Patents Represented by Attorney, Agent or Law Firm Martin G. Meder
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Patent number: 5804682Abstract: A process is provided for preparing a dispersion of a polyamide in water, said process comprising:forming a solution of a polyamide having an acid value of greater than about 2 in an organic solvent to form a solution of said polyamide in said solvent, said polyamide and said solvent being at a temperature below the softening point of said polyamide during said dissolving, said solution further comprising a surfactant, wherein at least a portion of the acid value of said polyamide is neutralized,adding sufficient water to said solution with mixing to form an oil-in-water dispersion, the temperature of said solution and said water being below the softening point of said polyamide during said adding, andremoving at least a major amount of said organic solvent from said oil-in-water dispersion. The resulting dispersion is useful in preparing a coating of the polyamide, which coating is useful as an adhesive.Type: GrantFiled: October 25, 1996Date of Patent: September 8, 1998Assignee: Henkel CorporationInventors: Stephen A. Fischer, David I. Devore, Kartar S. Arora, Reimar Heucher, Michael S. Wiggins, Chase J. Boudreaux, Dwight D. Heinrich
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Patent number: 5798398Abstract: It has been found that non-blushing coatings of high gloss, long pot life and fast cure time may be obtained by using an epoxy curing agent which comprises an epichlorohydrin-metaxylylenediamine reaction product selected from the group consisting of N,N'-bis(3-aminomethylbenzyl)-2-hydroxytrimethylenediamine, the higher oligomers of N,N'-bis(3-aminomethylbenzyl)-2-hydroxytrimethylenediamine and mixtures thereof and a melting point depressant such as a benzyl alcohol or water and an alcohol solvent and, optionally, a tertiary amine such as N,N'-bis(3-(dimethylamino)propyl)-urea.Type: GrantFiled: October 18, 1996Date of Patent: August 25, 1998Assignee: Henkel CorporationInventors: Shailesh Shah, Ronald J. Cash, Ronald LaFreeda, James Aloye, Joseph L. Mulvey
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Patent number: 5795949Abstract: The present invention relates to the use of dimerdiols and/or trimertriols along with other polyols in the making of polyurethane moldings.Type: GrantFiled: December 10, 1996Date of Patent: August 18, 1998Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Peter Daute, Roland Gruetzmacher, Alfred Westfechtel, Nicole Mertscheit
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Patent number: 5786436Abstract: A polymer useful as an inorganic pigment dispersant is provided. The polymer is derived from monomers consisting essentially of an ethylenically unsaturated aromatic monomer, an ethylenically unsaturated acid monomer, and an ethylenically unsaturated amide monomer. The amount of said ethylenically unsaturated acid monomer is sufficient to permit said polymer to associate with an inorganic pigment in an aqueous medium in a manner which disperses said inorganic pigment in said aqueous medium to form a stable aqueous dispersion of said inorganic pigment, and the amount of said ethylenically unsaturated aromatic monomer is sufficient to reduce the water sensitivity of a dried coating of a latex paint comprised of said stable aqueous dispersion of said inorganic pigment. A process of preparing a polymer useful as an inorganic pigment dispersant and a method of preparing an inorganic pigment dispersion useful in the preparation of latex paints are also provided.Type: GrantFiled: July 11, 1997Date of Patent: July 28, 1998Assignee: Henkel CorporationInventors: Stephen A. Fischer, Michael S. Wiggins, Bruce Matta
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Patent number: 5776406Abstract: The invention relates to the use of moisture-curing PU hotmelt adhesives as molding compounds for the production of moldings, the PU hotmelt adhesives having a melt viscosity of less than 100 Pa.multidot.s at the processing temperature of 70.degree. to 190.degree. C. To produce the moldings, the molding compound is melted at temperatures of 70.degree. to 200.degree. C., the melt is injected into closed molds under an excess pressure of 1 to 50 bar, the cooled moldings are removed from the mold after a short time and are then cured with atmospheric moisture. Economic and technical advantages include distinctly lower processing pressures, expense on machinery and tooling and firm adhesion to various substrates. The moldings are heat-resistant and adhere to various substrates. They are particularly suitable for the production of electrical components.Type: GrantFiled: June 23, 1997Date of Patent: July 7, 1998Assignee: Henkel Dommanditgesellschaft auf AktienInventors: Georg Schubert, Michael Krebs, Karin Jonscher, Roland Heider
