Abstract: Gas flow structures are described for the inputting and exhausting of gases for a continuous vapor deposition reactor to cause an even flow of gases within the reactor chamber and to prevent the deposition of reaction material on the walls of the reactor chamber. Gas inlet and exhaust port structures are provided for multiple-chamber chemical vapor deposition reactors having gas input and exhaust junctions, wherein the ports may include, in order to provide uniform flow, baffles or a plurality of orifices with or without shutters. Two vertically spaced gas inlets may be used, wherein gas from a second inlet prevents deposition on the reactor chamber from gases introduced through the first inlet.

Abstract: A track system is used in a continuous chemical deposition reaction system to guide semiconductor wafer carriers through a plurality of interconnected reaction chambers to position the carriers in each reaction chamber, and to prevent wear to the bottom of the reactor chambers.

Abstract: Trace quantities of elemental iodine are added to deionized water used in the manufacture of semiconductor materials and devices in order to sterilize the water and the delivery system of microscopic life forms, and to leave the iodine in the flow all the way through processing except for those process steps where iodine may be detrimental to the process step.

Abstract: An interconnection device is disclosed that is connected between a semiconductor device to be tested and the tester to match the device output impedance with the load applied to the semiconductor device and to prevent reflection on input waveforms in propagation delay measurements.

Abstract: A processing apparatus and method for anisotropically etching thin film metal (e.g. tungsten) under plasma bombardment conditions by using a feed gas mixture which includes a fluorine source (such as SF.sub.6) plus a bromine source (such as HBr), plus a very weak oxygen source (e.g. carbon monoxide). This chemistry provides anisotropic high rate fluoro-etching with good selectivity to photoresist.

Abstract: A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilizes a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.

Abstract: A processing apparatus and method utilizing a single process chamber to deposit a layer of doped or undoped silicon dioxide utilizing a silicon source and a dopant gas and a remote plasma from an oxygen source and a source of additional ultraviolet light.

Abstract: A processing apparatus and method utilizing a single process chamber for deposition of silicon nitride with a silicon source, a remote plasma including a nitrogen source, additional ultraviolet energy coupled into the process chamber to provide additional molecular excitation of the silicon source.

Abstract: A processing apparatus and method for performing a descum process (i.e. a process for removal of polymers and other organic residues) which uses a remote plasma, supplied through a distributor which includes a two-stage showerhead, to achieve improved results.

Abstract: The disclosure relates to the use of metastable state of mixed gases which, when appropriately mixed, provide better control of current and voltage conditions and subsequent arc formation properties in making balls of aluminum, copper and gold with an electronic flame-off method. The specific mixtures involve inert argon mixed with small amounts of hydrogen and neon. Exceptionally well controlled balls of uniform size result.

Abstract: A manufacturing system has a material handling system that uses free roaming mobile apparatuses that are under the control of a visual navigation system that has the capability of regenerating images that are temporarily obstructed from view of a visual navigation system. The visual navigation system uses the images to provide commands that navigate an electrical controllable apparatus such as a mobile robot. The mobile robot is fitted with a minimum of three navigation beacons which emit a light visible to overhead television cameras. The beacon area is arranged so as to form a triangle. The shape and dimension of the triangular pattern is measured and stored in a memory unit within the visual navigation system. When a beacon is blocked from view of the television cameras, the visual navigation will regenerate coordinate of the blocked beacon and provide the necessary navigation commands to the mobile apparatus.

Abstract: A controllable mobile apparatus such as a mobile robot travels to a commanded destination under the control of a guidance system that provides speed and direction commands to the controllable mobile apparatus. A plurality of wheels carry the mobile apparatus to the commanded position in response to the speed commands from the guidance system. Steering commands will cause the selected members of the plurality of wheels to vary their angles by a predetermined amount in response to the steering commands that are provided by the guidance system. Additionally, a braking system is provided for stopping the controllable mobile apparatus when it encounters loss of power or communications with the guidance system.

Abstract: An elastic buffer for absorbing frequency jitter or drift of an incoming data signal which includes a serial stack of data register. These data registers are used for storing data bits from an incoming data stream one at a time with each bit adjacent a next earlier bit at a frequency equal to the frequency of the incoming data and also for releasing stored bits onto an output data line. The stored bits are released one at a time at a predetermined fixed rate equal to the average frequency of incoming data from a number of registers away from the register into which data is being written which depends on the frequency difference between incoming data and the fixed rate aforesaid.

Abstract: A processing apparatus and method for depositing doped or undoped polysilicon on a wafer utilizing a single process chamber to heat the wafer, provide a silicon comtaining gas, and if desired, an appropriate dopant gas to the chamber with the excitation energy being provided by either or both of a remotely generated plasma form and illumination of the wafer with an in situ generated ultraviolet energy.

Abstract: A communication system for a mobile apparatus includes a means for communicating commanded destination to the mobile apparatus. The mobile apparatus includes a plurality of beacons that are used for both communicating with a master station and as a means of locating the mobile apparatus by the master station. The location of the mobile apparatus is used to generate commands which are transmitted to the mobile apparatus by light emitting diodes such that the light emitting diodes mounted on the mobile apparatus are used for both navigation purposes and communication.

Abstract: The disclosure relates to a gripper arm for use in conjunction with a robotic arm for gripping a tool wherein the tool is retained in the gripper arm until a positive action signal and lack of pressure from the tool are simultaneously provided. The tool cannot be discharged from the gripper arm under other conditions including power loss to the robotic device.

Abstract: A processing apparatus and method for edge-preferential processing of partially fabricated integrated circuit wafers or of other substantially flat and thin workpieces. A plasma remote from the workpiece is used to generate activated species, and a baffle which is in proximity to the wafer face but not in contact with it is used to direct the stream of activated species. This module can be set up to perform both edge bead removal and bake of spun-on photoresist.

Abstract: A method of plating bumps on metallization on the face of a wafer, including the steps of placing the wafer in a transportable fixture wherein cathode needles press against the face of the wafer to make electrical contact and to force the back side of the wafer against a sealing member to prevent the plating bath from contacting the back side. The fixture with the wafer therein is placed in a clean up or presoak bath and is then transported to a plating bath without an operator having to touch the wafer.

Abstract: A thin film etching process, wherein the rate of deposition of a robust sidewall passivant is controlled so that passivants can be continually deposited on the sidewalls of the resist pattern to change the geometry of the resist pattern during the processing step. That is, the existing pattern is modified as if a sidewall filament has been deposited on it, which can be advantageous for many purposes, without the added process complexity required by a sidewall filament process.

Abstract: A process module which is compatible with a system using vacuum wafer transport in which wafers are generally transported and processed in a face down position under vacuum, and which also includes an additional wafer movement, wherein, after a wafer has been emplaced face down, in a position where it can be clamped against the susceptor, the susceptor is rotated from its approximately horizontal position up to a more nearly vertical position. In the more nearly vertical position, the wafer can be processed by a top process module, which may be, e.g., a sputter system, an implanter, or an inspection module. Another process module is included in the bottom part of the chamber, so that the wafer can be processed by the lower process module while in its substantially horizontal position and processed by the upper process module when it is in its more nearly vertical position. This is especially advantageous when the lower process module is a plasma cleanup module and the top module is a deposition module.