Patents Represented by Attorney Raymond J. Chew
-
Patent number: 7991278Abstract: A camera module includes a voice coil motor comprising a fixing assembly, a movable assembly, an elastic member connecting the movable assembly to the fixing assembly, and a pivoting member located between the fixing assembly and the movable assembly; a lens assembly and an image sensor received in the movable assembly; a plurality of Hall sensors capable of detecting movement distances of the movable assembly; and a control module comprising a current distributor, and a processor electrically connected to the Hall sensors. Wherein when shaking occurs, the housing is driven to move along the central axis and at the same time is rotated a desired angles pivoting on the pivoting member, the processor configured for calculating rotated angles of the movable assembly base on movement distances of the movable assembly relative to the respective Hall sensors.Type: GrantFiled: April 7, 2010Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Shun-Fan Chiang
-
Patent number: 7988899Abstract: An exemplary method for making a soft mold is provided. A transparent substrate is provided. A to-be-solidified film is formed on the transparent substrate. A stamper and a guiding plate are further provided. The guiding plate is positioned between the stamper and the to-be-solidified film. The stamper inserts one of the through holes of the guiding plate. The first alignment mark is aligned with one of the second alignment marks. The stamper is pressed into the to-be-solidified film. The pressed portion of the to-be-solidified film is solidified to obtain a second molding surface on the to-be-solidified film. The previous steps are repeated for the stamper and the rest of the through holes of the guiding plate to obtain a soft mold having a plurality of the second molding surfaces.Type: GrantFiled: June 26, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Sei-Ping Louh
-
Patent number: 7990707Abstract: An electronic device includes a fan including a frame, and an enclosure. The frame includes a plurality of mounting holes respectively positioned in a plurality of diagonal corners of the frame. The enclosure includes a plurality of sidewalls and a plurality of fixing members to fix the fan in the enclosure. Each of the plurality of fixing members projects from an inner surface of one of the plurality of sidewalls and is integrally formed with the sidewall. Each of the plurality of fixing members includes a clasping portion, and a cushioning portion between the clasping portion and the sidewall and having an angled shape. The plurality of cushioning portions are corresponding to the plurality of mounting holes and positioned between the fan and the sidewall.Type: GrantFiled: November 4, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Tzu-Hsiu Hung
-
Patent number: 7989225Abstract: A method for detaching a first material layer from a second material layer includes following steps. Firstly, a high-magnetic-permeability material layer is formed on a first material layer. Secondly, a second material layer is formed on the high-magnetic-permeability material layer. Thirdly, the first and second material layers are cooled such that the first and second material layers shrink, wherein the first and second material layers are low-magnetic-permeability materials. Finally, the high-magnetic-permeability material layer is heated by applying a high-frequency radiofrequency electromagnetic wave thereto such that the high-magnetic-permeability material layer expands, thus detaching the first material layer from the second material layer.Type: GrantFiled: January 26, 2010Date of Patent: August 2, 2011Assignee: Advanced Optoelectronic Technology, Inc.Inventor: Shih-Cheng Huang
-
Patent number: 7989697Abstract: A network communication device includes a top component and a bottom cover forming a receiving space there between when assembled. The top component further includes a top cover and a body. The body is configured attaches the top cover and the bottom cover. The assembly of the top cover and the bottom cover utilizes at least one locking tab assembly. Each locking tab assembly includes a locking tab and a reciprocal locking structure engaged with the locking tab. One of the locking tabs and the reciprocal locking structure of the one locking tab assembly are utilized to assemble the top cover and the body is disposed on a first planar surface of the top cover, and another one of the locking tab and the reciprocal locking structure of the locking tab assembly is disposed on the body.Type: GrantFiled: April 15, 2009Date of Patent: August 2, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Bin Huang, Chih-Yu Yeh, Shih-Chi Wong
-
Patent number: 7990886Abstract: A network device records a number of data packets transmitted between a partner network device and the network device in a detection cycle. According to the number of detection packets without corresponding response packets number at the end the detection cycle, and the number of unchanged of data packets when the number of the detection packets without corresponding response packets is not less than the preset value, the network device determines a connection status of the partner network device.Type: GrantFiled: July 27, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Wen-Kuang Lin
-
