Patents Represented by Attorney, Agent or Law Firm Rabine Berdo, P.C.
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Patent number: 8235510Abstract: An ink cartridge apparatus for continuously supplying ink is provided, including a connection device, an exposed chip socket and a filtering device on an ink cartridge main body. The connection device is for connecting to an ink bottle and the filtering device is for filtering the impurity from the ink flowing from the ink bottle into ink cartridge main body. The exposed chip socket is for the user to replace the chip more conveniently. With the ink supply mechanism of ink bottle into ink cartridge main body, the ink cartridge main body can maintain good ink quality and when the threshold set by the chip is exceeded, the replacement of the chip can be done without removing the entire ink cartridge from the printer so as to achieve the object of continuously supplying ink.Type: GrantFiled: January 15, 2010Date of Patent: August 7, 2012Assignee: Jetbest CorporationInventors: Yi-Ching Lu, Ming-Chung Peng, Yun-Hsuan Chen
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Patent number: 8235681Abstract: A first swash plate (30) and a second swash plate (40) are disposed on either side of a cylinder block (4), and a plurality of cylinders (6) are disposed in the cylinder block (4). A first piston (8) and a second piston (9) are inserted opposite to each other in each cylinder (6) such that the first piston (8) slides on the first swash plate (30) and the second piston (9) slides on the second swash plate (40). By providing a servo mechanism (33) that tilts the first swash plate (30) and a tilt linking mechanism (40, 70) that tilts the second swash plate (40) in conjunction with the tilting of the first swash plate (30), tilt angles of the two swash plates (30, 40) can be controlled by the single servo mechanism (33).Type: GrantFiled: March 14, 2008Date of Patent: August 7, 2012Assignee: Kayaba Industry Co., Ltd.Inventor: Takeo Shimizu
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Patent number: 8237221Abstract: The semiconductor device according to the present invention includes a semiconductor layer, a trench formed by digging the semiconductor layer from the surface thereof, a gate insulating film formed on the inner surface of the trench, and a gate electrode made of silicon embedded in the trench through the gate insulating film. The gate electrode has a high-conductivity portion formed to cover the gate insulating film with a relatively high conductivity and a low-conductivity portion formed on a region inside the high-conductivity portion with a relatively low conductivity.Type: GrantFiled: August 22, 2011Date of Patent: August 7, 2012Assignee: Rohm Co., Ltd.Inventors: Ryotaro Yagi, Isamu Nishimura, Takahisa Yamaha
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Patent number: 8230958Abstract: A vehicle cowl may be arranged on a side portion of a vehicle, and include a duct that extends in a vehicle width direction. The duct may have an inside opening and an outside opening. The inside opening may face inward, toward the vehicle body, and the outside opening may face outward from the vehicle. The cowl may further include a panel for covering a portion of the outside opening. The panel may be arranged so that, when the vehicle is viewed from the front, a portion of the outside opening left uncovered by the panel is shielded by a forward part of the panel, and thus not visible. The vehicle may be a motorcycle.Type: GrantFiled: October 28, 2008Date of Patent: July 31, 2012Assignee: Yamaha Hatsudoki Kabushiki KaishaInventors: Kuniyuki Takahashi, Katsumitsu Wakamatsu
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Patent number: 8232216Abstract: Provided are a semiconductor manufacturing apparatus and method, capable of reliably and rapidly transporting a heated semiconductor wafer. the apparatus is provided for transporting a semiconductor wafer, which has been processed by desired treatment (for example, film formation) and is held by a susceptor equipped with a heater, to the outside by a transport arm which holds the semiconductor wafer by suction, by moving the susceptor to a certain position above a top of a wafer waiting stage and introducing the semiconductor wafer held by the susceptor onto the top of the wafer waiting stage. Then, the susceptor present on the top of the wafer waiting stage is moved in a horizontal direction. After a certain cooling time, the transport arm holds the semiconductor wafer placed on the wafer waiting stage by suction and transports the semiconductor wafer to outside.Type: GrantFiled: June 8, 2010Date of Patent: July 31, 2012Assignee: Oki Semiconductor Co., Ltd.Inventors: Hiroyuki Baba, Tomoyasu Kai
