Abstract: A MEMS device assembly (20) includes a MEMS die (22) and an integrated circuit (IC) die (24). The MEMS die (22) includes a MEMS device (36) formed on a substrate (38) and a cap layer (34). A packaging process (72) entails forming the MEMS device (36) on the substrate (38) and removing a material portion of the substrate (38) surrounding the device (36) to form a cantilevered substrate platform (46) at which the MEMS device (36) resides. The cap layer (34) is coupled to the substrate (38) overlying the MEMS device (36). The MEMS die (22) is electrically interconnected with the IC die (24). Molding compound (32) is applied to substantially encapsulate the MEMS die (22), the IC die (24), and interconnects (30) that electrically interconnect the MEMS device (22) with the IC die (24). The cap layer (34) prevents the molding compound (32) from contacting the MEMS device (36).

Abstract: A new measurement system, with two receiver channels per measurement port, has been developed that provides absolute magnitude and absolute phase relationship measurements over wide bandwidths. Gain ranging is used at RF to provide optimum noise performance and a swept YIG preselector filter is used to avoid spurious signals. A new absolute vector error correction method is used to calibrate the measurement system in order to allow for absolute vector measurements, and it also removes the time-varying responses caused by the swept YIG preselector filters. A quasi-reciprocal mixer with a characterized non-reciprocal ratio is used to provide the absolute calibration standard. The two receiver channels can be adapted to a wide variety of applications, including wide bandwidth vector signal analyzer measurements, mixer measurements, and harmonic measurements. The two-channels can also be used as an absolute calibrated transmitter/reflectometer.

Abstract: A wireless network (20) with at least a first radio communication unit (24) and a second radio communication unit (26) transmits and receives signals with minimal interference from the surrounding environment of the first unit (24) and second unit (26). The first radio communication unit (24) determines frequencies (54) having power level above a threshold (52), and creates a list of these frequencies (50) to be transmitted to the second radio communication unit (26). The second radio communication unit (26) places notches (140) in its transmission band (88) based on frequencies (54) in the list (50), reserved frequencies (132), and local frequencies (92) having signal energy above a threshold (90). When transmitting a signal (42), the second radio communication unit (26) avoids transmitting in frequencies that have notches (140).

Abstract: A system (20) for conditioning air (30) includes conditioning circuits (26, 28). Each of the circuits (26, 28) includes a heat transfer coil (54, 60) residing in a supply section (22) of the system (20), and a heat transfer coil (56, 62) residing in a return section (24) of the system (20). A controller (50) in communication with the circuits (26, 28) determines one of a heating mode (78, 110) and a cooling mode (148, 150) for an interior space (34). The controller (50) selectively actuates the conditioning circuits (26, 28) to condition outside air (30) entering the supply section (22) to produce conditioned supply air (36) for provision into space (34) and to recover heating and cooling energy from return air (38) entering the return section (24) from the space (34) prior to its discharge from the system (20) as exhaust air (44).

Abstract: A method (32) of packaging integrated circuit (IC) dies (48) includes applying (36) a laminating material (44) to a wafer (40), and separating (46) the wafer (40) into multiple IC dies (48) such that the laminating material (44) is applied to back surfaces (52) of the IC dies (48). Each of the IC dies (48) is positioned (62) with an active surface (50) facing a support substrate (56). An encapsulant layer (72) is formed (64) overlying the laminating material (44) and the back surfaces (52) of the IC dies (48) from a molding compound (66). The molding compound (66) and the laminating material (44) are removed from the back surfaces (52) of the IC dies (48) to form (76) openings (78) exposing the back surfaces (52). Conductive material (84, 88) is placed in the openings (78) and functions as a heat sink and/or a ground for the IC dies (48).

Abstract: Disclosed is a market-based software system that will help user-retailers manage price and inventories more effectively. The system will take advantage of available price and sales data to provide pricing recommendations that will achieve a retail user's objectives. The system will offer a solution that will allow for pricing improvement shortly after installation by utilizing data that is readily available. The system will recommend price changes that help a user achieve specified objectives such as contribution, sales volume, desired margins, and the like. The system can also collect and process price and sales data on an ongoing basis, which can enable improved estimates of customer price sensitivity and performance on a category-by-category basis. This data can be used to improve further pricing decisions.

Abstract: A suture anchor 20 is inserted within the spongy bone 22? such that only suture segments 40 and 42 extend into the cortical bone 22?. Suture anchor 20 is inserted with a suture inserting device 58 that holds suture anchor 20 until suture inserting device 58 has entered spongy bone 22?. Deployment device 62 pushes suture anchor 20 from suture inserting device 58 into spongy bone 22?. Suture anchor 20 is positioned such that suture anchor 20 spans the hole 24 through which suture inserting device 58 inserted suture anchor 20.