Patent number: 7988890Abstract: In a method for manufacturing a lens mold, a raw mold is provided. The raw mold defines a cavity therein. The cavity defines a raw molding surface. The raw molding surface includes a molding surface portion. The molding surface portion includes a center. Photoresist material is filled in the cavity, covering the molding surface portion. A photo mask is provided. The photo mask defines a through hole. The size through hole is the same as the molding surface portion of the lens mold. The photo mask is placed above the photoresist material with the through hole aligned with the center. The photoresist material is exposed and developed to form a photoresist portion. A rigid molding material is filled in the cavity. The resist portion is removed to expose the molding surface.Type: GrantFiled: June 30, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Sei-Ping Louh
-
Patent number: 7991277Abstract: A camera module includes a circuit board, an image sensor mounted on the circuit board, a lens module including a lens, a position sensor, a plurality of electrical wire groups mounted on the lens, and a plurality of magnetic field generators. The lens held a distance from the circuit board by holding wires fixed on the circuit board. The position sensor is mounted on the circuit board and configured for detecting displacements of the lens module and the image sensor relative to the object. The magnetic field generators are arranged adjacent to the respective electrical wire groups, and each configured for generating a magnetic field for allowing the electrical wire groups together with the lens to move to give a correction of the displacements of the lens, such that an image of an object is projected at a predetermined region of the image sensor.Type: GrantFiled: October 21, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chau-Yuan Ke
-
Patent number: 7990637Abstract: An autofocus lens module includes a holder defining a space, a barrel positioned in the space of the holder, a first post extended from an outer surface of the barrel, a first spring connecting adjacent ends of the barrel and the holder such that the barrel is maintained in the holder, and a first piezoelectric actuator. The first piezoelectric actuator is fixed on an internal surface of the holder and capable of deforming along a central axis of the holder. The first piezoelectric actuator is coupled with the first post so as to move the barrel along the central axis of the holder.Type: GrantFiled: April 28, 2010Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chia-Hung Liao
-
Patent number: 7990619Abstract: The present disclosure relates to a method for making a lens. In step 1, a first light pervious substrate and a second light pervious substrate are provided. The first light pervious substrate includes a first surface and an opposite second surface, and the second light pervious substrate includes a third surface and a fourth surface. In step 2, a first optically active part is formed on the first surface of the first light pervious substrate. In step 3, a second optically active part is formed on the third surface of the second light pervious substrate. In step 4, the fourth surface of the second light pervious substrate is attached to the second surface of the first light pervious substrate in such a manner that the first and the second optically active parts have a common optical axis.Type: GrantFiled: July 6, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Tai-Cherng Yu
-
Patent number: 7990806Abstract: A seismograph system includes a seismometer, a positioning unit, a transmitter, a remote processing device. The seismometer includes a micro electromechanical system (MEMS) accelerometer and a MEMS gyroscope. The seismometer, the positioning unit, and the transmitter being located at a detecting site. The MEMS accelerometer and the MEMS gyroscope are respectively configured for measuring an acceleration and an angular velocity of the movement of the earth at the detecting site. The positioning unit is configured for providing a location at the detecting site. The transmitter is configured for transmitting the measured acceleration, the measured angular velocity, and the provided location to the remote processing device. The remote processing device is positioned at a remote site and configured for analyzing recording the measured acceleration, the measured angular velocity, and the provided location.Type: GrantFiled: June 20, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Ga-Lane Chen
-
Patent number: 7989827Abstract: A multichip light emitting diode package is provided. The multichip light emitting diode (LED) package includes a substrate having a non-plane surface including a plurality of sectioned-surfaces, a plurality of light emitting diode chips and a transparent molding material. Each of the light emitting diode chips is disposed on one of the sectioned-surfaces of the substrate. The transparent molding material is formed on the substrate for encapsulating the light emitting diode chips. By way of the configurations of the non-plane surface of the substrate and the transparent molding material, the multichip light emitting diode package emits converging light in accordance with the Snell's law. The purposes of evenly mixing emitting lights and improving brightness are achieved. The present invention can provide a single color, multi-color or full-color multichip LED package with uniform brightness and hues.Type: GrantFiled: May 19, 2005Date of Patent: August 2, 2011Assignee: Advanced Optoelectronic Technology, Inc.Inventor: Chih-Peng Hsu
-
