Abstract: A package structure of an integrated circuit device comprises a copper foil substrate, an integrated circuit device, a plurality of metal wires and an encapsulation material. The copper foil substrate comprises an IC bonding area, a plurality of conductive areas and an insulating dielectric material. The integrated circuit device is mounted on the surface of the IC bonding area, and is electrically connected to the plurality of conductive areas through the metal wires. The insulating dielectric material is between the IC bonding area and the conductive areas, and is also between two adjacent conductive areas. In addition, the encapsulation material covers the IC bonding area, the conductive areas and the integrated circuit device.
Type:
Grant
Filed:
March 3, 2009
Date of Patent:
January 4, 2011
Assignee:
Advanced Optoelectronic Technology, Inc.
Inventors:
Shih Hsiung Chan, Shen Bo Lin, Pin Chuan Chen
Abstract: A system and method for measuring a curve of an object includes aligning the ideal curve and the real point-cloud of the object, and defining a plurality of tolerance ranges for an area of a real curve of the object having a tolerance in a predetermined range. The method further includes determining a closest ideal point on the ideal curve corresponding to each real point in the real point-cloud, and assigning a serial number to each real point in the real point-cloud according to a sequence of the closest ideal points on the ideal curve. Furthermore, the method includes generating the real curve by connecting every two real points in the real point-cloud according to the serial number, and assigning a color to each line-segment according to the tolerance range in which two closest distances corresponding to two end-points of each line-segment fall.
Type:
Grant
Filed:
April 26, 2009
Date of Patent:
January 4, 2011
Assignees:
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
Abstract: An exemplary lens module includes a lens barrel having a cavity defined therein and a groove defined in an inner sidewall thereof, and a deformable light blocking plate engaged in the groove of the lens barrel. The groove surrounds a central axis of the lens barrel. The deformable light blocking plate defines a central through hole therein for light passing therethrough.
Abstract: A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.
Type:
Grant
Filed:
May 9, 2008
Date of Patent:
December 21, 2010
Assignee:
Advanced Optoelectronic Technology, Inc.
Inventors:
Jian Shihn Tsang, Wen Liang Tseng, Yao Te Tseng, Shih Hsiung Chang
Abstract: An exemplary lens actuator includes a lens barrel, a plurality of convex stages and a plurality of stop mechanisms protruding out from a first end surface of the lens barrel, a coil wrapped around the lens barrel, a plurality of magnets, a bracket, and a resilient plate. The resilient plate includes an outer frame, an inner frame substantially coaxial with the outer frame, and a plurality of spring portions interconnected between the outer frame and the inner frame. The outer frame of the resilient plate is fixed on the first side of the bracket. The inner frame of the resilient plate is fixed on the plurality of convex stages. The plurality of stop mechanisms faces a surface of the outer frame and is configured for limiting a maximum travel of the lens barrel.
Abstract: A transformer includes a bobbin and a core assembly. The bobbin includes a pair of first winding portions to wrap primary winding coils thereon and a second winding portion between the pair of first winding portions to wrap secondary winding coils thereon. The core assembly includes a first core and a second core. At least one gap is formed between the first core and the second core at opposite sides of the second winding portion to adjust leakage inductance of the transformer. The gaps and the winding coils of the second winding portion are positioned in a same magnetic circuit, the magnetic circuit generating the leakage inductance of the transformer.