Patents Represented by Attorney Morris, Manning & Martin
  • Patent number: 8246357
    Abstract: An electrical connector. In one embodiment of the present invention, the electrical connector includes a first main body, including a first insulating body and a first conductive member set fixed to the first insulating body, in which each conductive member of the first conductive member set includes a first internal connecting portion; and a second main body, including a second insulating body and a second conductive member set fixed to the second insulating body, in which each conductive member of the second conductive member set includes a second internal connecting portion, and the second internal connecting portion of each conductive member of the second conductive member set is in contact with the first internal connecting portion of the corresponding conductive member of the first conductive member set respectively.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: August 21, 2012
    Assignee: Lotes Co., Ltd
    Inventor: Qi Chen
  • Patent number: 8246555
    Abstract: The present invention relates to a method and system for monitoring sport related fitness by estimating muscle power and joint force of limbs, in which the system comprises a sensing module and a force/track detection module, wherein sensor values from the sensing module are fed to the force/track detection module to be used as base for estimating feature parameters and classifying a motion series relating to muscle power and joint force of limbs so as to obtain skill-related fitness parameters corresponding to the sensing of the sensor module.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: August 21, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Hsien Chiu, Chi-Chun Hsia, Pei-Jung Wang
  • Patent number: 8248192
    Abstract: A pulse activated magnetic trip/reset mechanism for a ground fault circuit interrupter, comprising: (i) a body, (ii) a ferrite core, (iii) a plunger, (iv) a ferrite surrounding, (v) a permanent magnet, (vi) a trip/reset coil, (vii) a reset spring positioned between a plunger block and the body, (viii) a first fixed contact holder having a first fixed contact point, and (ix) a first movable contact holder having a first movable contact point, wherein the first movable contact holder is attached to the body of the plunger such that when the plunger is in its first position (trip position), the first movable contact point is not in contact with the first fixed contact point, and when the plunger is in its second position (reset position), the first movable contact point is in contact with the first fixed contact point.
    Type: Grant
    Filed: January 11, 2010
    Date of Patent: August 21, 2012
    Assignee: General Protecht Group, Inc.
    Inventors: Juhai Hu, Yulin Zhang, Bin Liu, Jianning Jiang
  • Patent number: 8248563
    Abstract: A system for displaying images is provided including a liquid crystal display panel. The liquid crystal display panel has a plurality of sub-pixels, each defined between two adjacent data lines extending along a vertical direction and two adjacent scan lines extending along a horizontal direction. The liquid crystal display panel comprises a transparent bottom electrode on the data lines, and a transparent top electrode on the transparent bottom electrode, wherein the transparent top electrode has an extended portion at a corner of the sub-pixel, extending along the horizontal direction to overlap at least a portion of the data line.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: August 21, 2012
    Assignee: Chimei Innolux Corporation
    Inventors: Su-Jung Hsu, Shao-Wu Hsu
  • Patent number: 8248138
    Abstract: The present invention relates to a method and an apparatus, during a phase switching process, for choosing all of outputted phases upon the clock phases devoid of phase switching so as to avoid glitches during clock switching. Compared with the conventional approach for removing glitches by controlling a clock switching sequence, an improvement of a phase rotator is further disclosed in the present invention, which eliminates the glitches of the outputted phase clock so as to realize a glitch-less phase switching in a phase interpolation circuit.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: August 21, 2012
    Assignee: Realtek Semiconductor Corp.
    Inventor: Ye Liu
  • Patent number: 8246195
    Abstract: A light emitting diode (LED) side marker lamp, comprising a punching panel with a coating, a water-proof light source module, and a through hole. The water-proof light source module is disposed below the punching panel, and the through hole is disposed on the punching panel and operates to allow light to be emitted from the water-proof light source module. A traditional cover is not needed, and the punching panel is used to replace the cover and colors thereof match with those of buildings, which improves decoration effect of the invention; secondly, as the LED side marker lamp fails, only the water-proof light source module needs to be replaced, which is convenient for maintenance and reduces cost; finally, the number of light source modules can be varied, which is flexible in use.
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: August 21, 2012
    Assignee: Foshan Nationstar Optoelectronics Co., Ltd.
    Inventors: Xing Yan, Chuangda Nie, Shuguang Jin
  • Patent number: 8246360
    Abstract: An electrical connector with a plurality of solder balls arranged therein. In one embodiment, the electrical connector includes: an insulating body, wherein a plurality of receiving slots are formed through the insulating body, and at least one side surface of each receiving slot forms a stop wall; and a plurality of conductive terminals, received in the receiving slots. Each conductive terminal has a base, at least one fixing portion extends downwards from the base, and a soldering portion is bent laterally and extends from the fixing portion. The soldering portion includes a soldering arm and a hook portion bent and extending from a lower end of the soldering arm towards the stop wall. The solder ball is clamped between the soldering portion and the stop wall. The hook portion has at least one retaining point urging against a lower hemispherical surface of the solder ball.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: August 21, 2012
    Assignee: Lotes Co., Ltd.
