication unit couples information to and receives information from the network. The control unit includes a central processing unit (CPU) and a partitioned memory space, including, both common and personal memory. The personal memory of each system contains one or more personal images that can be viewed only by the respective system, wherein each system is controlled to access only its respective personal memory. Under control of the CPUs in the respective systems, a common image is coupled to each system over the network and commonly displayed on each system. While the common image is commonly displayed on each system, it is edited by the first image processing system.

Abstract: Color measuring systems and methods are disclosed. Perimeter receiver fiber optics are spaced apart from a central source fiber optic and receive light reflected from the surface of the object being measured. Light from the perimeter fiber optics pass to a variety of filters. The system utilizes the perimeter receiver fiber optics to determine information regarding the height and angle of the probe with respect to the object being measured. Under processor control, the color measurement may be made at a predetermined height and angle. Various color spectral photometer arrangements are disclosed. Translucency, fluorescence and/or surface texture data also may be obtained. Audio feedback may be provided to guide operator use of the system. The probe may have a removable or shielded tip for contamination prevention.

Abstract: A method for formation of a wiring layer in a semiconductor device, which includes the steps of: forming a first conductive layer upon a substrate; forming a second conductive layer on the first conductive layer, the second conductive layer having a melting point lower than that of the first conductive layer; and melting (or flowing) the second conductive layer. The first conductive layer is composed of aluminum or an aluminum alloy, and the impurity may be Si or Cu, while the second conductive layer has a melting point lower than that of the first conductive layer by 10.degree. C. or more.