Patents Represented by Attorney Raymond J. Chew
  • Patent number: 7827702
    Abstract: A measurement device for measuring a distance between a center of a through hole defined in a panel and a side of the panel extending from an end of the panel includes a positioning member, a support member, and a measurement member. The positioning member and the measurement member are set on two ends of the support member. An inside surface of the positioning member resists the side of the panel. A distance between the inside surface and a center of the measurement member is about equal to a normal distance between the side and the center of the through hole. If an actual distance between the side and the center of the through hole meets a determined specification, the measurement member will enter into the through hole.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: November 9, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hong Hai Precision Industry Co., Ltd.
    Inventor: Bing-Jun Zhang
  • Patent number: 7830100
    Abstract: A system for driving a plurality of lamps may monitor the faults of the lamps by detecting the voltage variance of the first, second and third detecting resistors connected to the low voltage ends of the first and second secondary winding for providing the power to the lamps.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: November 9, 2010
    Assignees: Ampower Technology Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Tzu-Chiang Mi, Chih-Chan Ger, Chia-Kun Chen, Chi-Chang Lu
  • Patent number: 7828590
    Abstract: An electronic device includes an enclosure, a battery mounted the enclosure to supply power to the electronic device, a printed circuit board (PCB) mounted in the enclosure, at least one electrical connector attached to the PCB, and at least one contact probe. The enclosure includes a pair of sidewalls and at least one receiving hole defined in one of the pair of sidewalls. The electrical connector includes a fixing member including a hook located at a distal end thereof. The contact probe is received in the receiving hole to electrically connect the battery to the PCB, and includes a contact portion including a receiving groove defined at a distal end thereof. The hook is received in the receiving groove to electrically connect the contact probe to the PCB.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: November 9, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chung-Gi Hsu
  • Patent number: 7824942
    Abstract: A method of fabricating a photoelectric device of Group III nitride semiconductor comprises the steps of: forming a first Group III nitride semiconductor layer on a surface of an original substrate; forming a patterned epitaxial-blocking layer on the first Group III nitride semiconductor layer; forming a second Group III nitride semiconductor layer on the epitaxial-blocking layer and the first Group III nitride semiconductor layer not covered by the epitaxial-blocking layer and then removing the epitaxial-blocking layer; forming a third Group III nitride semiconductor layer on the second Group III nitride semiconductor layer; depositing or adhering a conductive layer on the third Group III nitride semiconductor layer; and releasing a combination of the third Group III nitride semiconductor layer and the conductive layer apart from the second Group III nitride semiconductor layer.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: November 2, 2010
    Assignees: Zhanjing Technology (Shen Zhen) Inc., Advanced Optoelectronic Technology, Inc.
    Inventors: Po Min Tu, Shih Cheng Huang, Wen Yu Lin, Chih Peng Hsu, Shih Hsiung Chan
  • Patent number: 7817916
    Abstract: A camera module includes a substrate, an image sensor, a shell, and at least two lens modules. The image sensor comprises at least two image sensor portions connecting with each other via a connecting portion. The at least two image sensor portions are mounted on the substrate. The connecting portion is separated from the substrate. The shell is mounted on the substrate and has a chamber for receiving the image sensor. The lens modules are each mounted in the shell corresponding to the image sensor portions. The lens module captures and transmits images to the image sensor portion of the image sensor.
    Type: Grant
    Filed: May 31, 2009
    Date of Patent: October 19, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Tsung-Yu Lin
  • Patent number: 7811843
    Abstract: A method of manufacturing an LED includes the following steps: preparing an LED wafer including a substrate and an epitaxial layer formed on the substrate; cutting the epitaxial layer of the LED wafer into a plurality of LED dies with a gap defined between every two neighboring dies; filling an electrically insulating material in each gap between neighboring LED dies such that the neighboring LED dies are separated from each other by the insulating material; providing a circuit board having a layer of anisotropic conductive adhesive coated thereon; pressing the LED dies against the adhesive to bring the top surfaces of the LED dies into contact with the adhesive such that the LED dies each are electrically connected to the circuit board via the adhesive; and encapsulating the LED dies with a light penetrable material.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: October 12, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chih-Chen Lai
  • Patent number: D625168
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: October 12, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Wei-Hsi Chen
  • Patent number: D625438
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: October 12, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao
  • Patent number: D625439
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: October 12, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao
  • Patent number: D625458
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: October 12, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventor: Yu-Pin Liu
  • Patent number: D626099
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: October 26, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chien-Ju Huang
  • Patent number: D626100
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: October 26, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Tsung-Yuan Huang
  • Patent number: D626264
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: October 26, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventor: Yu-Pin Liu
  • Patent number: D627311
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: November 16, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao, Hong-Bin Yang
  • Patent number: D627312
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: November 16, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao, Hong-Bin Yang
  • Patent number: D627314
    Type: Grant
    Filed: April 14, 2010
    Date of Patent: November 16, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao, Hong-Bin Yang
  • Patent number: D627379
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: November 16, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chiao-Ling Peng, Shan-Ju Lin
  • Patent number: D627495
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: November 16, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chih-Ming Lai, Ming-Young Shiao
  • Patent number: D627499
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: November 16, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventors: Chi-Chung Hu, Zheng-Jay Huang, Yu-Pin Liu, Hong-Bin Yang
  • Patent number: D627505
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: November 16, 2010
    Assignee: Foxsemicon Integrated Technology, Inc.
    Inventor: Yu-Pin Liu