Patents Represented by Attorney, Agent or Law Firm Mark Goldberg
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Patent number: 5169320Abstract: This invention provides shielded and wireless connectors for interconnecting electronic circuit boards that are stacked in metal carriers. Serial interconnectors through the carriers provide transmission line paths through the stacked layers through connector assemblies embedded in and fed through each carrier in collinear alignment with each other. Each of the embedded feed through connector assemblies has upper and lower button connectors interconnected by a metal conductor, all positions within an axial hole formed by a pair of substantially cylindrical dielectric inserts. The upper and lower button connectors protrude from the upper and lower surfaces of the upper and lower adjacent circuit boards, respectively. This invention provides connector assemblies having the ability to withstand very high inertial forces without degradation of the electrical contact with the metal pads of the respective circuit boards.Type: GrantFiled: September 27, 1991Date of Patent: December 8, 1992Assignee: Hercules Defense Electronics Systems, Inc.Inventors: Franklin S. Burkett, Jr., Allen Fernandez
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Patent number: 5130376Abstract: Compositions comprised of ultra-high molecular weight polyethylene slurried in a styrene monomer containing a styrene crosslinker and a free radical catalyst are disclosed. These slurries are subjected to heating in a mold whereby the polyethylene phase is dissolved in the styrene monomer and the styrene monomer is polymerized to form a shaped article. The polystyrene/polyethylene product has unique properties.Type: GrantFiled: April 23, 1990Date of Patent: July 14, 1992Assignee: Hercules IncorporatedInventor: Keith S. Shih
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Patent number: 5112924Abstract: Described are novel thermosetting maleimide compositions suitable for making cured resins, prepregs and tough thermoset composites. The thermosetting compositions comprise a multifunctional maleimide and a terminally unsaturated polyamide, polyimide, or polyamideimide oligomer which is soluble in the composition. The cured resins have a fracture toughness, K.sub.IC, of at least 1.0 MPam 1/2 and a glass transition temperature of at least 200.degree. C.Type: GrantFiled: July 30, 1990Date of Patent: May 12, 1992Assignee: Hercules IncorporatedInventors: Sung G. Chu, Harold Jabloner, Tuyen T. Nguyen
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Patent number: 5104634Abstract: A novel process is disclosed for forming diamond coatings whereby a silent discharge, such as a DC glow discharge, is used to form a plasma containing activated species. The plasma is then expanded through a nozzle to form a low temperature plasma jet which contacts a substrate to form the diamond coating. The plasma initially contains a mixture of hydrogen and carbon based gases such as methane. In a preferred embodiment, hydrogen is initially present in the plasma and the carbon containing gas (carbon containing molecules e.g. methane, carbon monoxide) is subsequently mixed into the plasma jet downstream of the nozzle throat and allowed to react with the activated hydrogen, prior to the plasma jet contacting the substrate.Type: GrantFiled: April 20, 1989Date of Patent: April 14, 1992Assignee: Hercules IncorporatedInventor: Hartwell F. Calcote
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Patent number: 5096766Abstract: Described are novel thermosetting maleimide compositions suitable for making cured resins, prepregs and tough thermoset composites. The thermosetting compositions comprise a multifunctional maleimide and a terminally unsaturated polyamide, polyimide, or polyamideimide oligomer which is soluble in the composition. The cured resins have a fracture toughness, K.sub.IC, of at least 1.0 MPan.sup.1/2 and a glass transition temperature of at least 200.degree. C.Type: GrantFiled: July 30, 1990Date of Patent: March 17, 1992Assignee: Hercules IncorporatedInventors: Sung G. Chu, Harold Jabloner, Tuyen T. Nguyen
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Patent number: 5095074Abstract: A novel polyfunctional maleimide-based thermosettable resin composition comprising: (a) at least one polyfunctional maleimide compound selected from the group consisting of bismaleimide and polymaleimide, and (b) at least one ether derivative of an alkenylphenol.Type: GrantFiled: April 2, 1990Date of Patent: March 10, 1992Assignee: Hercules IncorporatedInventors: Sung G. Chu, Harold Jabloner, Tuyen T. Nguyen
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Patent number: 5082909Abstract: This invention relates to a two component catalyst system for polymerization of metathesis polymerizable cycloolefins, comprising(a) a tungsten compound of the formula WOCl.sub.4-x (OAr).sub.x wherein Ar represents a hindered phenyl ring having bulky alkyl, alkoxyl halogen or aryl groups in the 2,6 position, i.e., diisopropyl or phenyl group and x=1, 2 or 3; and(b) an activator compound that is triphenyl tin hydride or trialkyl tin hydride, preferably a tributyltin hydride.Among the preferred molecules or groups that are substituted on the phenyl ring of the tungsten compound include chlorine, bromine, phenyl, methoxy and isopropyl. Ar may also represent a multisubstituted phenyl group such as 2,4-dichloro-6-methyl phenyl.Type: GrantFiled: October 12, 1990Date of Patent: January 21, 1992Assignee: Hercules IncorporatedInventor: Andrew Bell