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Patent number: 8230754Abstract: The present invention provides a safety unit comprising: a case; a rotary linkage disposed at one end thereof at the outside of the case and rotatably mounted at the other end thereof to the case; a force transfer shaft mounted to one side of the rotary linkage in such a fashion as to be oriented perpendicular to the rotating plane of the rotary linkage; a crank linkage rotatably mounted at one end thereof to the inner side of the case and adapted to abut against the force transfer shaft at the outer circumferential edge thereof so as to be transferred with an external force to be rotatably moved; and a support means rotatably connected to the other end of the crank linkage and adapted to allow for the rotation of the crank linkage when an external force having a value larger than a predetermined threshold value is exerted to the rotary linkage.Type: GrantFiled: August 11, 2006Date of Patent: July 31, 2012Assignee: Korea University Industry and Academy Cooperation FoundationInventors: Jae-Bok Song, Jung-Jun Park, Byeong-Sang Kim
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Patent number: 8232870Abstract: A vehicle control apparatus that informs that a smart key has been dropped at a location as proximate to a location of the dropping the smart key as possible while minimizing consumption of a battery of the smart key. A transmitting/receiving circuit transmits to the smart key a code request signal for confirming whether the smart key is disposed within a predetermined range of a motorcycle by a predetermined transmission period, and receive a code signal transmitted from the smart key receiving the code request signal. A code checking portion checks a code of a code signal received by the transmitting/receiving circuit. A control portion changes a period of transmitting the code request signal in accordance with a situation of running the motorcycle to detect dropping of the smart key.Type: GrantFiled: July 31, 2007Date of Patent: July 31, 2012Assignee: Yamaha Hatsudoki Kabushiki KaishaInventor: Akihiro Yoshizawa
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Patent number: 8231171Abstract: A folding chair comprises a cross folding supporting frame with two X-shaped cross folding bars. Each of the cross folding bars has a front and rear leg connected crossly to each other in the middle. The upper portions of the two front legs form a first upper portion and the upper portions of the two rear legs form a second upper portion. The seat has a first and second side which are parallel to each other. The first side is pivotally connected to the first upper portion of a cross folding supporting frame. A supporting bar is disposed in the bottom of the seat and can slide between the first side and the second side. The two ends of the supporting bar are connected to the second upper portion of the cross folding supporting frame. The chair folds by a supporting bar sliding along the bottom of the seat.Type: GrantFiled: November 7, 2008Date of Patent: July 31, 2012Assignee: New-Tec Integration (Xiamen) Co., Ltd.Inventor: Luhao Leng
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Patent number: 8227868Abstract: A semiconductor device according to the present invention includes a semiconductor substrate of a first conductivity type having a top surface and a rear surface, a semiconductor layer of a second conductivity type formed on the top surface of the semiconductor substrate, having a top surface and a rear surface, and having the rear surface in contact with the top surface of the semiconductor substrate, a body region of the first conductivity type formed in a top layer portion of the semiconductor layer, a first impurity region of the second conductivity type formed in a top layer portion of the semiconductor layer and spaced apart from the body region, a second impurity region of the second conductivity type formed in a top layer portion of the body region and spaced apart from a peripheral edge of the body region, a gate electrode formed on the semiconductor layer and opposed to a portion between the peripheral edge of the body region and a peripheral edge of the second impurity region, a field insulating fiType: GrantFiled: January 31, 2011Date of Patent: July 24, 2012Assignee: Rohm Co., Ltd.Inventor: Daisuke Ichikawa