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Patent number: 5770680Abstract: A process is provided for preparing a dispersion of a polyamide in water, said process comprising:dissolving a polyamide having an amine value of greater than about 2 in an organic solvent to form a solution of said polyamide in said solvent, said polyamide and said solvent being at a temperature below the softening point of, said polyamide during said dissolving, said solution further comprising a surfactant and an inorganic alkaline material,adding sufficient water containing an acid to said solution with mixing to form an oil-in-water dispersion, the temperature of said solution and said water being below the softening point of said polyamide during said adding, the amount of said acid being sufficient to neutralize a portion of said inorganic alkaline material, but insufficient to coagulate said polyamide from the resulting oil-in-water dispersion, andremoving at least a major amount of said organic solvent from said oil-in-water dispersion.Type: GrantFiled: October 25, 1996Date of Patent: June 23, 1998Inventors: Stephen A. Fischer, David I. Devore, Kartar S. Arora, Reimar Heucher
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Patent number: 5755486Abstract: A reinforced structural member has a w-shaped reinforcement member that carries a thermally expandable resin-based material. The w-shaped reinforcement member is placed in the channel of a hollow structural member over a transverse pin which fits through the slot of the reinforcement member. The structural member is heated to expand the resin-based material which locks the reinforcement member in place, thereby significantly strengthening the structural member.Type: GrantFiled: May 23, 1995Date of Patent: May 26, 1998Assignee: Novamax Technologies Holdings, Inc.Inventor: Joseph S. Wycech
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Patent number: 5756555Abstract: Plastisol compositions based on vinyl chloride/vinyl acetate copolymers produced by suspension polymerization have a low viscosity, even with low polymer-to-plasticizer ratios, so that they may be used for plastisol formulations suitable for airless spraying. The compositions are stable in storage and show good gelation properties. Coatings based on these plastisols have a good noise-damping effect, even with high vinyl acetate contents.Type: GrantFiled: December 20, 1996Date of Patent: May 26, 1998Assignee: Henkel Teroson GmbHInventors: Karl Wesch, Klaus Ruch
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Patent number: 5744543Abstract: Described is a single-component adhesive made from a radical-polymerized olefinically unsaturated monomer and an air-activated initiator system and characterized in that the adhesive also contains isocyanate and/or silane groups. This makes a dual curing mechanism possible. The more rapid of the two curing reactions gives specific characteristics in the initial stage, e. g. high initial strength, high adhesive strength or high contact strength. The slower of the two reactions produces the definitive characteristics, e.g. final strength or resistance to heat.Type: GrantFiled: December 9, 1996Date of Patent: April 28, 1998Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Thomas Huver, Herbert Fischer, Wolfgang Klauck, Gerd Bolte
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Patent number: 5739184Abstract: The present invention relates to thermosetting resin compositions which may be used in the automotive industry as sealants to coat steel substrates. The thermosetting resin composition contains an epoxy resin, a rosin, an organometallic compound and, optionally, an elastomeric and/or thermoplastic polymeric binder.Type: GrantFiled: December 17, 1996Date of Patent: April 14, 1998Assignee: National Starch and Chemical CompanyInventors: David L. Marbry, David R. Duller
