Abstract: Method and apparatus for testing tires to measure the rolling resistance generated while a tire rolls under a radial load, the method including the steps of mounting two tires on spindles having substantially parallel axes; wherein the two tires are substantially equivalent and have substantially equal inflation pressures; loading a first one of the tires against a second one of the tires, tread-to-tread, at a predetermined tire-to-tire test load, then measuring a distance between axes of the two tire spindles; rotating one of the tires such that it rotates the other tire; measuring the total torque required to rotate the two tires at a predetermined rotation rate; and calculating the average rolling resistance of the two tires by dividing the value of total torque by the distance between the axes of the two tire spindles. Alternatively measure force at each spindle, equating each force to that tire's rolling resistance.

Abstract: A telescoping folding platform that is compact in the retracted and folded configuration and that is made rigid and locked in the unfolded and extended configuration by means of spring biased securements that are incorporated into the structures of the platform. The platform can be given numerous utilitarian embodiments by means of attachments that are locked in place in securements that are incorporated into the structures of the platform. When the attachments are wheels and a drawbar the platform is configured as a cart which has particular utility in off the road emergency rescue situations.

Abstract: A submount is used to mount a diode between two metal areas on the upper surface of a substrate. One of the areas is connected to a metal plate at the lower surface of the substrate through a via. The submount is clamped between two metal sheets. The top metal sheet has a through-hole for anchoring and self-aligning the diode. The electrodes of the diode are each coupled to one of the clamping metal sheets. Clamping metals provide pressure contact without soldering to the contact. But soldering can be alternatively used to enhance product reliability. Either the top metal sheet or the bottom metal sheet can be fully or selectively coating of solder for batch soldering at the contact point upon heating. The large metal plates and the large metal clamping sheets provide good heat sink and speedy soldering.

Abstract: A LED chip is bonded on a large submount serving as a heat sink. The submount is punched out from a thin metal sheet together with two other sections of lead frames for the LED and held together with insulating material. The planar structure makes the package thin. A transparent lens may be mounted over the submount. More than one LED of same or different color can be mounted on the submount.

Abstract: A vertical cavity semiconductor optical photoamplifer (VCSOA) is used as a modulating retro-reflector (MRR) as a pixel in an array. The boundary of the cavity in the VCSOA forms a mirror for reflecting an incident light as an amplified output.

Abstract: This invention describes an apparatus, Scanning Localized Evaporation Methodology (SLEM) for the close proximity deposition of thin films with high feature definition, high deposition rates, and significantly improved material economy. An array of fixed thin film heating elements, each capable of being individually energized, is mounted on a transport mechanism inside a vacuum chamber. The evaporable material is deposited on a heating element. The SLEM system loads the surface of heating elements, made of foils, with evaporable material. The loaded thin film heating element is transported to the substrate site for re-evaporation. The re-evaporation onto a substrate, which is maintained at the desired temperature, takes place through a mask. The mask, having patterned openings dictated by the structural requirements of the fabrication, may be heated to prevent clogging of the openings. The translation of the substrate past the evaporation site permits replication of the pattern over its entire surface.

Abstract: Apparatus and method are provided for enhancing the earth's dc magnetic field (14) and/or for restoring the earth's dc magnetic field (14), when the earth's dc magnetic field (14) has been degraded by steel construction, or has been degraded by either an extra-low-frequency or an rf magnetic field (96), in a living space (144). Magnetic-field enhancing/restoring apparatus includes beds (120), mattresses (314), bassinets (428), other seating furniture (370), office furniture (414), rooms (186), buildings (222), child-restraint seating (560), and vehicles (712). Apparatus and method also are provided for enhancing the earth's dc magnetic field in a body member (608) by use of body-worn apparatus (596). Magnetic-field enhancers/restorers include magnetic-field-enhancing coils (226) and magnetized sheets or pads (514).

Abstract: Alternate layers of wide band gap and narrow band gaps of different kinds of semiconductors are used to form multiple channels of a FET. The channels are doped or formed as 2-DEG/2-DHG in narrow band semiconductor by charge supply layer in the wide band gap semiconductor. The different kinds of semiconductors form heterojunctions to confine the electrons/holes in separate thin spikes layers. A number of spikes (3-10 nm thick) of different doped or 2-DEG/2-DHG concentrations in various channels can result in overall electron concentration gradient such as a 1/x3 electron/hole concentrations profile. Such an electron/hole concentration gradient can result in a linear variation of drain current with voltage to obtain a wide dynamic range.

Abstract: A light emitting diode (LED) includes a LED chip, which can transfer electrical power to electric-magnetic wave. A set of lead frame is enclosed by electrical isolator material to form a cavity. An optics lens seats on top of the cavity and is bonded to said electrical isolator material. A submount to carry said LED chip is soldered or adhered to the lead frame and forms the electrical contact from said LED chip to lead frame. A high transparency material is utilized to enclosed the LED chip.

