Abstract: A method for determining the effective quantity of an organic additive in an electroplating bath involving passing an inert electrode through a predetermined sequence of voltammetric steps including a step of plating the electrode at a given applied potential, stripping the plated metal at a given applied potential, and conditioning the inert electrode without applied potential; correlating the quantity of additive with the coulombs utilized during the metal stripping step; and using the same predetermined sequence of voltammetric steps for a bath having an unknown quantity of additive.

Abstract: A method for determining the effective quantity of an organic additive in an electroplating bath involving passing an inert electrode through a predetermined sequence of voltammetric steps including a step of plating the electrode at a given applied potential, stripping the plated metal at a given applied potential, and conditioning the inert electrode without applied potential; correlating the quantity of additive with the coulombs utilized during the metal stripping step; and using the same predetermined sequence of voltammetric steps for a bath having an unknown quantity of additive.

Abstract: A method and composition for treating dry eye. The method comprises addition of a positively or negatively charged, complex phospholipid to the ocular surface of the eye. The phospholipid is desirably added in a treatment composition, preferably in the form of an aqueous emulsion. It is believed that the phospholipid component of the treatment composition permits replication of a tear film.

Abstract: The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and photoimaging of permanent dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using photoimaging techniques.

Abstract: A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.Also disclosed is a device for measuring throwing power of a plating solution. The device comprises two anodes and a cathode suspended in a chamber adapted to contain a plating solution. The cathode is suspended between said anodes and comprises two flat electrode portions in electrical contact with each other, in parallel relationship to each other and spaced apart from each other to define a space containing plating solution.

Abstract: A process for improving the corrosion resistance of an iron or steel part having a phosphate conversion coating, said method comprising contact of said part with a solution containing ions selected from the group of cobalt ions and nickel ions. Preferably, the solution also containing stannous ions. Contact may be by immersion or spraying.

Abstract: A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating adjacent to and in contact with conductive areas. In a preferred embodiment, the catalytic metal chalcogenide conversion coating is formed by treating the article with an acid colloidal solution of a tin-noble metal electroless metal plating catalyst and, subsequently, treating with a solution containing a dissolved sulfide to form a sulfide of the noble metal. The conversion coating allows the article to be directly electroplated. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

Abstract: A lithographic process analysis and control system which provides a modeled verison of a lithographic process in the dimensions of feature width, focus and exposure. This system uses the model to quickly determine the range of focus and exposure limits for obtaining the desired feature width. The system has flexible graphic display capability for displaying graphic representations of the data as measured and modeled.

Abstract: The invention provides a method for forming a photoresist mask on a substrate resistant to reticulation during plasma etching. The method comprises the steps of forming an imaged and developed photoresist coating over an integrated circuit substrate where the photoresist contains an essentially unreacted acid activated cross linking agent, and subjecting said substrate to an etching plasma in a gaseous stream that contains a Lewis acid. Contact of the surface of the photoresist film with the Lewis acid causes cross linking of the surface of the photoresist film during plasma etching with the formation of a reticulation resistant surface layer.

Abstract: An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

Abstract: A simple, inexpensive device and method are disclosed for measuring the effectiveness of a photoresist composition in controlling reflective notching. The device utilized in practicing the method is a metalized silicon wafer having a U-shaped image thereon. This wafer may be coated with a photoresist, exposed through a grating pattern and developed, whereby the degree of notching of the photoresist lines may be readily observed.

Abstract: The subject invention involves reduction of light reflection into a photoresist coating over a reflective substrate by the use of a photoactive compound in a photoresist formulation that is the reaction product of a diazooxide and curcumin.

Abstract: A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

Abstract: The invention is for a developer for a bilayer photoresist film comprising a first relatively thick layer of a polyglutarimide and a second relatively thin layer of a diazo sensitized novolak resin. The developer is an aqueous solution of a tetra alkyl ammonium hydroxide where at least two of the alkyl groups have two or more carbon atoms. The developer of the invention permits development of the bottom resist layer without erosion of the top resist layer.

Abstract: Novel partially silylated polyvinylphenol polymers of the Formula (I) are disclosed: ##STR1## wherein X is H or CH.sub.3 ; R is --OH or ##STR2## wherein R.sub.1 is --O or --O(CH.sub.2).sub.n, n is 1 to 4, and R.sub.2, R.sub.3 and R.sub.4 are independently selected from 1-4 carbon alkyl, aryl or benzyl, and wherein the average molecular weight of the silylated polymer is from about 2,700 to 22,000 and the average percent by weight silicon is from about 3% to 12%. This invention also relates to blends of such polymers to yield a polymer having a predetermined average molecular weight and percent by weight silicon.

Abstract: An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

Abstract: A method for coating a conductive surface with an organic coating where one discrete area of the organic coating is coated onto the surface in an image pattern by conventional means and another discrete area of the organic coating is electrophoretically deposited onto the surface. The process is useful for diverse applications including the fabrication of printed circuit boards.