Abstract: A microelectromechanical systems (MEMS) sensor device (184) includes a sensor portion (180) and a sensor portion (182) that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (270). The sensor portions (180, 182) can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (184). The sensor portion (180) includes one or more sensors (186, 188), and the sensor portion (182) includes one or more sensors (236, 238). The sensors (186, 188) are located inside the chamber (270) facing the sensors (236, 238) also located inside the chamber (270). The sensors (186, 188, 236, 238) are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.

Abstract: An apparatus includes multiple first reservoirs and multiple second reservoirs joined with a substrate. Selected ones of the multiple first reservoirs include a reducing agent, and first reservoir surfaces of selected ones of the multiple first reservoirs are proximate to a first substrate surface. Selected ones of the multiple second reservoirs include an oxidizing agent, and second reservoir surfaces of selected ones of the multiple second reservoirs are proximate to the first substrate surface.

Abstract: A device (20, 90) includes sensors (28, 30) that sense different physical stimuli. A pressure sensor (28) includes a reference element (44) and a sense element (52), and an inertial sensor (30) includes a movable element (54). Fabrication (110) entails forming (112) a first substrate structure (22, 92) having a cavity (36, 100), forming a second substrate structure (24) to include the sensors (28, 30), and coupling (128) the substrate structures so that the first sensor (28) is aligned with the cavity (36, 100) and the second sensor (30) is laterally spaced apart from the first sensor (28). Forming the second structure (24) includes forming (118) the sense element (52) from a material layer (124) of the second structure (24) and following coupling (128) of the substrate structures, concurrently forming (132) the reference element (44) and the movable element (54) in a wafer substrate (122) of the second structure (24).

Abstract: The present invention relates to the field of e-commerce and in particular to making purchases on-line using payment card, for example debit, charge or credit cards. The concept of the present invention adopts an alternative approach to security methods presently employed to protect cardholders. The concept obviates the need for a cardholder to transmit Card Numbers along with other purchasing details at the time of purchase and couples this with the use of a password feature. This renders the transaction akin to a Bank Cash withdrawal that Bank/card Schemes are totally happy with from a security point of view but are reluctant to allow e-commerce and/or any others access to their “network” to ensure Security.

Abstract: A method (104), operable on a processor platform (24), and a code module (38) facilitate navigation between webpages (34) of a website (32). The code module (38) is incorporated into the webpages (34), and is executed at the processor platform (24) when one of the webpages (34) is downloaded to the processor platform (24). Upon execution of the code module (38), a destination address (36) for the downloaded webpage (34) is obtained. When one or more keywords are detected in the destination address (36), a thread of navigation links (124) related to the keywords is generated and displayed within the current website. The navigation links (124) reference other webpages (34) of the website (32) pertinent to the current webpage (34), and these other webpages (34) can be downloaded when their associated navigation links (124) are activated.

Abstract: A transducer (20) includes sensors (28, 30) that are bonded to form a vertically integrated configuration. The sensor (28) includes a proof mass (32) movably coupled to and spaced apart from a surface (34) of a substrate (36). The sensor (30) includes a proof mass (58) movably coupled to and spaced apart from a surface (60) of a substrate (56). The substrates (36, 56) are coupled with the surface (60) of substrate (56) facing the surface (34) of substrate (36). Thus, the proof mass (58) faces the proof mass (32). The sensors (28, 30) are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors (28, 30) are subsequently coupled (90) utilizing a wafer bonding technique to form the transducer (20). Embodiments of the transducer (20) may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.

Abstract: An accelerometer (50, 100, 120, 130) includes a substrate (58) and a proof mass (54) spaced apart from a surface (56) of the substrate (58). Compliant members (62) are coupled to the proof mass (54) and enable the proof mass (54) to move parallel to the surface (56) of the substrate (58) in a sense direction (68). Proof mass anchors (60) interconnect the compliant members (62) with the surface (56). The accelerometer (50, 100, 120, 130) includes an over-travel stop structure (52, 102, 122, 132) having stop anchors (70, 72) coupled to the substrate (58). The stop anchors (70, 72) are coupled to the substrate (58) at positions (76) on the surface (56) residing at least partially within an anchor attach area (71) bounded in the sense direction (68) by locations (78) of the proof mass anchors (60) on the surface (56).

