Abstract: Data communications, including issuing, by an application program to a high level data communications library, a request for initialization of a data communications service; issuing to a low level data communications library a request for registration of data communications functions; registering the data communications functions, including instantiating a factory object for each of the one or more data communications functions; issuing by the application program an instruction to execute a designated data communications function; issuing, to the low level data communications library, an instruction to execute the designated data communications function, including passing to the low level data communications library a call parameter that identifies a factory object; creating with the identified factory object the data communications object that implements the data communications function according to the protocol; and executing by the low level data communications library the designated data communications fu

Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a process of generating equalization data and a design structure for multilayer electronic structures is presented.

Abstract: The invention relates to a method of optimizing a state transition function specification for a state machine engine based on a probability distribution for the state transitions. For the preferred embodiment of the invention, a B-FSM state machine engine accesses a transition rule memory using a processor cache. The invention allows improving the cache hit rate by exploiting the probability distribution. The N transition rules that comprise a hash table entry will be loaded in a burst mode from the main memory, from which the N transition rules are transferred to the processor cache. Because the comparison of the actual state and input values against each of the transition rules can immediately start after each of these rules has been received, the overall performance is improved as the transition rule that is most likely to be selected is the first to be transferred as part of the burst access.

Abstract: A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board.

Abstract: A cooling system that promotes cooling of a device including a heat source therein is provided, the cooling system includes: a cooling unit that absorbs, upstream from the heat source, heat from intake air that the device takes in from an outside to cool the heat source and dissipates the heat to an outside of a flow path of the intake air; and a fluid control unit that lets fluid flow toward the cooling unit so as to discharge the heat absorbed by the cooling unit from the intake air to an outside of the cooling unit.

Abstract: A first through via is electrically insulated from surrounding wafer substrate material. A second through via is not electrically insulated from the surrounding wafer substrate material. This configuration is advantageous when the non-insulated via serves as the path for either Vdd or GND. By not insulating the through via, a first supply voltage (Vdd or GND) is allowed to flow through the surrounding wafer substrate material thereby decreasing the resistance of the first supply voltage path.

Abstract: The invention relates to a method and system for the design and implementation of state machine engines. A first constraints checking step checks a state transition function created by a designer against constraints imposed by the implementation technology in order to detect all portions of the state transition function that are in conflict with the constraints. A subsequent conflict resolution step tries to determine one or more suggested ways to meet the conflicting constraints, by investigating how the original state transition function can be modified such that all constraints are met. A final presentation and selection step provides the designer textual and/or graphically results of the constraints check and suggested modifications. The modifications can be accepted interactively, or the state transition function can be changed manually. In the latter case, the modified state transition function will be processed starting again with the constraints checking step.

Abstract: A first through via is electrically insulated from surrounding wafer substrate material. A second through via is not electrically insulated from the surrounding wafer substrate material. This configuration is advantageous when the non-insulated via serves as the path for either Vdd or GND. By not insulating the through via, a first supply voltage (Vdd or GND) is allowed to flow through the surrounding wafer substrate material thereby decreasing the resistance of the first supply voltage path.

Abstract: It is an object to reduce a thickness of a semiconductor component (chip) on a substrate to a predetermined thickness regardless of a variation in thickness of a substrate in a semiconductor product. In a semiconductor product mounted on a base plate, a surface of a semiconductor component on a substrate is set to be located at a predetermined height h from a surface of a base plate. Thereafter, through machining the surface of the semiconductor component which is adjusted to be located at the predetermined height, it is possible to make the thickness of the semiconductor component on the substrate equal to a predetermined thickness.

Abstract: A monitor bank consists of test one time programmable memory that is programmed distinctively from functional one time programmable memory in order to determine whether the functional one time programmable memory has or will program successfully. In a specific embodiment, each monitor bank consists of a first eFuse configured to expectedly never blow, a second eFuse configured to expectedly always blow, and at least a third eFuse configured to be more difficult to blow than the first eFuse, but easier to blow than the second eFuse. The method of determining whether functional eFuses have or will be programmed successfully is described: programming a monitor bank; sensing whether the test eFuses have blown; creating a monitor bank bit line blow pattern; determining an anticipated bit line blow pattern; comparing the two patterns; and determining that the functional eFuses will not blow successfully if the patterns do not match.

Abstract: Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: An assembly, system, and method particularly adapted for a magnetic resonator apparatus in a magnetic resonance imaging (MRI) scanning system. Provided is a restraining assembly supportable by the supporting assembly and including at least a system that is selectively operable for positioning and restraining at least a portion of the body to be imaged, thereby optimizing image quality.

Abstract: A method and apparatus of defining a time interval includes providing a source of ionizing radiation that radiates emissions thereof; placing a radiation sensitive display material responsive to ionizing radiation in a close proximity relationship to the source of ionizing radiation whereby the radiated emissions of the source strike the radiation sensitive display material, thereby commencing a time interval; and, measuring changes in characteristics of the radiation sensitive display material that are indicative of the elapsed time.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.

Abstract: An arrangement to enable automatic baud rate speed negotiation between transceivers having different operating speed characteristics is implemented. When an event indicative of a possible baud rate mismatch occurs, control signals are generated and used to trigger a baud rate negotiation procedure. In the baud rate negotiation procedure, a predetermined pattern is transmitted, the baud rate of the respective transmitting transceiver is decoded, and the decoded baud rate is used to select an appropriate filtering for the transceiver.

Abstract: Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.

Abstract: An arrangement to enable automatic baud rate speed negotiation between transceivers having different operating speed characteristics is implemented. When an event indicative of a possible baud rate mismatch occurs, control signals are generated and used to trigger a baud rate negotiation procedure. In the baud rate negotiation procedure, a predetermined pattern is transmitted, the baud rate of the respective transmitting transceiver is decoded, and the decoded baud rate is used to select an appropriate filtering for the transceiver.