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Patent number: 5075356Abstract: A resin composition especially suited to the resin transfer molding and wet filament winding processes is composed of epoxide compounds and one or more aromatic amine hardeners wherein the blend of epoxide compounds is (i) a diglycidyl ether of the reaction product of a bisphenol and a blend of (a) a diglycidyl ether of bisphenol A other than that of (i) and (b) a halohydrin having about two epoxy groups per molecule, (ii) a copolymer of ethyl hexyl acrylate and glycidyl methacrylate and (iii) a neopentyl glycol digylcidyl ether. This composition has a low viscosity, and when cured, exhibits high toughness and mechanical strengths useful in making high performance composites.Type: GrantFiled: November 15, 1990Date of Patent: December 24, 1991Assignee: Hercules IncorporatedInventors: David A. Crosby, Kenneth A. Lowe
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Patent number: 5073282Abstract: Disclosed are electrorheological fluids which display improved stability against sedimentation, reduced current density and good electrorheological responses. In the preferred embodiment of this invention, these electrorheological fluids are prepared from monomers which are polymerized by dispersion polymerization in a low conductivity medium which also serves as the dispersion medium for the fluid.Type: GrantFiled: April 21, 1989Date of Patent: December 17, 1991Assignee: Hercules IncorporatedInventor: Syed M. Ahmed
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Patent number: 5053256Abstract: A method of improving the paint adhesion properties of a cycloolefin polymer article comprising exposing the surface of said article to a solution of sodium hypochlorite or a solution of potassium permanganate. Preferably the solution is of sodium hypochlorite and it further contains a detergent solution.Type: GrantFiled: November 3, 1988Date of Patent: October 1, 1991Assignee: Hercules IncorporatedInventor: Harold F. Haag
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Patent number: 5049615Abstract: Novel thermoplastic compositions are provided comprising a blend of a polyindane resin and an engineering thermoplastic such as polyphenylene ethers, polysulfones, polycarbonates, polyether ether ketones, polyarylates, polyamides, polyimides and polyphenylene sulfides. Blends of thermoplastic block copolymers with polyindane resins are also provided. These blends provide improved processability with good physical properties including high impact strength and high heat distortion temperature.Type: GrantFiled: December 11, 1989Date of Patent: September 17, 1991Assignee: Hercules IncorporatedInventors: Sung G. Chu, Birendra K. Patnaik, Keith S. Shih
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Patent number: 5025045Abstract: Damage tolerant composites comprising high strength filaments in the form of bundles or tows of continuous fiber and a tough phase separated, crosslinked epoxy resin matrix are disclosed. The crosslinked epoxy resin matrix comprises infusible particles that reside primarily between plies of the composite and critically have a median particle size between 10-75 microns. Prepregs for making the damage tolerant composites and methods of making such prepregs and the epoxy resin compositions thereof are also disclosed. The epoxy resin compositions comprise the infusible particles which become segregated as to size on a surface layer of the prepreg during the process of combining the high strength filaments of the prepreg and the resin containing the epoxy resin composition. Alternatively, the infusible particles may be disposed directly on the epoxy resin surface of the prepreg.Type: GrantFiled: December 20, 1988Date of Patent: June 18, 1991Assignee: Hercules IncorporatedInventors: Irena Gawin, Brian J. Swetlin
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Patent number: 5023230Abstract: Disclosed is a method of preparing a superconductor wherein a precursor oxide mixture is dispersed in an appropriate polymer matrix and shaped into a predetermined form following which the matrix and oxide precursor are respectively carbonized and sintered simultaneously. An alternate method is to separately prepare a superconducting material from the precursor oxide mixture, grind the superconducting material and add it to a solution containing polyacrylonitrile, shape into a predetermined form, following which the superconducting material and matrix are, respectively, carbonized and then annealed.Type: GrantFiled: July 7, 1989Date of Patent: June 11, 1991Assignee: Hercules IncorporatedInventor: Huai N. Cheng
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Patent number: 5019544Abstract: This invention is a process for preparing a polymer which comprises contacting pure dicyclopentadiene with a pure tungsten catalyst complex, such as WCl.sub.3 (2,6-diisopropylphenoxy).sub.3, when tributyl tin hydride or triphenyl tin hydride is used as the activator for the polymerization. This process affords a method of polymerization of dicyclopentadiene in which the mixture gels slowly without the use of a rate moderator at 80.degree. C. (in from about 15 seconds to as much as two minutes or more) and furthermore cures quite slowly (in about 3-6 minutes). This delay makes these compositions particularly applicable to reaction injection molding processes. Moreover, both the tungsten complexes and the tin activator compounds employed in this invention are relatively insensitive to oxygen and water.Type: GrantFiled: August 9, 1990Date of Patent: May 28, 1991Assignee: Hercules IncorporatedInventor: Andrew Bell
