Abstract: An apparatus and corresponding method obtains time-integrated samples of fluid from the rumens of cattle, sheep, goats or other animals through a cannula. The apparatus allows ruminal fluid to be sampled under standard conditions. It reduces the labor required to obtain samples and allows dynamic fermentation patterns to be followed. The apparatus includes a ceramic filter connected to a sampling tube assembly. The filter is placed in the rumen and vented to atmosphere by a first tube. A second tube connects an inside region of the filter to a peristaltic pump which removes fluid for time-integrated sampling.

Abstract: A mold plate assembly for a patty-forming apparatus includes a reciprocating mold plate having patty-forming cavities, with at least two rows of cavities aligned in a longitudinal direction, and a fill plate arranged facing the mold plate. The mold plate reciprocates between a cavity fill position and a patty discharge or knock-out position. Fill slots are arranged through the fill plate to fill food product into said mold cavities when the mold plate is in the fill position. A valve plate is provided facing the fill plate and having valve openings corresponding to the fill openings of the fill plate. The valve plate is reciprocated between an open and a closed position, to fill food product into the mold cavities when the mold plate is in the fill position, and the valve plate is in an open position, or to prevent flow through the fill openings when the valve plate is in the closed position.

Abstract: A steering wheel console is provided that includes a sidewall with a recessed area. The recessed area carries air conditioning controls in a fashion that the controls do not extend outwardly of the recessed area. By locating the controls within the recessed area, the controls are substantially protected from being disturbed by interference from an operator's leg during entry and exit to/from the utility vehicle and during operation of the utility vehicle.

Abstract: An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

Abstract: A hand held implement includes a structure which is capable of automatic orientation in an upright position upon a horizontal surface. The structure includes a weighted base having a substantially rounded and convex exterior, and adapted to support the hand held implement vertically upon a horizontal surface. A working end portion of the implement is adapted for performing the desired task, such as for holding food, or for painting a surface, or for brushing teeth. A handle extends between the working end portion and the weighted base.

Abstract: A slicing machine including a slicing blade for slicing at least first and second product loaves disposed in a side-by-side arrangement using a single rotation of the slicing blade is set forth. A single rotation of the slicing edge about the center of rotation results in a penetration gradient into each of the first and second product loaves that diminishes in magnitude over the single rotation. To this end, the slicing edge may have a profile defined a plurality of constant radius sections. Each constant radius section has a section center defining the center of the constant radius for that constant radius section. Further, each constant radius section has a section center differing from the section center of an adjacent constant radius section. Such a blade and its associated slicing station provide great control of slices from the loaves as they proceed from the loaf to a receiving conveyor of the slicing station.

Abstract: A mold plate assembly for a patty-forming apparatus includes a reciprocating mold plate having patty-forming cavities, with at least two rows of cavities aligned in a longitudinal direction, and a fill hole located rearwardly of the cavities. The assembly includes a bottom fill plate and a top fill plate structure arranged facing opposite sides of the mold plate. The mold plate reciprocates between a cavity fill position and a patty discharge or knock-out position. Outlet slots are arranged through the top fill plate structure to deliver food product into said mold cavities when the mold plate is in the fill position. During filling of food product into the cavities, a pressurized food product flow distribution path is established through the bottom fill plate, through the fill hole of the mold plate, through the top fill plate structure, through the outlet slots and into the cavities.

Abstract: The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

Abstract: A patty forming machine includes a frame structure supporting a compartment which encloses a mechanical reciprocating device, the compartment having a front wall. A mold plate locate outside of the front wall includes cavities for receiving food product for the formation of patties. At least one drive rod having a circular cross-section penetrates the front wall and connects the mold plate to the reciprocating device. The machine also includes a vacuum bar assembly having a vacuum bar for interleaving flexible paper sheets with formed patties. The vacuum bar is driven by a reciprocating rod having a round cross-section and penetrating through the front wall of the housing to operatively connect the vacuum bar to the reciprocating device. The frame structure of the machine is underlied by a bottom skin which is spaced below a horizontal frame to provide an access gap for clear viewing and maintenance of a top of the bottom skin.