Abstract: A secure computing device (14) includes a secure processing section (30) having a tamper detection circuit (58) and a monotonic counter (68). The tamper detection circuit (58) detects an event which suggests that the trust associated with the secure processing section (30) may have been compromised. When such an event is detected, a security breach is declared and trusted software (38) is disabled. After a security breach is declared, the monotonic counter (68) may be reclaimed. The monotonic counter (68) provides a monotonic count value (70) that includes an LSB portion (80) and an MSB portion (82). The LSB portion (80) is obtained from a binary counter (72). The MSB portion (82) is obtained from a register (84) of independent one-time-programmable bits. The monotonic counter (68) is reclaimed by programming one of the one-time programmable bits to guarantee that future counting of the monotonic counter will be monotonic relative to all past counting.

Abstract: A transmitting unit (12) clips a communication signal (14) to form a threshold-responsive signal (36, 36?) which includes in-band distortion (40) and out-of-band distortion (38). A portion of the out-of-band distortion (38) is notched within rejection bands (48, 50) adjacent to the communication signal's bandwidth (24). But remaining portions of the out-of-band distortion (38) and portions of the in-band distortion (40) are included with the communication signal (14). The remaining portion of the out-of-band distortion (38) causes the communication signal (14) to be in violation of a spectral mask (30). The mask-violating communication signal 14 with out-of-band distortion (38) and in-band distortion (40) is amplified by an RF power amplifier (22). After amplification, a bandpass filter (92) exhibiting fast rolloff regions (110) attenuates the amplified out-of-band distortion (38) causing compliance with the spectral mask (30).

Abstract: An encryption apparatus (14) includes a secure processing system (12) in the form of an integrated circuit. The secure processing system (12) includes an on-chip secure memory system (30). The secure memory system (30) includes a non-volatile, read-only, permanent key register (62) in which a permanent cryptographic key (64) is stored. The secure memory system (30) also includes a non-volatile, read-write, erasable key register (56) in which an erasable cryptographic key (60) is stored. Symmetric cryptographic operations take place in an encryption engine (46) using an operating cryptographic key (68) formed by combining (96) the permanent and erasable keys (64, 60). A tamper detection circuit (70) detects tampering and erases the erasable key (60) when a tamper event is detected.

Abstract: A new measurement system, with two receiver channels per measurement port, has been developed that provides absolute magnitude and absolute phase relationship measurements over wide bandwidths. Gain ranging is used at RF to provide optimum noise performance and a swept YIG preselector filter is used to avoid spurious signals. A new absolute vector error correction method is used to calibrate the measurement system in order to allow for absolute vector measurements, and it also removes the time-varying responses caused by the swept YIG preselector filters. A quasi-reciprocal mixer with a characterized non-reciprocal ratio is used to provide the absolute calibration standard. The two receiver channels can be adapted to a wide variety of applications, including wide bandwidth vector signal analyzer measurements, mixer measurements, and harmonic measurements. The two-channels can also be used as an absolute calibrated transmitter/reflectometer.

Abstract: A MEMS capacitive device (90) includes a fixed capacitor plate (104) formed on a surface (102) of a substrate (100). A movable capacitor plate (114) is suspended above the fixed capacitor plate (104) by compliant members (116) anchored to the surface (102). A movable element (120) is positioned in spaced apart relationship from the movable capacitor plate (104) and has an actuator (130) formed thereon. Actuation of the actuator (130) causes abutment of a portion of the movable element (120) against a contact surface (136) of the movable plate (114). The abutment moves the movable plate (114) toward the fixed plate (104) to alter a capacitance (112) between the plates (104, 114). Another substrate (118) may be coupled to the substrate (100) such that a surface (126) of the substrate (118) faces the surface (102) of the substrate (100). The movable element (120) may be formed on the surface (126).

Abstract: An integrated passive device (20) includes a first wafer (22), a first integrated device (28) formed on a first surface (24) of the wafer (22), and a second integrated device (30) formed on a second surface (26) of the wafer (22), the second surface (26) opposing the first surface (24). A microelectromechanical (MEMS) device (72) includes a second wafer (74) having a MEMS component (76) formed thereon. The integrated passive device (20) and the MEMS device (72) are coupled to form an IPD/MEMS stacked device (70) in accordance with a fabrication process (90). The fabrication process (90) calls for forming (94) the second integrated device (30) on the second surface (26) of the wafer (22), constructing (100) the MEMS component (76) on the wafer (74), coupling (104) the wafers (22, 74), then creating the first integrated device (28) on the first surface (24) of the first wafer (22).