Abstract: The leads of a light emitting diode are made coaxial. The inner lead protrudes lower than the outer lead. The package is inserted into a spongy display panel for power supply. The display panel has three layers: a lower conducting layer for contacting said inner lead and a top conducting layer for contacting said outer layer, and an insulating layer between the top and the bottom layer. For LED with a bottom electrode and a top electrode, the LED can be mounted on the planar tops of the inner lead and the top electrode wire bonded to the outer lead, or the LED can be mounted on the side surface of the inner lead and the top electrode wire bonded to the outer lead. For LED with two bottom electrode, the LED electrodes can straddle over the planar tops of the inner lead and the outer lead, or the LED electrodes can straddle over the telescopic side surfaces of the two leads.

Abstract: A control pad is split into two sections for output one of three signals selected from the group consisted of 00, 01, and 11 on an integrated circuit. Each section is internally connected to different voltage sources, say Vdd which represents logical “1”, or Vss which represents logical “0”, so that a default output is 1,0. When the split control pad is bonded with outside Vdd or Vss, both sections output “1,1” or “0,0” respectively. One of three possible logic word combinations can be selected to use for an IC.

Abstract: Heat from a heat generating device such as a CPU is dissipated by a heat sink device containing a recycled two-phase vaporizable coolant. The coolant recycles inside a closed metal chamber, which has an upper section and a lower section connected by a conveying conduit, and a wick evaporator placed in the lower section. The liquid coolant in the evaporator is vaporized by the heat from the heat generating device. The coolant vapor enters the upper section and condenses therein, with the liberated latent heat dissipated out through the inner top chamber wall. The condensed coolant is then collected and flows into the lower section, and further flows back to the wick evaporator by capillary action of the evaporator, thereby recycling the coolant. Space or a piece of element with parallel grooves is used to form at least one of the sections to reduce friction in the liquid flow path.

Abstract: The leads of a light emitting diode are made coaxial. The inner lead protrudes lower than the outer lead. The package is inserted into a spongy display panel for power supply. The display panel has three layers: a lower conducting layer for contacting said inner lead and a top conducting layer for contacting said outer layer, and an insulating layer between the top and the bottom layer. For LED with a bottom electrode and a top electrode, the LED can be mounted on the planar tops of the inner lead and the top electrode wire bonded to the outer lead, or the LED can be mounted on the side surface of the inner lead and the top electrode wire bonded to the outer lead. For LED with two bottom electrode, the LED electrodes can straddle over the planar tops of the inner lead and the outer lead, or the LED electrodes can straddle over the telescopic side surfaces of the two leads.

Abstract: Provided are radiofrequency identification (RFID) tag readers having visible light beams to visually indicate the location of an RFID tag. In one embodiment, the RFID reader can electronically determine the location of an RFID tag. The RFID reader has a visible laser scanner that is controlled to target the RFID tag, based on the electronic location data. Hence, the user will see a laser beam point toward the RFID tag location. In another embodiment, the RFID tag reader has a directional RF interrogating beam, and a visible light beam that overlaps with the RF interrogating beam. The visible light beam indicates the volume of space where the RFID tag reader can detect RFID tags. The size of the visible light beam can be adjusted to be bigger for more sensitive tags (e.g. active tags) or smaller for less sensitive tags. (e.g. passive tags), or adjusted for RF output power.

Abstract: In a direct conversion receiver with zero-frequency intermediate frequency (IF) signal, the DC offset and 1/f noise of the IF signal is compensated by means of double-sampling. The first period of the doubling-sampling is a calibration phase, which stores the DC offset and the 1/f noise. The second period is a signal flow phase during which the stored DC offset and 1/f noise is connected in opposition with the IF signal to cancel the DC offset and 1/f noise.

Abstract: A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip. wherein said supporting forms a cantilever over said first metallic contact and the overhanging end of the cantilever is glued to said second metallic contact.

Abstract: Shared-current electronic systems (120, 130, 140, 150, 160, 170, 180, 190, and 200) include two or more solid-state electronic devices, such as a solid-state amplifying device (Q1), a baseband processor (110), and a multiplier/up-converter (112), that are connected in dc series or dc series-parallel, that may be connected in rf series, and that either fixedly or variably share percentages of a dc source voltage. Various embodiments produce separate rf outputs, variably shift the phase of a single rf output, variably shift rf power between/among rf outputs, or produce a frequency-compressed modulation. The apparatus includes means (122, 162, 162A, and /or 162B) for precisely proportioning percentages of the regulated dc source voltage to the dc series-connected electronic devices irrespective of production variations in operating parameters of the electronic devices and/or drift of the electronic devices.