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Patent number: 8228677Abstract: A second output wiring and a third output wiring enter into a chip mounting portion while coming across a second side and a third side of the chip mounting portion. The other end portions of the second output wiring and the third output wiring enter into the chip mounting portion are bent toward a fourth side of the chip mounting portion, and are connected to an output pad and an output pad provided along a fourth side of the semiconductor chip. An input wiring extends along the fourth side of the chip mounting portion, is bent from a midstream to enter into the chip mounting portion while coming across the fourth side of the chip mounting portion, and is connected to an input pad provided along the fourth side of the semiconductor chip.Type: GrantFiled: February 19, 2009Date of Patent: July 24, 2012Assignee: Lapis Semiconductor Co., Ltd.Inventors: Daisuke Kunimatsu, Takehiro Takayanagi
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Patent number: 8230254Abstract: A technology for rescuing an object when a failure occurs in a redundant system. In a synchronization memory, an instance of an object, which includes the virtual function discrimination information for discriminating a memory area where a virtual function corresponding to the object is stored, the class information for discriminating a class corresponding to the object, and the object data to be used for the processing of the object, is stored according to the order of the processing. In a function memory, plural kinds of virtual functions generated for each process to be carried out by the object are stored. When the object of a new active server reproduces the process, the class corresponding to this object is discriminated using the class information, and the virtual function discrimination information of this object is rewritten.Type: GrantFiled: March 29, 2006Date of Patent: July 24, 2012Assignee: Oki Electric Industry Co., Ltd.Inventor: Tomotake Koike
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Patent number: 8230315Abstract: A coding system in which the coding apparatus generates information bits and parity bits and transmits the parity bits and information bits selectively to the decoding apparatus. The decoding apparatus predicts the information bits, stores the predicted information bits, also stores the parity and information bits received from the encoding apparatus, combines the received information bits with the predicted information bits, and uses an error correcting decoder to decode the combined information bits and the stored parity bits. Combining the predicted information bits with received information bits improves decoding accuracy and enables the decoding apparatus to conserve computational resources.Type: GrantFiled: March 3, 2009Date of Patent: July 24, 2012Assignee: Oki Electric Industry Co., Ltd.Inventor: Takashi Nishi
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Patent number: 8227832Abstract: The present invention provides a multi-finger structure of a SiGe heterojunction bipolar transistor (HBT). It is consisted of plural SiGe HBT single cells. The multi-finger structure is in a form of C/BEBC/BEBC/.../C, wherein, C, B, E respectively stands for collector, base and emitter; CBEBC stands for a SiGe HBT single cell. The collector region is consisted of an n type ion implanted layer inside the active region. The bottom of the implanted layer is connected to two n type pseudo buried layers. The two pseudo buried layers are formed through implantation to the bottom of the shallow trenches that surround the collector active region. Two collectors are picked up by deep trench contact through the field oxide above the two pseudo buried layers. The present invention can reduce junction capacitance, decrease collector electrode output resistance, and improve device frequency characteristics.Type: GrantFiled: December 17, 2010Date of Patent: July 24, 2012Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.Inventors: Tzuyin Chiu, Zhengliang Zhou, Xiongbin Chen
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Patent number: 8228523Abstract: An image forming apparatus in which multiple image forming units for forming a developer image arranged along a prescribed medium feeding path are disposed in a manner to contact and face a belt component, the image forming apparatus includes an image formation driving unit for driving said multiple image forming units; a belt component driving unit for driving said belt component; and a drive control unit for supplying a drive command to said belt component driving unit and said image formation driving unit, said drive control unit sequentially initiating the driving of said image forming units from said image forming unit located downstream in the medium feeding path, after initiating the driving of said belt component drive unit.Type: GrantFiled: March 23, 2007Date of Patent: July 24, 2012Assignee: Oki Data CorporationInventor: Shuichi Fujikura