    Inventors: Shang Ju Tsai, Yan Xian Yuan
  • Patent number: 8244132
    Abstract: A pre-compensation method for delays caused by optical fiber chromatic dispersion, a multi-sub-carrier signal generator applying the method, and a transmitter applying the signal generator are applicable to an optical orthogonal frequency-division multiplexing (OFDM) system. The pre-compensation method includes receiving a plurality of pre-compensation values, in which the pre-compensation values correspond to sub-carriers; and transmitting the sub-carriers after delaying the sub-carriers by time of the corresponding pre-compensation values. The delay time between the sub-carriers is estimated at a receiver end and a pre-compensation value of the transmitter is set according to the delay time. The transmitter delays the pre-compensation values respectively when transmitting the respective sub-carriers. Therefore, the respective sub-carriers are able to reach a receiver at nearly the same time, thereby achieving a purpose of pre-compensating for the delays caused by optical fiber chromatic dispersion.
    Type: Grant
    Filed: July 13, 2009
    Date of Patent: August 14, 2012
    Assignee: Industrial Technology Research Institute
    Inventor: Yu-Min Lin
  • Patent number: 8241604
    Abstract: A method for making a metal-titania pulp and photocatalyst is provided, including firstly acidically hydrolyzing a titanium alkoxide solution in presence of an alcohol solvent to get a colloidal solution; then, adding at least one metal salt solution into the colloidal solution to produce a nano-porous metal/titania photocatalyst under appropriate conditions by appropriate reaction. The nano-porous metal/titania photocatalyst thus prepared has excellent optical activity and is applicable in research of water decomposition with light to improve production efficiency of hydrogen energy. In addition, the photocatalyst is further processed in the form of powder or film to facilitate industrial application in wastewater treatment.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: August 14, 2012
    Assignee: Institute of Nuclear Energy Research Atomic Energy Council, Executive Yuan
    Inventors: Jen-Chieh Chung, Yu-Zhen Zeng, Yu-Chang Liu, Yun-Fang Lu
  • Patent number: 8242958
    Abstract: A system and method for positioning using signal transmit power, SNR of the signal receiving unit, signal receive PER or PLR, and distance relationship between the signal source and receiving unit. The system includes a ranging signal transmitting unit and receiving unit. The transmitting unit continuously transmits a fixed number of ranging signal packets using different transmit powers, and the receiving unit receives the ranging signal packets, collect statistics for the PLR at each transmit power, and calculates the distance between the transmitting unit and itself using the distance relationship. The present invention uses the reference signal source and the method for calculating relative distance to reduce the impact from the noise and environment changes on the positioning, and introduces the critical transmit power to further enhance positioning precision. With the method provided in the present invention, using a common active RFID tag achieves high precision and effective positioning.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: August 14, 2012
    Assignee: Westvalley Digital Technologies, Inc.
    Inventors: Jason Y. Liao, Changzheng Sun
  • Patent number: 8241055
    Abstract: A patch panel assembly and a patching module thereof are described. The patch panel assembly includes an outer frame and more than one patching module disposed on the outer frame. The patching module includes a registered jack (RJ) component and an insulation displacement contact (IDC) component which can be combined correspondingly, so that a plurality of RJ jacks and a plurality of IDC pins are electrically connected and assembled on the outer frame. The IDC component can further match two specifications of punch down tools to perform compression and wire bonding.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: August 14, 2012
    Assignee: Surtec Industries Inc.
    Inventor: Chou-Hsing Chen
  • Patent number: 8240323
    Abstract: A rain shielding device for an automobile includes an umbrella holder, an umbrella cloth, and a power accumulator. The umbrella holder includes a first edge column mounted on a vehicle door, a second edge column mounted on a vehicle body, a plurality of main umbrella sticks between the first edge column and the second edge column, and two interlock members. The umbrella cloth is covered on the umbrella holder. The power accumulator includes a movable member, a plurality of auxiliary umbrella sticks, and an energy-storing member. The interlock members move the movable member when the vehicle door opens, and then the movable member interacts with the auxiliary umbrella sticks to push the main umbrella sticks and umbrella cloth unfolding. The energy-storing member stores energy when the umbrella cloth unfolds and releases energy when the vehicle door is closed; thus provides an auxiliary force when the umbrella cloth folds/unfolds.