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Patent number: 5017647Abstract: A pigmented polymeric composition of matter is provided which comprises units derived from ring-opening metathesis catalyst polymerization of a norbornene-type monomer or mixtures of norbornene-type monomers, and from about 0.05 to about 25 parts by weight, per 100 parts norbornene-type monomer, of carbon black which is substantially free of oxygen.Type: GrantFiled: June 5, 1990Date of Patent: May 21, 1991Assignee: Hercules IncorporatedInventors: Alvin L. Dougal, Jr., Shigeyoshi Hara
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Patent number: 5015705Abstract: A process for preparing molded objects wherein a liquid reaction mass comprised of a metathesis polymerizable cycloolefin, a metathesis polymerization catalyst, a catalyst activator and a reaction rate moderator are charged to a mold wherein polymerization will take place, the improvement wherein said catalyst activator comprises a dialkylzinc compound. Significantly increased gel and cure times are obtained with the dialkylzinc compounds as compared to the use of aluminum alkyl activator compounds. The gel and cure times may be further controlled by the addition of a phenolic compound to the tungsten or molybdenum compound or by the addition of a Lewis base.Type: GrantFiled: November 13, 1989Date of Patent: May 14, 1991Assignee: Hercules IncorporatedInventor: Andrew Bell
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Patent number: 4999238Abstract: Damage tolerant composites comprising high strength filaments in the form of bundles or tows of continuous fiber and a tough phase separated, crosslinked epoxy resin matrix are disclosed. The crosslinked epoxy resin matrix comprises infusible particles made from a rubber polymer that reside primarily between plies of the composite and critically have a median particle size between 10-75 microns. Prepregs for making the damage tolerant composites and methods of making such prepregs and the epoxy resin compositions thereof are also disclosed The epoxy resin compositions comprise the infusible particles which become segregated as to size on a surface layer of the prepreg during the process of combining the high strength filaments of the prepreg and the resin containing the epoxy resin composition.Type: GrantFiled: April 3, 1989Date of Patent: March 12, 1991Assignee: Hercules IncorporatedInventor: Irena Gawin
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Patent number: 4997991Abstract: The invention provides an inexpensive synthesis process for preparation of diethynylbenzene monomers that are useful in the preparation of polyacetylenes. This process provides for the preparation of thermally sensitive monomers in a one-pot reaction using readily available materials at low temperatures in an environment capable of absorbing large amounts of energy. Divinylbenzene is first brominated and then dehydrobrominated with sodium hydroxide or potassium hydroxide preferably in the presence of a phase transfer agent followed by distillation to recover the diethylnylbenzene product.Type: GrantFiled: March 26, 1990Date of Patent: March 5, 1991Assignee: Hercules IncorporatedInventors: Lawrence E. Carosino, David C. Herak
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Patent number: 4992192Abstract: Disclosed are electrorheological (ER) fluids which display improved stability against sedimentation, reduced current density and good ER responses. Thes=e ER fluids are prepared from monomers which are polymerized by dispersion polymerization in a low conductivity medium which also serves as the dispersion medium for the fluid. The ER fluids are further processed by modifying the polymer particles through polymerization of a hydrophilic monomer to form a hydrophilic shell or globule around the particles followed by neutralization through addition of an organic soluble base. The resulting dispersion is then doped with water to obtain a stable ER fluid. The hydrophilic shell or globule constitutes about 15% of the particle. Water dopant is only absorbed by the hydrophilic portion of the particle and does not enter into the core of the particle. The quantity of water is significantly reduced, which in turn results in a significant reduction of the current density at any given comparative voltage.Type: GrantFiled: April 21, 1989Date of Patent: February 12, 1991Assignee: Hercules IncorporatedInventor: Syed M. Ahmed
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Patent number: 4990279Abstract: Disclosed are electrorheological (ER) fluids which display improved stability against sedimentation, reduced current density and good electrorheological response. These ER fluids are prepared from monomers which are polymerized by dispersion polymerization in a low conductivity medium which in most embodiments of the invention serves as the dispersion medium for the fluid. the ER fluids are further processed by modifying the polymer particles through polymerization of a hydrophilic monomer to form a hydrophilic shell or globule around the particles. The resulting dispersion is then doped with water to obtain a stable ER fluid. The hydrophilic shell or globule constitutes a minor part of the particle. Water dopant is only absorbed by the hydrophilic portion of the particle and does not enter into the core of the particle. The quantity of water is significantly reduced, which in turn results in a significant reduction of the current density at any given applied field strength.Type: GrantFiled: April 21, 1989Date of Patent: February 5, 1991Assignee: Hercules IncorporatedInventor: Syed M. Ahmed