Abstract: One embodiment disclosed relates to a method of detecting defects in a microminiature pattern repeated over a particular surface of an object. The method includes providing an image detector capable of resolving intensity data for each pixel of an array of m×n pixels of an image projected thereupon. An area of the surface of the object is illuminated with incident electrons, radiation from the illuminated area is detected, and image data from the detected radiation is retrieved into a data processor. If necessary, the image data is rotated for alignment purposes. The scale of the image data is then adjusted such that a dimension of a cell of the repeated pattern in the image data is equivalent to a distance across an integer number of pixels of the m×n pixel array. With the scale adjusted, then features in one cell of the repeated pattern are compared with features in another cell of the repeated pattern to detect said defects.

Abstract: One embodiment relates to a charged-particle beam apparatus. The apparatus includes at least a source for generating the charged-particle beam, a first deflector, and a second deflector. The first deflector is configured to scan the charged-particle beam in a first dimension. The second deflector is configured to deflect the scanned beam such that the scanned beam impinges telecentrically (perpendicularly) upon a surface of a target substrate. Other embodiments are also disclosed.

Abstract: In one embodiment, a sample of an integrated circuit device is prepared for observation in a transmission electron microscope (TEM). The sample may be placed on a surface formed by vertical edges of several TEM grids. The sample may be affixed to a vertical edge of one of the TEM grids. The TEM grid supporting the sample may be separated from the other TEM grids, and then placed in the TEM so that the sample may be observed.

Abstract: In one embodiment, a solar cell module comprises a plurality of solar cells interconnected as a solar cell array. An interconnect assembly electrically connects the backsides of two adjacent solar cells. The interconnect assembly may have an interconnect that electrically connects a contact point on a backside of a solar cell to a contact point on a backside of another solar cell. The interconnect assembly may further include an interconnect shield placed between the solar cells and the interconnect.

Abstract: One embodiment pertains to an apparatus which impinges a focused electron beam onto a substrate. The apparatus includes an irradiation source and at least two non-axisymmetric lenses. The irradiation source is configured to originate electrons for an incident electron beam. The non-axisymmetric lenses are positioned after the irradiation source and are configured to focus the beam in a first linear dimension so as to produce a linear crossover of the beam. The non-axisymmetric lenses are further configured to subsequently focus the beam in a second linear dimension, which is substantially perpendicular to the first linear dimension. Finally, the non-axisymmetric lenses are also configured to produce a focused image at an image plane. Other embodiments are also disclosed.

Abstract: An apparatus for selectively adjusting power levels of component signals of a wavelength division multiplexed signal. The apparatus comprises a first filter and a second filter. The first filter modulates the component signals according to a static attenuation profile, thereby providing coarsely modulated component signals. The second filter is coupled to the first filter to receive the coarsely modulated component signals and to modulate the coarsely modulated component signals according to a dynamic attenuation profile, thereby providing finely modulated component signals.

Abstract: One embodiment described relates to a multiple electron beam apparatus. Multiple columns are arranged in a row configured to generate multiple electron beams. A mechanism is included for translating a substrate so as to be impinged upon by the multiple electron beams. A direction of the substrate translation and a direction of the row of columns are at a skew angle.

Abstract: In a solar cell having p doped regions and n doped regions alternately formed in a surface of a semiconductor wafer in offset levels through use of masking and etching techniques, metal contacts are made to the p regions and n regions by first forming a base layer contacting the p doped regions and n doped regions which functions as an antireflection layer, and then forming a barrier layer, such as titanium tungsten or chromium, and a conductive layer such as copper over the barrier layer. Preferably the conductive layer is a plating layer and the thickness thereof can be increased by plating.

Abstract: In one embodiment, a self-aligned contact (SAC) trench structure is formed through a dielectric layer to expose an active region of a MOS transistor. The SAC trench structure not only exposes the active region for electrical connection but also removes portions of a stress liner over the active region. This leaves the stress liner mostly on the sidewall and top of the gate of the MOS transistor. Removing portions of the stress liner over the active region substantially removes the lateral component of the strain imparted by the stress liner on the substrate, allowing for improved drive current without substantially degrading a complementary MOS transistor.

Abstract: In one embodiment, a technique for configuring a network component in a computer network includes coupling the network component to a first computer and a second computer. The network component may be an appliance while the second computer may be a management server for the appliance, for example. A data unit, such as an Internet Protocol (IP) packet, can be sent from the first computer and the data unit can be observed by the appliance such that a source of the data unit may be determined. The source address of the data unit can then be adopted as an appliance address. Also, the appliance address may be forwarded from the appliance to the management server for registration. The appliance may be a transparent security appliance or device, for example. Among other advantages, the technique allows for plug-and-play accommodation of network components with good usability across different network configurations.

