Abstract: The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. In one embodiment, the package includes an integrated circuit device on a metal die pad. A metal ring is between the die pad and leads and surrounds the die pad. The ring is connected to the die pad by a nonconductive adhesive tape. Encapsulant material covers the entire structure, except for portions of the leads. The ring is electrically connected to a lead identified for connection to an external power voltage supply. The ring in turn is electrically connected to a power voltage input pad on the integrated circuit device. The potential of the die pad may float, or the die pad may be electrically connected through a lead to an external ground voltage. The package is made from a leadframe that has a die pad, a metal ring between the die pad and radiating leads, and a nonconductive adhesive tape that connects the ring to the die pad.

Abstract: A preheating circuit for a fluorescent lamp is provided. The preheating circuit includes a filament detecting circuit indirectly detecting a filament resistance in a fluorescent lamp by measuring a filament voltage and a filament current, a pulse generation circuit providing pulses of one of a first frequency and a second frequency determined by the detected filament resistance and a specific filament resistance, and a filament resonance circuit operating the fluorescent lamp at an operating frequency determined by the pulse generation circuit. Therefore, the filament resonance circuit operates at the first frequency to preheat the fluorescent lamp when the detected filament resistance is smaller than the specific resistance. The filament resonance circuit operates at the second frequency to operate the fluorescent lamp when the detected filament resistance is one of a first value being larger than and a second value being equal to that of the specific resistance.

Abstract: A method for making low cost chip size semiconductor packages (“CSPs”) includes preparing a substrate having a first surface with metal pads and lands thereon, and an opposite second surface having openings in it through which the lands are exposed. A solder mask is formed over the first surface of the substrate, and has apertures in it through which the metal pads are exposed. At least one vent opening is formed through the substrate and solder mask. A semiconductor die is electrically connected to the substrate through the apertures in the solder mask using the “flip chip” connection method. A body of an insulative plastic material is formed on the surface of the solder mask that simultaneously overmolds the die and underfills the space between the solder mask and the die in a single step. Solder balls are attached to the lands through the openings in the second surface of the substrate to serve as package input/output terminals.

Abstract: A circuit for automatically driving a mechanical device at its resonance frequency is provided. To do so, the circuit detects non-resonance driving conditions of the mechanical device being coupled to and driven by such circuit. Based on such detection, the circuit generates a signal to drive the device at its resonance frequency.

Abstract: A driver may be provided which controls output impedance of a driver which includes within the driver an impedance circuit and slew rate control. Accordingly, a desired output slew rate and a desired output impedance can be advantageously established and maintained over a wide range of variations in operating conditions, manufacturing processes and output voltage levels. Such a driver also advantageously limits any crowbar current, thereby reducing the overall power consumption of the driver with little, if any, degradation of driver performance.

Abstract: An apparatus and method is disclosed for illuminating an image display with ambient light using holographic techniques. The apparatus includes a pair of holographic optical elements each having a first surface aligned on a common axis so that the first surfaces of each optical element face each other. Each of the first and second optical elements diffracts first bandwidth light. The second holographic optical element, however, diffracts first bandwidth light received on the first surface facing the first surface of the first holographic optical element. The second holographic optical element diffracts first bandwidth light received on its first surface, the diffracted light emerging from the first surface. The first and second holographic optical elements are switchable between inactive and active states. In the inactive state, each of the first and second holographic optical elements transmits substantially all light without substantial alteration.

Abstract: A semiconductor device having data multiplexing and data masking functions is provided. The semiconductor device includes a dynamic random access memory (DRAM) cell array for inputting or outputting M×N data signals in parallel, a logic circuit having a control function, and a memory unit connected between the DRAM cell array and the logic circuit. The memory unit transmits or receives M×N data signals to or from the DRAM cell array and transmits or receives M data signals to or from the logic circuit, in response to an address signal input from the outside. The memory unit includes at least M memory blocks. Each memory block receives N data signals from the DRAM cell array and transmits at least one data signal to the logic circuit, and receives at least one data signal from the logic circuits and transmits N data signals to the DRAM cell array. A write/read word line driver connects to the at least M memory blocks.

Abstract: A semiconductor memory device having a write masking function and a write masking method are provided. The semiconductor memory device includes a plurality of write bit lines, a plurality of write word lines, a plurality of write drivers, a plurality of MOS transistors, a plurality of latch circuits, and a plurality of precharge controllers. Each of the write drivers receives input data, a write enable signal and a write masking signal, outputs the input data when the write enable signal is activated and the write masking signal is deactivated, and does not output the input data when the write masking signal is activated. Each of the latch circuits includes an inverter having a large driving capacity and an inverter having a small driving capacity. When a precharge signal is activated, each of the precharge controllers precharges a corresponding write bit line to the logic threshold voltage of the inverter having the large driving capacity.

