Patents Represented by Attorney Raymond J. Chew
  • Patent number: 7863717
    Abstract: A package structure of an integrated circuit device comprises a copper foil substrate, an integrated circuit device, a plurality of metal wires and an encapsulation material. The copper foil substrate comprises an IC bonding area, a plurality of conductive areas and an insulating dielectric material. The integrated circuit device is mounted on the surface of the IC bonding area, and is electrically connected to the plurality of conductive areas through the metal wires. The insulating dielectric material is between the IC bonding area and the conductive areas, and is also between two adjacent conductive areas. In addition, the encapsulation material covers the IC bonding area, the conductive areas and the integrated circuit device.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: January 4, 2011
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shih Hsiung Chan, Shen Bo Lin, Pin Chuan Chen
  • Patent number: 7865330
    Abstract: A system and method for measuring a curve of an object includes aligning the ideal curve and the real point-cloud of the object, and defining a plurality of tolerance ranges for an area of a real curve of the object having a tolerance in a predetermined range. The method further includes determining a closest ideal point on the ideal curve corresponding to each real point in the real point-cloud, and assigning a serial number to each real point in the real point-cloud according to a sequence of the closest ideal points on the ideal curve. Furthermore, the method includes generating the real curve by connecting every two real points in the real point-cloud according to the serial number, and assigning a color to each line-segment according to the tolerance range in which two closest distances corresponding to two end-points of each line-segment fall.
    Type: Grant
    Filed: April 26, 2009
    Date of Patent: January 4, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chih-Kuang Chang, Xin-Yuan Wu
  • Patent number: 7859775
    Abstract: An exemplary lens module includes a lens barrel having a cavity defined therein and a groove defined in an inner sidewall thereof, and a deformable light blocking plate engaged in the groove of the lens barrel. The groove surrounds a central axis of the lens barrel. The deformable light blocking plate defines a central through hole therein for light passing therethrough.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: December 28, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Keng-Ming Chang
  • Patent number: 7855390
    Abstract: A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: December 21, 2010
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Jian Shihn Tsang, Wen Liang Tseng, Yao Te Tseng, Shih Hsiung Chang
  • Patent number: 7843656
    Abstract: An exemplary lens actuator includes a lens barrel, a plurality of convex stages and a plurality of stop mechanisms protruding out from a first end surface of the lens barrel, a coil wrapped around the lens barrel, a plurality of magnets, a bracket, and a resilient plate. The resilient plate includes an outer frame, an inner frame substantially coaxial with the outer frame, and a plurality of spring portions interconnected between the outer frame and the inner frame. The outer frame of the resilient plate is fixed on the first side of the bracket. The inner frame of the resilient plate is fixed on the plurality of convex stages. The plurality of stop mechanisms faces a surface of the outer frame and is configured for limiting a maximum travel of the lens barrel.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: November 30, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Yu-Bin Wang
  • Patent number: 7839250
    Abstract: A transformer includes a bobbin and a core assembly. The bobbin includes a pair of first winding portions to wrap primary winding coils thereon and a second winding portion between the pair of first winding portions to wrap secondary winding coils thereon. The core assembly includes a first core and a second core. At least one gap is formed between the first core and the second core at opposite sides of the second winding portion to adjust leakage inductance of the transformer. The gaps and the winding coils of the second winding portion are positioned in a same magnetic circuit, the magnetic circuit generating the leakage inductance of the transformer.
    Type: Grant
    Filed: May 10, 2009
    Date of Patent: November 23, 2010
    Assignee: Ampower Technology Co., Ltd.
    Inventors: Chih-Chan Ger, Chia-Kun Chen
  • Patent number: D627313
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: November 16, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao, Hong-Bin Yang
  • Patent number: D627315
    Type: Grant
    Filed: April 19, 2010
    Date of Patent: November 16, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao
  • Patent number: D627746
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: November 23, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Rong-Yih Yan, Hong-Bin Yang
  • Patent number: D627748
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: November 23, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chuang-Jian Li, Jun Chen, Jun Liu
  • Patent number: D627908
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: November 23, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chi-Chung Hu, Rong-Yih Yan, Ming-Young Shiao
  • Patent number: D627909
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: November 23, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chi-Chung Hu, Zheng-Jay Huang, Yu-Pin Liu
  • LED
    Patent number: D628167
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: November 30, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao
  • LED
    Patent number: D628168
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: November 30, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao
  • Patent number: D628327
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: November 30, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chi-Chung Hu, Hsin-Fei Huang, Yu-Pin Liu
  • Patent number: D628328
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: November 30, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Zheng-Jay Huang, Rong-Yih Yan, Ming-Young Shiao
  • Patent number: D629927
    Type: Grant
    Filed: April 5, 2010
    Date of Patent: December 28, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chin-Chung Chen, Shi-Yu Song
  • Patent number: D629928
    Type: Grant
    Filed: April 5, 2010
    Date of Patent: December 28, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chin-Chung Chen, Shi-Yu Song
  • Patent number: D629929
    Type: Grant
    Filed: April 5, 2010
    Date of Patent: December 28, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chin-Chung Chen, Shi-Yu Song
  • Patent number: D630776
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: January 11, 2011
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Zhong-Qing Wang, Chin-Chung Chen