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Patent number: 8227922Abstract: A semiconductor device includes a lower layer wiring made of a conductive material; an etching stopper film laminated on the lower layer wiring and having a laminated structure including an SiCO layer and an SiCN layer; an interlayer insulating film laminated on the etching stopper film; an intermediate film laminated on the interlayer insulating film and made of a material having an etching selectivity with respect to a material of the etching stopper film; an upper wiring layer laminated on the intermediate film and having an upper groove formed in a top surface thereof; an upper layer wiring embedded in the upper groove and made of a metal material having Cu as a main component; and a via electrically connecting the lower layer wiring and the upper layer wiring and disposed in a via hole penetrating through the interlayer insulating film and the intermediate film.Type: GrantFiled: November 7, 2008Date of Patent: July 24, 2012Assignee: Rohm Co., Ltd.Inventor: Satoshi Kageyama
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Patent number: 8229055Abstract: The present invention relates to a top nozzle for a nuclear fuel assembly that has a two-stage elastic section such that a pushing force against the axial movement of the nuclear fuel assembly under normal conditions is optimized and at the same time a suppressing force against a drastic uplifting force of the nuclear fuel assembly under transient conditions is strengthened, and that lowers the elastic coefficients of the springs operating under normal conditions more than those of existing coil springs, thereby providing an optimal pushing force against the nuclear fuel assembly.Type: GrantFiled: January 8, 2008Date of Patent: July 24, 2012Assignee: Korea Nuclear Fuel Co., Ltd.Inventors: Joon-kyoo Park, Joon-hyung Choi, Kyu-Tae Kim, Jung-min Suh, Shin-ho Lee, Nam-gyu Park, Kyong-bo Eom, Jin-sun Kim, Jin-seok Lee, Seong-ki Lee
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Patent number: 8228132Abstract: A voltage-controlled oscillator robust against power supply includes: a regulating unit configured to maintain a virtual power supply of a VCO core circuit in a stable condition with regard to a reference voltage; and a power supply removal unit including second transistors configured to correspond to respective first transistors of the regulating unit, the power supply removal unit being configured to remove power noise of the virtual power supply by using negative feedback through a closed-circuit loop formed by each of the first and second transistors.Type: GrantFiled: May 13, 2010Date of Patent: July 24, 2012Assignee: Electronics and Telecommunications Research InstituteInventors: Young-Ho Kim, Je-Hoon Yun
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Patent number: 8227980Abstract: The organic EL device (1) comprises: a substrate (2); a light emitting unit formed on the substrate (2), and including an anode (11), a cathode (7) having anelectric resistance lower than that of the anode (11), an organic light emitting layer (6) formed between the anode (11) and the cathode (7); an anode terminal (12) formed on the substrate (2) and connected to the anode (11), and a cathode terminal (16) formed on the substrate (2) and connected to the cathode (7). A surface of the anode terminal (12) connected to the external is applied into an anode connecting surface (12a), and a surface of the cathode terminal (16) connected to the external is applied into a cathode connecting face (16a). The size (S1) of the anode connecting surface (12a) is larger than the size (S2) of the cathode connecting surface (16a).Type: GrantFiled: March 31, 2009Date of Patent: July 24, 2012Assignee: Rohm Co., Ltd.Inventors: Norifumi Kawamura, Kohichi Mori, Hideyuki Kobayashi, Hiroshi Takehisa
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Patent number: 8224142Abstract: A nano/micro-patterned optical device includes a soft film substrate and nano/micro thin wires. A surface of the soft film substrate includes a nano/micro-pattern formed through a lithography process, and the nano/micro-pattern includes a plurality of depressed grooves. The nano/micro thin wires are placed in the depressed grooves, and used to form a plurality of optical waveguides, in which the optical waveguides include at least one optical coupling region, and the optical coupling region is located on a joining position of the optical waveguides. A fabrication method of the nano/micro-patterned optical device is also provided.Type: GrantFiled: July 31, 2009Date of Patent: July 17, 2012Assignee: National Taiwan UniversityInventors: Lon Wang, Jian-Hong Chen, Shih-Min Chuo
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Patent number: D664355Type: GrantFiled: October 13, 2011Date of Patent: July 31, 2012Assignee: FTI Group (Holding) Company LimitedInventor: Jerry Moon