Patent number: 7988370Abstract: A camera includes a lens module, an image sensor, and a shutter module. The centers of the image sensor and the shutter module are on an optical axis of the lens module. The shutter module includes a frame and an electroactive telescopic unit having a first electroactive polymer layer, two compliant electrode layers, and two second electroactive polymer layers. The center of the electroactive telescopic unit has a through hole through the first electroactive polymer layer, the two compliant electrode layers, and the two second electroactive polymer layers. A central axis of the through hole and the optic axis of the lens module are coaxial. The electroactive telescopic unit is contractible or expandable along a direction perpendicularly to the optic axis of the lens module in response to a change in a voltage applied between the two compliant electrode layers.Type: GrantFiled: March 3, 2010Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Tai-Hsu Chou, Yuan-Hsu Chou
-
Patent number: 7990634Abstract: An exemplary lens module includes a substrate, a housing, a carrier, and a barrel. The housing is hollow, and disposed on the substrate. The carrier is received in the housing. The carrier defines a through hole. The barrel is received in the housing. The barrel includes a receiving body, a focusing portion, a connection portion, and a groove. The focusing portion is at a top end of the receiving body. The connection portion is at a bottom end of the receiving body. The groove spans from the top end of the receiving body to the connection body. The receiving body is received in the through hole of the carrier. The connection portion is mechanically connected to the carrier. A top end of the connection portion is exposed by the groove.Type: GrantFiled: December 28, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chun-Cheng Ko
-
Patent number: 7989149Abstract: An exemplary method for fabricating a mold core includes the following steps. First, an ultraviolet (UV) transmitting glass substrate is provided. Second, a photo resist layer is formed on the substrate. Third, the photo resist layer is exposed under a UV light and developed to form a plurality of spaced through holes therein. Fourth, the areas of the surface of the substrate under the through holes are etched to form a plurality of cavities. Fifth, each cavity is filled with a light-curable material, and the photo resist layer is removed. Sixth, the light-curable material is solidified to form a light-cured material block in each cavity. Lastly, the light-cured material block in each cavity is machined using an ultra-precision machine to form a molding surface of the light-cured material block. Thereby, the mold core with a plurality of the molding surfaces is obtained.Type: GrantFiled: August 14, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Sei-Ping Louh
-
Patent number: 7988443Abstract: A mold clearing tool includes a support portion and a draft portion. The support portion includes a bracket and two poles extending downward from two ends of the bracket. The bracket includes a second through hole defined therein. The draft portion includes a main body and a spiral draft end on one end of the main body. The spiral draft end is threaded outside. The draft portion is movably received through the second through hole for clearing excess material remaining in a molding chamber. The molding chamber includes a plurality of first through holes defined therein.Type: GrantFiled: May 31, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Hsin-Ho Lee
-
Patent number: 7986470Abstract: An annular aperture stop includes a first annular portion and a second annular portion. The first annular portion extends and slowly tapers towards the center of the aperture stop. The second annular portion extends inwards from the first portion and sharply tapers off to the innermost boundary of the aperture stop and defines a tapering angle. The radial thickness of the second portion is smaller than a predetermined tolerance of about 0.035 mm of the inner diameter of the aperture stop. The tapering angle is smaller than a predetermined threshold of about 70 degrees, whereby the innermost boundary of the aperture stop is protected from flashes during molding the aperture stop.Type: GrantFiled: March 5, 2010Date of Patent: July 26, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Hou-Yao Lin
-
Patent number: 7986533Abstract: A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.Type: GrantFiled: May 7, 2009Date of Patent: July 26, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Wen-Jia Ren, Xiao-Yan Qin
-
Patent number: 7985075Abstract: A micro electromechanical system connecter includes a u-shaped plug connecter and a socket connector. The plug connecter includes two opposite substrates and a spacing element sandwiched therebetween and positioned at one ends of the two substrates. Two parallel grooves are defined in outer surfaces of the two substrates at the other ends the two substrates. A plurality of parallel first electrodes formed on the outer surfaces of the two substrates and configured to extend along a direction perpendicular to grooves. The socked connecter includes a base having a top surface. A recess is defined in the top surface. Two protrusions are respectively formed on two internal walls of the recess adjacent to the entrance of the recess. A plurality of parallel second electrodes formed on the base according to the first electrodes. Each second electrode extends from the top surface of the base to one of the two internal walls of the recess.Type: GrantFiled: March 24, 2010Date of Patent: July 26, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Jen-Tsorng Chang
-
Patent number: D642316Type: GrantFiled: April 20, 2010Date of Patent: July 26, 2011Assignee: Foxconn Technology Co., Ltd.Inventors: Shi-Song Zheng, Lin Wen, Shih-Hsun Wung