Abstract: The present invention provides for a semiconductor workpiece processing tool. The semiconductor workpiece processing tool includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool has a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
Type:
Grant
Filed:
July 15, 1996
Date of Patent:
March 20, 2001
Assignee:
Semitool, Inc.
Inventors:
Robert W. Berner, Daniel J. Woodruff, Wayne J. Schmidt, Kevin W. Coyle, Vladimir Zila, Worm Lund