    Type: Grant
    Filed: December 25, 2008
    Date of Patent: August 14, 2012
    Assignee: Ann Show Co., Ltd.
    Inventor: Chih-Chung Lee
  • Patent number: 8244060
    Abstract: A noise suppression method for a digital image is described, which utilizes an adjacent area of a target pixel in the digital image to conduct a denoising process on the target pixel. The noise suppression method includes the following steps. A feature-weighted processing procedure is performed on each original pixel in the digital image to convert the original pixel into a feature-weighted pixel. According to a position of the target pixel in the digital image, a reference pixel is selected from a corresponding position in the feature-weighted image. Similarities of the reference pixel relative to the other feature-weighted pixels are respectively computed. Through the computed similarities, a feature-weighted pixel for compensation is selected from the feature-weighted pixels other than the reference pixel. Finally, noise suppression is performed on the reference pixel by using the feature-weighted pixel for compensation.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: August 14, 2012
    Assignee: Altek Corporation
    Inventors: Chung-Fang Chien, Che-Hung Lin
  • Patent number: 8235551
    Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: August 7, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Jian-Shian Lin, Chieh-Lung Lai, Hsiu-Jen Lin, Weng-Jung Lu, Yi-Ping Huang, Ya-Chun Tu
  • Patent number: 8235543
    Abstract: A compensation method for alleviating color shading in a digital image is adapted to correct a color shading phenomenon in a digital image that causes luminance differences between regions in the digital image.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: August 7, 2012
    Assignee: Altek Corporation
    Inventors: Che-Lun Chuang, Chung-Ta Wu
  • Patent number: 8236680
    Abstract: An article of manufacture comprising a nanowire and methods of making the same. In one embodiment, the nanowire includes a Ga-doped trace formed on a surface of an indium oxide layer having a thickness in nano-scale, and wherein the Ga-doped trace is formed with a dimension that has a depth is less than a quarter of the thickness of the indium oxide layer. In one embodiment, the indium oxide layer, which is optically transparent and electrically insulating, comprises an In2O3 film, and the thickness of the indium oxide layer is about 40 nm, and the depth of the nanowire is less than 10 nm.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: August 7, 2012
    Assignee: Northwestern University
    Inventors: Tobin J. Marks, Mark C. Hersam, Norma E. S. Cortes
  • Patent number: 8234949
    Abstract: A power transmission mechanism and a robot arm using the same are described. The power transmission mechanism at least includes a first power source, a second power source, a plurality of steel ropes, a support arm component, a stopping component and a joint component. The stopping component is disposed in the support arm component and includes a first stopping unit and a second stopping unit that rotate coaxially. The first and second power sources and the joint component are disposed at two ends of the support arm component. The first and second power sources transmit power via the first stopping unit and the second stopping unit through the plurality of steel ropes to drive the joint component to perform a two-degree-of-freedom motion. The support arm component and the joint component can be applied in an upper arm and an elbow of a robot arm, thereby constituting a multi-degree-of-freedom robot arm.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: August 7, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Wei Lung Pan, Chun Hung Huang, Hsiang Nien Chung
  • Patent number: 8235734
    Abstract: An electrical connector that includes: an insulating body, having a plurality of receiving holes disposed thereon, a plurality of solder balls, respectively received in one of the receiving holes, a plurality of terminals, in which each terminal has a base correspondingly received in one of the receiving holes, a first extending portion and a second extending portion extend downwards from the base, a first hook extends laterally from an end of the first extending portion, a second hook extends laterally from an end of the second extending portion, and the first hook and the second hook respectively hook a periphery of the solder ball under a horizontal center line of the solder ball.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: August 7, 2012
    Assignee: Lotes Co., Ltd
    Inventor: Ted Ju
  • Patent number: 8235572
    Abstract: A backlight module includes a reflector, a light-guiding sheet, a light-emitting element, and a plurality of first adhesive materials. The reflector has a reflecting surface and the light-guiding sheet is disposed on the reflecting surface. The light-emitting element is disposed on the reflecting surface and located beside the light-guiding sheet. The first adhesive materials are disposed between the reflecting surface and the light-guiding sheet, and adhere the reflecting surface, the light-guiding sheet, and the light-emitting element.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: August 7, 2012
    Assignee: Chunghwa Picture Tubes., Ltd.
    Inventors: Ching-Hsiu Hsu, Chin-Young Lin
  • Patent number: 8236687
    Abstract: A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid -solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time for performing a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110° C., and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200° C.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: August 7, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Hsiu-Jen Lin, Jian-Shian Lin, Shau-Yi Chen, Chieh-Lung Lai