Abstract: A direct sequence spread spectrum (DSSS) transmitter (12) is configured to form “N” multiple excess-bandwidth channels (44) in an allocated bandwidth (54), where N is an integer. Each excess-bandwidth channel (44) includes a lower rolloff band (40), a minimum-bandwidth channel (38), and an upper rolloff band (42). The N excess-bandwidth channels (44) are placed in the allocated bandwidth (54) so that two of the rolloff bands (40, 42) reside within allocated bandwidth 54 and outside all of minimum-bandwidth channels 38 and so that N?2 of the rolloff bands (40, 42) predominately reside within adjacent minimum-bandwidth channels (38). The excess-bandwidth channels (44) substantially conform to EV-DO standards, and four of the excess-bandwidth channels (44) are supported for each 5 MHz of allocated bandwidth (54).

Abstract: A tube interface (53) includes a first tube (28) and a second tube (34). The first tube (28) has an oblong opening (54) exhibiting a first major dimension (58), and the second tube (34) has an oblong end (52) exhibiting a second major dimension (72). The oblong end (52) of the second tube (34) is inserted into the oblong opening (54) so that the second major dimension (72) is aligned with the first major dimension (58). The second tube (34) is turned in the oblong opening (54) to move the second major dimension (72) out of alignment with the first major dimension (58) of the oblong opening (54) to secure the second tube (34) to the first tube (28) prior to brazing.

Abstract: A grass treatment device height adjustment assembly for adjusting the height of a grass treatment tool above ground level includes a height adjustment mechanism and an elongate rotational element, such as a roller, having first and second ends. The rotational element has an axle extending substantially along the longitudinal axis of the element about which the element rotates. The height adjustment mechanism includes a rotatable member connected to the axle of the rotational element wherein the rotatable member is associated with a second fixed axis of rotation that is substantially parallel to but offset relative to the first rotational axis. The second axis of rotation enables the height adjustment mechanism to adjust the position of the first axis of rotation relative to the second axis of rotation.

Abstract: A microelectromechanical systems (MEMS) device (20) includes a polysilicon structural layer (46) having movable microstructures (28) formed therein and suspended above a substrate (22). Isolation trenches (56) extend through the layer (46) such that the microstructures (28) are laterally anchored to the isolation trenches (56). A sacrificial layer (22) is formed overlying the substrate (22), and the structural layer (46) is formed overlying the sacrificial layer (22). The isolation trenches (56) are formed by etching through the polysilicon structural layer (46) and depositing a nitride (72), such as silicon-rich nitride, in the trenches (56). The microstructures (28) are then formed in the structural layer (46), and electrical connections (30) are formed over the isolation trenches (56). The sacrificial layer (22) is subsequently removed to form the MEMS device (20) having the isolated microstructures (28) spaced apart from the substrate (22).

Abstract: A grass treatment device comprises: a first grass treatment element disposed towards a front portion of the device; a second grass treatment element disposed towards a rear portion of the device; a third grass treatment element disposed substantially between the first and second grass treatment elements, the third element being in the form of a grass cutting tool; and a fourth grass treatment element connectable at a position substantially between the first grass treatment element and the grass cutting tool, the grass treatment elements being elongate and having their longitudinal axes disposed substantially parallel to each other, the grass treatment device characterized in that the fourth grass treatment element is configured to be displaced from the position located between the first grass treatment element and the grass cutting tool in order to enable the first grass treatment element to substantially occupy the position.

Abstract: A clothing material or clothing article includes multiple first reservoirs and multiple second reservoirs joined with a substrate. Selected ones of the multiple first reservoirs include a reducing agent, and first reservoir surfaces of selected ones of the multiple first reservoirs are proximate to a first substrate surface. Selected ones of the multiple second reservoirs include an oxidizing agent, and second reservoir surfaces of selected ones of the multiple second reservoirs are proximate to the first substrate surface.

Abstract: An RF transmitter (10) includes an RF amplifier (22) that experiences gain-droop distortion as a result of self-heating. A heat compensator (20) is included to insert a gain boost of an amount which is the inverse of the gain droop experienced by the RF amplifier (22). The amount of gain boost is determined by generating a heat signal (88) from low-pass filtering (86) the squared magnitude (82) of a communication signal (14). The heat signal (88) is scaled by a weighting signal (68) estimated by monitoring the amplified RF signal (42) at the output of the RF amplifier (22). A nonlinear relationship section (96) then transforms the scaled signal into a gain-boost signal (94) that corresponds to the inverse of gain droop in the RF amplifier (22).

