Abstract: The present invention relates to an amplification device comprising an amplifying medium (2) of parallelepiped shape and pumping means comprising lamps (5) emitting first radiation in a frequency range useful for the amplification and second radiation capable of degrading the amplifying medium. It is characterized in that lamps (5) are integrated into a jacket (3) that absorbs at least some of the second radiation.

Abstract: A quadrature oscillator includes a first oscillator having a first second-order harmonic node, a second oscillator having a second second-order harmonic node, and at least one capacitor coupling the first second-order harmonic node and the second second-order harmonic node. The first oscillator is configured to supply an in-phase signal and the second oscillator is configured to supply a quadrature signal.

Abstract: An exemplary structure for a gate structure of a field effect transistor comprises a gate electrode; a gate insulator under the gate electrode having footing regions on opposing sides of the gate electrode; and a sealing layer on sidewalls of the gate structure, wherein a thickness of lower portion of the sealing layer overlying the footing regions is less than a thickness of upper portion of the sealing layer on sidewalls of the gate electrode, whereby the field effect transistor made has almost no recess in the substrate surface.

Abstract: A roll of optical-film laminate that increases accuracy, speed and yield in the production of liquid-crystal display elements. The roll of optical film laminate is for use in an apparatus for continuously producing liquid-crystal display elements. The optical film comprises a polarizing composite film of a laminate having a continuous web of polarizer and a protective film superposed on one side of the continuous polarizer, an adhesive layer disposed on one side of the laminate; and a carrier film superposed on the adhesive layer of the polarizing film in a peelable state. Defective and normal regions in the polarizing film are determined. According to these determined regions, coded information that specifies positions of slit lines to be formed in the optical-film web are recorded on the continuous web.

Abstract: A manufacturing method of an absorbent article according to the present invention includes the steps of a leg circumference forming process of forming a leg circumferential region on a web which is continuously fed in an MD, in a conveyance device, and a folding process of folding the web in two after the leg circumference forming process, so that a second half region on one divided by a center line in a CD comes closer to or overlaps a first half region on the other side. In the folding process, the first half region is conveyed on a conveyance belt which drives horizontally in parallel to an installation surface of the conveyance device (for example, a folding device) and the second half region is folded towards the first half region by a guide unit that guides the second half region.

Abstract: The present invention relates to a device for optically detecting position and/or attitude of an object (5) moving in a given travel range (4), said device comprising electro-optical sensors positioned on said object and distributed in groups, called clusters (6), analysis and computation means (2) making it possible to find the position and/or the attitude of said object, electronic image generation means (1) and optical projection means (1) comprising a display and a projection optic. The optical projection means emit, in a projection cone, a clear image (3) at any point of the travel range, the analysis of the signals received by the sensors of at least one cluster making it possible to identify the position and/or the attitude of the object in the frame of reference defined by the projection means, the latter consisting of a plane perpendicular to the projection axis, called image plane, and the projection axis.

Abstract: An integrated circuit includes a bipolar transistor disposed over a substrate. The bipolar transistor includes a base electrode disposed around at least one germanium-containing layer. An emitter electrode is disposed over the at least one germanium-containing layer. At least one isolation structure is disposed between the emitter electrode and the at least one germanium-containing layer. A top surface of the at least one isolation structure is disposed between and electrically isolating a top surface of the emitter electrode from a top surface of the at least one germanium-containing layer.

Abstract: An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer.

Abstract: Disclosed herein is a system and method for providing a packet network-based MRBT service. In the method, when an originating MSC (110) requests call termination location information from an HLR (120), the HLR transmits an MRBT service request message, including a calling number and a called number, to an MRBT server (140). The MRBT server returns an MRBT service response message, including URL of MRBT content, to the HLR. The HLR transmits a call termination location information response message to the originating MSC, with MRBT service ID information and called party MRBT content URL information included in the call termination location information response message. The originating MSC (110) transmits called party MRBT content URL information to an originating MS (100) on a basis of the MRBT service ID information. The originating MS accesses the MRBT content URL, downloads relevant MRBT content, and plays and stores the MRBT content.