Abstract: A mold plate assembly for a patty forming apparatus includes a mold plate having patty forming cavities and a breather plate arranged facing the mold plate. A fill slot is arranged facing the mold cavities, on a side opposite the breather plate, to fill food product into said mold cavity when the mold plate is in a filling position. The breather plate includes first breather holes at a remote position from the inlet slot to discharge air to ensure an even and uniform filling of the food product into the cavity, and second breather holes located close to the fill slot to relieve filling pressure at that location to avoid the formation of a ridge on the finished formed food patty.

Abstract: An apparatus for processing a semiconductor wafer is set forth. The apparatus comprises a processing bowl that defines a processing chamber. The processing bowl is in fixed alignment with a frame. A wafer support structure adapted to support at least one wafer is mounted for rotation within the processing chamber. A motor drive assembly is disposed exterior to the processing chamber and connected to rotate the wafer support. The motor drive assembly includes an electrically driven motor and at least one shock absorbing member connected between the electrically driven motor and the frame. The electrically driven motor preferably includes a rotor shaft that rotates about an axis of rotation.

Abstract: A process for providing one or more protected copper elements on a surface of a workpiece is set forth. In accordance with the process, a barrier layer is applied to the workpiece. If the barrier layer is not suitable as a seed layer for subsequent electroplating processes, a separate seed layer is applied over the surface of the barrier layer. One or more copper elements are then electroplated on selected portions of the seed layer or, if suitable, the barrier layer. If used, the seed layer is then substantially removed. At least a portion of a surface of the barrier layer is rendered unplatable while leaving the copper elements suitable for electroplating. A protective layer is then electroplated onto surfaces of the one or more copper elements.

Abstract: A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy input of the electroanalytical technique. The method comprises a first step in which an electroanalytical measurement cycle of the target constituent is initiated by providing an energy input to a pair of electrodes disposed in the electroplating solution. The energy input to the pair of electrodes is provided for at least a predetermined time period corresponding to a time period in which the electroanalytical measurement cycle reaches a steady-state condition. In a subsequent step, an electroanalytical measurement of the energy output of the electroanalytical technique is taken after the electroanalytical measurement cycle has reached the steady-state condition.

Abstract: A method for use in the manufacture of a microelectronic device is set forth. The method include to a first step in which a workpiece including exposed metallized surfaces and residues is provided. The workpiece, including the exposed metallized surfaces, is then treated with an alkaline, water-based solution containing one or more components that form an additive layer of an anti-corrosive compound on the exposed metallized surfaces. The solution reacts with the residues and assists in removing them from the workpiece. When the surfaces are principally include of aluminum, the solution may be include of DI water, an ammonium hydroxide based component, such as TMAH, silicic acid, and aluminum hydroxide.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.

Abstract: The present invention provides semiconductor workpiece position sensors and methods of monitoring the position of a semiconductor workpiece. One embodiment of the invention provides a method of monitoring position of a semiconductor workpiece including providing a process module including a process container having a process fluid therein and a workpiece holder configured to support the semiconductor workpiece, moving the semiconductor workpiece toward the process fluid within the process container, applying a reference signal to the process module, and indicating position of the semiconductor workpiece with respect to the process fluid responsive to the reference signal.

Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip and forming a seal.

Abstract: A semiconductor processing workpiece support which includes a detection subsystem that detects whether a wafer or other workpiece is present. The preferred arrangement uses an optical beam emitter and an optical beam detector mounted along the back side of a rotor which acts as a workpiece holder. The emitted beam passes through the workpiece holder and is reflected by any workpiece present in the Workpiece holder. The preferred units include both an optical emitter and pair of detectors. The detection is preferably able to discriminate on the basis of the angle of the reflected beam, so that a portion of the beam reflected by the workpiece holder is not considered or minimized.