Abstract: A semiconductor memory device which includes a plurality of memory cell array blocks, each block including 2n partial blocks selectable in response to n address bits among a plurality of bits address. A partial block select signal generator is used for selecting ½n partial blocks of the 2n partial blocks in each of the plurality of memory cell array blocks by selecting the state of corresponding address bits among the n address bits. A method for repairing a semiconductor memory device which includes a plurality of memory cell array blocks and 2n partial blocks selected by the plurality of memory cell array blocks each responding to n address bits among a plurality of address bits, the method includes selecting only the ½n functional partial blocks of the 2n partial blocks in each of the plurality of memory cell array blocks by selecting the state of corresponding address bits among the n bits of address information.

Abstract: An apparatus, system, and method for uniformly and controllably heating the active surface of a semiconductor wafer during processing. The present invention includes a scanner assembly, which is operable to scan over a single semiconductor wafer. A radiation energy source is provided enclosed within the main body of the scanner assembly. The radiation energy source may be surrounded by a reflective/absorptive surface, which reflects and absorbs the emitted radiation, such that the resultant energy output is substantially free of non-uniformities. The reflected energy is directed through a slit in the scanner assembly to the wafer. The narrow wavelength band of energy allowed to escape the scanner assembly is uniformly scanned over the wafer to heat only the active layer of the wafer surface.

Abstract: In an electric contact probe unit using a perforated plate member as a holder member, the holder member is made of material having a low coefficient of thermal expansion so that, even when used in a high temperature environment, the thermal expansion of the holder member can be minimized so that the positional accuracy of the electric contact probe units can be ensured without creating cumulative errors between those located remote from each other. When the holder member consists of a plurality of laminated thin plate members, because the perforation of thin plate members can be accomplished by etching, the production process is suited for mass production. By forming electrically insulating film on the inner circumferential surface of the holder hole, it becomes possible to form the holder member from materials which have a low coefficient of thermal expansion but are electroconductive, thereby expanding the range of material selection.

Abstract: This invention relates to a luminous necktie wherein a large number of light-emitting-diodes are installed to be exposed to the front part of the necktie, whereby they are in harmony with designs formed in the necktie surface to give a sense of beauty to who sees the necktie, simultaneously with raising night discrimination. The present invention comprises a large number of light-emitting-diodes(LED1, LED2, ˜, LEDn) exposed to the front part of a necktie 30; a oscillation circuit portion 40 for flashing said light-emitting-diodes(LED1, LED2, ˜LEDn); and a switch(SW) giving trigger signals to the trigger signal end(T) of said oscillation circuit portion 40.

Abstract: A set of haptic elements (haptels) are arranged in a grid. Each haptel is a haptic feedback device with linear motion and a touchable surface substantially perpendicular to the direction of motion. In a preferred embodiment, each haptel has a position sensor which measures the vertical position of the surface within its range of travel, a linear actuator which provides a controllable vertical bi-directional feedback force, and a touch location sensor on the touchable surface. All haptels have their sensors and effectors interfaced to a control processor. The touch location sensor readings are processed and sent to a computer, which returns the type of haptic response to use for each touch in progress. The control processor reads the position sensors, derives velocity, acceleration, net force and applied force measurements, and computes the desired force response for each haptel. The haptels are coordinated such that force feedback for a single touch is distributed across all haptels involved.

Abstract: A dynamic random access memory device includes a circuit for generating sense amplification activation signals applied to sense amplifier circuits. The circuit changes the slopes of the activation signals according to variation of a power supply voltage. According to the present invention, the peak current the sense amplifier circuits use when the power supply voltage increases, is reduced, so that the sense amplifier circuits create less noise in the memory device.

Abstract: A printed circuit board assembly characterized by at least two decoupling capacitors for decoupling transient currents resulting from, for example, logic transitions in high-speed digital circuitry. The decoupling capacitors are physically arranged, and electrically connected between a power plane and a ground plane, so that transient currents flow in respectively opposite directions through the capacitors, thereby maximizing the capacitors' mutual inductance, and thus minimizing the electromagnetic interference generated by the capacitors.

Abstract: Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).

Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.

Abstract: A data acquisition system has a central station connected to a plurality of nodes over a network. Each node is connected to receive signals from one or more sensors ad each is configured to have substantially the same transmission delay to said central station. The central station is configured to notify all nodes of an event time at which a data event, such as a seismic shot, occurred.