Abstract: In one embodiment, an antivirus mechanism builds an automaton of a virus using a pattern and a set of rules. The antivirus mechanism may then scan a binary file to detect an engine of the virus by matching the automaton with a plurality of disassembly codes derived from the binary file. The pattern may comprise a data structure including a name of a particular virus, and information for detecting the virus using the disassembly codes.

Abstract: One embodiment disclosed relates to the use of object motion estimation to interlace a progressive video sequence. One of a plurality of consecutive frames is segmented and motion vectors for each segment are determined though object motion estimation. Interpolated motion vectors are used to construct at least one intermediate frame, and interlaced fields are extracted from the new sequence of frames that includes intermediate frames. An interlaced sequence with smooth, incremental motion is thus constructed from a progressive video sequence.

Abstract: A light modulator and a method of manufacturing the same are provided having a continuously deformable optical surface. Generally, the modulator includes a substrate, a membrane disposed above and spaced apart from an upper surface of the substrate, the membrane having a continuously deformable light reflective surface formed on its upper side facing away from the upper surface of the substrate, and a means for deflecting the deformable surface relative to the substrate. Light reflected from different points of the deformable surface can interfere to modulate light reflected from the modulator in 0th order applications. In one embodiment, the membrane includes a static reflective surface surrounding the deformable surface. Light reflected from the static surface and the deformable surface can interfere to modulate light reflected from the modulator in non-0th order applications.

Abstract: One embodiment relates to a dynamic pattern generator for controllably reflecting charged particles. The generator includes at least a controllable light emitter array, an optical lens, and an array of light-sensitive devices. The controllable light emitter array is configured to emit a pattern of light. The optical lens is configured to demagnify the pattern of light. The array of light-sensitive devices is configured to receive the demagnified pattern of light and to produce a corresponding pattern of surface voltages. Other embodiments and features are also disclosed.

Abstract: One embodiment of the invention pertains to a method of determining a measure of image complexity. An image is subdivided the image into a plurality of small image regions. Multiple statistical tests are performed to determine the similarity of a pair of adjacent image regions. If said pair passes the multiple statistical tests, then the pair of adjacent image regions are grouped together into one new region. The resulting merged regions may be weighted according to geometry and/or color variance, and the weights may be summed to produce an image complexity measure.

Abstract: One embodiment disclosed is a method of detecting defects in objects. A selected surface area of an object is inspected with a multi-pixel electron microscope, and first set of data is generated having signal values representing image content of each pixel thereof. Further selected surface area of the object is inspected with said multi-pixel electron microscope, and second set of data is generated having signal values representing image content of each pixel thereof. Corresponding portions of first and second sets of data are stored in memory. Misalignment between stored portions of the first and second sets of data is detected with resolution of a fraction of a pixel, and the stored portions of first and second sets of data are aligned using subpixel interpolation to correct the detected misalignment therebetween. Finally, corresponding subportions of the aligned portions of first and second sets of data are compared to detect differences therebetween.

Abstract: A solar cell that is readily manufactured using processing techniques which are less expensive than microelectronic circuit processing. In preferred embodiments, printing techniques are utilized in selectively forming masks for use in etching of silicon oxide and diffusing dopants and in forming metal contacts to diffused regions. In a preferred embodiment, p-doped regions and n-doped regions are alternately formed in a surface of the wafer in offset levels through use of masking and etching techniques. Metal contacts are made to the p-regions and n-regions by first forming a seed layer stack that comprises a first layer such as aluminum that contacts silicon and functions as an infrared reflector, second layer such titanium tungsten that acts as diffusion barrier, and a third layer functions as a plating base. A thick conductive layer such as copper is then plated over the seed layer, and the seed layer between plated lines is removed.

Abstract: In one embodiment, a probe card for testing dice on a wafer includes a substrate, a number of cantilevers formed on a surface thereof, and a number of probes extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers project over cavities on the surface of the substrate. The probes have tips to contact pads on the dice under test. The probe card may include a compressive layer above the surface of the substrate with a number of holes through which the probes extend.

Abstract: In one embodiment, a probe card includes a substrate and a plurality of probes. Each of the probes may have a supported portion and an unsupported portion that meet at a base. The unsupported portion may have a non-uniform (e.g. triangular) cross-section along a length that begins at the base. The probes may be interleaved and fabricated using MEMS fabrication techniques.

Abstract: In one embodiment, a selective tungsten deposition process includes the steps of pre-flowing silane into a deposition chamber, pumping down the chamber, and then selectively depositing tungsten on a silicon surface. The silane pre-flow helps minimize silicon consumption, while the pump down helps prevent loss of tungsten selectivity to silicon.