Abstract: A semiconductor package holder includes two plates, and each plate defining a through-hole. Each of the plates has a set of first members along a periphery of the through-hole and extending into the through-hole. The first members of one of the plates are positioned to overlie the first members of the other of the plates. One of the at least two plates further has a set of second members along a periphery of the through-hole and extending into the through-hole.

Abstract: A joint on an aircraft, a bonding lead for use in such a joint, and a method of manufacturing such a joint. The bonding lead comprises an elongate conductive core with a pair of end faces at the extremities of its length. The conductive core is encapsulated along at least a majority of its length and at both end faces in a barrier layer typically formed from an elastomer. The lead is encapsulated along its length in the barrier layer apart from at a first contact region towards a first end of the bonding lead and a second contact region towards a second end of the bonding lead.

Abstract: The present invention relates to a device making it possible to study the solar corona on a space mission requiring the formation flight of two satellites: an occulting satellite (OCC), the role of which is to create an artificial eclipse of the sun from the point of view of a coronagraph (10) onboard a second satellite, called carrying satellite (COR). The invention presents the advantage of proposing a formation flight device intended for a solar coronagraphy mission comprising fixed solar panels (11a), requiring no deployment, thanks to a dissymmetrical accommodation of the coronagraph (10) reflected in a shifting of said coronagraph (10) to a side of the carrying satellite (COR).

Abstract: There is provided a wireless apparatus having a shielding function for shielding signal interference between driving power from a power amplifier and a conductive wire of a coupler. The wireless apparatus having a shielding function, includes an amplifying unit receiving preset driving power and amplifying a radio frequency (RF) input signal according to a preset gain, an impedance matching unit including at least one coil, receiving the driving power from the amplifying unit, and matching the impedance of a path of a signal, amplified from the amplifying unit, through the coil, and a shielding unit eliminating signal interference between the coil and a transmission path of the driving power from the amplifying unit.

Abstract: A characteristic tracking method for a battery module including at least one battery is disclosed. A look-up table is provided according to a primary characteristic of the battery. It is determined whether a battery has satisfied a preset condition when the battery module is operated from a usage state to an idling state. The battery is measured to have obtained a first voltage and a real capacity when the battery satisfies the preset condition. The measured first voltage is utilized to locate a table capacity of the battery from the look-up table. The look-up table is updated according to the real capacity and the table capacity. A peripheral circuit of characteristic tracking method has been exhibited.

Abstract: A check valve in particular for medical applications has a first hose connecting casing and a second hose connecting casing and a membrane disk configured between the two hose connecting casings. The membrane disk is made of a resilient material and cooperates with an annular valve seat. The membrane disk is fitted radially outside the valve's seat with apertures leading to a discharge space. The wall of the second hose connecting casing is opposite the apertures and fitted with a surface curved away from the membrane toward the discharge channel. The discharge channel is fitted with an intake mouth in the wall, and conically tapers within a transition segment toward the intake mouth. Recesses communicating with the discharge space are fitted into the transition segment and are dimensioned in a way to substantially compensate the different flow cross-sections between the intake mouth and the discharge channel.

Abstract: A method for thinning a wafer is provided. In one embodiment, a wafer is provided having a plurality of semiconductor chips, the wafer having a first side and a second side opposite the first side, wherein each of the chips includes a set of through silicon vias (TSVs), each of the TSVs substantially sealed by a liner layer and a barrier layer. A wafer carrier is provided for attaching to the second side of the wafer. The first side of the wafer is thinned and thereafer recessed to partially expose portions of the liner layers, barrier layers and the TSVs protruding from the wafer. An isolation layer is deposited over the first side of the wafer and the top portions of the liner layers, barrier layers and the TSVs. Thereafter, an insulation layer is deposited over the isolation layer. The insulation layer is then planarized to expose top portions of the TSVs. A dielectric layer is deposited over the planarized first side of the wafer.

Abstract: A wafer is attached to a carrier by using an adhesive layer, and a portion of the adhesive layer is exposed adjacent to an edge of the wafer. After thinning the wafer, a protection layer is provided to cover the exposed portion of the adhesive layer. A plurality of dies is bonded onto the thinned wafer, and then the thinned wafer and the dies are encapsulated with a molding compound.