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Patent number: 5723538Abstract: A process is provided for preparing a dispersion of a polyamide in water, said process comprising:dissolving a polyamide having an amine value of greater than about 2 in an organic solvent to form a solution of said polyamide in said solvent, said polyamide and said solvent being at a temperature below the softening point of said polyamide during said dissolving, said solution further comprising a surfactant and an inorganic alkaline material,adding sufficient water containing an acid to said solution with mixing to form an oil-in-water dispersion, the temperature of said solution and said water being below the softening point of said polyamide during said adding, the amount of said acid being sufficient to neutralize a portion of said inorganic alkaline material, but insufficient to coagulate said polyamide from the resulting oil-in-water dispersion, andremoving at least a major amount of said organic solvent from said oil-in-water dispersion.Type: GrantFiled: October 25, 1996Date of Patent: March 3, 1998Assignee: Henkel CorporationInventors: Stephen A. Fischer, David I. Devore, Kartar S. Arora, Reimar Heucher, Michael S. Wiggins, Chase J. Boudreaux
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Patent number: 5719255Abstract: A composition of matter useful as a hotmelt adhesive is provided. The adhesive comprises a polyamide based on dimerized fatty acid, preferably having an amine value of less than 2, and at least one heat stabilizer for polyvinyl chloride, preferably selected from the group consisting of alkyl tin carboxylate compounds and epoxy compounds. The heat stabilizer is preferably present in an amount of 0.2% to 10.0% by weight of the composition. Also provided is a method of using the composition as a hotmelt adhesive for polyvinyl chloride.Type: GrantFiled: September 11, 1996Date of Patent: February 17, 1998Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Reimar Heucher, Bettina Becker, Angela Rossini
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Patent number: 5710199Abstract: The present invention is directed to compositions for use as additives in the automotive industry, which compositions contain waste powder prime and a plasticizer selected from the group consisting of 2-ethylhexyl diphenyl phosphate, diisoheptyl phthalate, a linear phthalate based upon C.sub.7 -C.sub.9 alcohols, a mixture of esters containing a minimum of 55 percent of diesters and a maximum of 20 percent dibenzoate, a mixture of esters containing a minimum of 60 percent of diesters and a maximum of 30 percent dibenzoate and dipropylene glycol dibenzoate and automotive sealants which contain waste powder prime, a plasticizer selected from the group consisting of 2-ethylhexyl diphenyl phosphate, diisoheptyl phthalate, a linear phthalate based upon C.sub.7 -C.sub.Type: GrantFiled: June 19, 1996Date of Patent: January 20, 1998Inventors: James F. Hubert, Richard A. Rinka
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Patent number: 5700891Abstract: The invention pertains to a composition containing an activator system for free-radical polymerizations and a free-radical polymerizable compound of the general formula II:?H.sub.2 C.dbd.CR.sup.1 --C(.dbd.O)--O--R.sup.2 --O--C(.dbd.O)--NH--Q--NH--C(.dbd.O)!.sub.2 ?{--O--R.sup.4a --O--C(.dbd.O)--NH--Q'--NH--C(.dbd.O)}.sub.m --O--R.sup.4a --O--!(II)whereinm is from 0 to 10;R.sup.1 is hydrogen or a methyl group;R.sup.2 is a linear or branched chain alkyl group containing from 2 to 6 carbon atoms or an alkylene oxide containing from 4 to 21 carbon atoms;Q and Q' independently are aromatic, aliphatic or cycloaliphatic groups containing from 6 to 18 carbon atoms which are derived from the basic diisocyanate or diisocyanate mixtures; andR.sup.4a is derived from a polyesterdiol having a C:O ratio of >2.6, a C:H ratio of <10, and a molecular weight of from 1000 to 20,000.The invention further pertains to a process for the preparation of such composition and the use thereof.Type: GrantFiled: June 28, 1996Date of Patent: December 23, 1997Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Thomas Huver, Carsten Friese, Winfried Emmerling, Michael Kux, Kerstin Motzkat
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Patent number: 5686632Abstract: A process of producing a tocopheryl succinate powder is provided. The process forming a tocopheryl succinate powder into a plastic mass. The plastic mass is then allowed to cool whereupon its sets to a solid state. The solid mass can then be subjected to a size reduction to obtain a tocopherol succinate powder having a desirable particle size, e.g. not more than 5% by weight through a 120-mesh sieve and not more than 5% by weight retained on a 14-mesh sieve.Type: GrantFiled: August 14, 1996Date of Patent: November 11, 1997Assignee: Henkel CorporationInventor: Leo Walsh