Abstract: A method (20, 104) for processing a panel (26, 128) during semiconductor device (52) fabrication entails forming grooves (72, 142) in a surface (34, 132) of the panel (26, 128) coincident with a dicing pattern (54) for the panel (26, 128). The grooves (72, 142) extend partially through the panel (26, 128) so that the panel (26, 128) remains intact. The grooves (72, 142) relieve stress in the panel (26, 128) to reduce panel (26, 128) warpage, thus enabling the panel (26, 128) to be reliably held on a support structure (88, 98, 138) via vacuum when undergoing further processing, such as solder printing (86). The method (20, 104) further entails, dicing (96, 152) through the panel (26, 128) from the surface (34, 132) in accordance with the dicing pattern (54) while the panel (26, 128) is mounted on the support structure (98, 138) to singularize the semiconductor devices (52).

Abstract: A stacked semiconductor device assembly (20) includes a device (24) having conductive traces (34) formed therein, and conductive interconnects (28) electrically connected to the conductive traces (34). Another device (26) has conductive traces (44) formed therein and device pads (54) formed on an outer surface (52) of the device (26). A method (120) entails attaching (84) a magnetic core (30) to an outer surface (42) of the device (24) and forming (92) the conductive interconnects (28) on the outer surface (42) using a stud bumping technique such that the interconnects (28) surround the magnetic core (30). The conductive interconnects (28) are coupled (126) with the device pads (54) using thermocompression bonding to couple the device (26) with the device (24) to form a continuous device coil (22) wrapped around the magnetic core (30) from an alternating electrical connection of the traces (34), the conductive interconnects (28), and the traces (44).

Abstract: A system-on-a-chip integrated circuit includes a multimedia module that produces rendered output data and a high-speed interface. A processing module generates output multimedia data in accordance with at least a portion of a multimedia application in response to input multimedia data received from either the multimedia module or the high-speed interface. The output multimedia data is provided to either the multimedia module or the high-speed interface. An on-chip DC-to-DC converter converts a battery voltage into a supply voltage that is coupled to the multimedia module, the high-speed interface, and/or the processing module.

Abstract: A sensor system (20) includes transducers (32, 34) each yielding an analog signal (37, 39) representing a parameter independently sensed by each of the transducers (32, 34). The signals (37, 39) are summed and the resulting transducer signal (46) is converted to a digital transducer signal (26) by a high resolution analog-to-digital converter (ADC) (48). Concurrently, one of the signals (37, 39) is subtracted from the other. The resulting difference signal (56) is converted to a digital difference signal (60) by a low resolution ADC (58). When the digital difference signal (60) is within a threshold window (78), a fault signal (28) indicates a normal condition (80) of the transducers (32, 34). When the signal (60) falls outside of the threshold window (78), a fault signal (28) indicates a fault condition (82) of the transducers. The transducer and fault signals (26, 28) are concurrently output from the sensor system (20).

Abstract: A method for managing operability of an on-chip debug capability (24) in a product (26) configured to execute software (30) includes storing (74, 76) a debug public key (40) and an operational public key (44) in product memory (54). The software (30) with either a debug signature (82) or an operational signature (88) is saved (84) in the memory (56). When enablement indication is received, the debug signature (82) is validated (102) using the debug public key (40). The debug capability (24) is enabled upon validation of the signature (82) and the software (30) is allowed to execute. When disablement indication is received, the operational signature (88) is verified (112) using the operational public key (44). The on-chip debug capability (24) is disabled upon verification of the signature (88) and the software (30) is allowed to execute.

Abstract: An integrated circuit (IC) module (20) includes a ground plane (22) having adjoining cutouts (30, 32). The cutout (32) defines a critical signal pathway (38). A device (24) is positioned in the cutout (30) and a device (26) is positioned outside of the cutout (30) adjacent to the cutout (32). An electrical interconnect (56) positioned in the critical signal pathway (38) interconnects the device (24) with the device (26). A method (60) of packaging the IC module (20) entails encapsulating the ground plane (22) and devices (24, 26) in a packaging material, and forming conductive vias (92) in the packaging material (84) that extend between the ground plane (22) and an exterior surface (94) of the packaging material (84). The conductive vias (92) surround the device (24) and cutout (32) to protect again electromagnetic interference and to provide guided signal pathways for high frequency signals on electrical interconnect (56).

Abstract: A dual-frequency conformal multi-filiar helical antenna system (20) provides a low-profile, low drag antenna useable in flying equipment. This antenna system (20) securely holds within its shell (22) signal distribution circuitry (64), signal combining circuitry (68), and any other circuit components necessary for antenna system (20) to communicate with other stations or devices. Antenna system (20) has radiating conductors (24, 32) tuned to two different frequencies such that simultaneous transmission and reception of signals is possible in the same and opposite directions.