Abstract: A system for machining and for verifying the machining of substrates includes an energy beam located to impinge upon machined features of the substrates and a photodiode switching circuit matrix for detecting those portions of the energy beam which impinge upon the machined features of the substrate. The photodiode switching circuits include a current boost resistor in parallel with the photodiode which allows greater current to flow through the output diode, thereby increasing its switching speed. Pairs of photodiode circuits of the array are sequentially energized so that dual strings of outputs are produced. These outputs are then multiplexed and digitized. The digital outputs are compared in a verifier controller with a predetermined set of data to determine accuracy of the machining process. Substrates to be machined and verified can be mounted on a single X-Y table so that the machining and verification processes can be accomplished simultaneously.

Abstract: Self-aligning process for fabricating a semiconductor structure and stud therefor on a semiconductor substrate comprises depositing a first material onto the substrate, depositing a second material onto the first material, removing excess portions of second material so as to form openings through the second material exposing excess portions of first material, whereby a selected portion of second material is retained and forms a sacrificial element, removing the excess portions of first material selectively to the substrate so as to extend the openings through the first material to the substrate, whereby a selected portion of first material is retained and forms the semiconductor structure, filling the openings with an insulating material, removing the sacrificial element selectively to the insulating material and the semiconductor structure for forming a contact window opening for allowing access to the semiconductor structure, and filling the contact window opening with stud material so as to contact the sem

Abstract: Substrate handling apparatus includes a trigger handle which forms a trigger-like mechanism with a handle grip. The trigger handle is interconnected with activation means such that application of pressure on the trigger handle activates the activation means.

Abstract: A contact stud for semiconductor structure is fabricated by providing a semiconductor substrate having an alignment structure, which includes a sidewall, and the semiconductor structure formed thereon, forming a sidewall spacer contiguous with the semiconductor structure and the sidewall of the alignment structure, depositing an insulating layer contiguous with the sidewall spacer so as to insulate the semiconductor structure, etching the sidewall spacer selectively to the sidewall of the alignment structure, the semiconductor structure and the insulating layer forming a contact window opening for allowing access to the semiconductor structure, and backfilling the contact window opening with a conductive material so as to contact the semiconductor structure for forming the stud.

Abstract: A system for machining and for verifying the machining of substrates includes an energy beam located to impinge upon machined features of the substrates and a photodiode switching circuit matrix for detecting those portions of the energy beam which impinge upon the machined features of the substrate. The photodiode switching circuits include a current boost resistor in parallel with the photodiode which allows greater current to flow through the output diode, thereby increasing its switching speed. Pairs of photodiode circuits of the array are sequentially energized so that dual strings of outputs are produced. These outputs are then multiplexed and digitized. The digital outputs are compared in a verifier controller with a predetermined set of data to determine accuracy of the machining process. Substrates to be machined and verified can be mounted on a single X-Y table so that the machining and verification processes can be accomplished simultaneously.