Abstract: A system and method for time diversity uses interleaving. To simplify the operation at both transmitters and receivers, a formula can be used to determine the mapping from slot to interlace at a given OFDM symbol time.

Abstract: An interleaver that implements the LCS turbo interleaver algorithm utilized by the CDMA2000 standard is described. The interleaver includes a first computation unit for receiving an input address and computing a first sequential interleaved address during a first clock cycle in response thereto. A second computation unit is included for receiving an input address and computing a second sequential interleaved address during the first clock cycle in response thereto. The interleaver further includes a comparator for determining whether the first or the second sequential interleaved address is invalid and generating a signal in response thereto. The output of the comparator provides a control signal to a switch which selects the first or the second sequential interleaved address as an output interleaved address for the first clock cycle. The interleaver is further designed to move in a forward direction or a reverse direction.

Abstract: In a communication system 10, a method and apparatus provide for decoding a sequence of turbo encoded data symbols. The channel nodes Rx, Ry and Rz are updated based on a received channel output, and the outgoing messages from symbol nodes (701, 707, 708) are initialized. The symbol nodes symbol nodes (701, 707, 708) are in communication with the channel nodes Rx, Ry and Rz. Updates of computational nodes C (704) and D (706) at different time instances are performed in accordance with a triggering schedule.

Abstract: Apparatus and methods for estimating the frequency of a sleep or slow clock by selectively utilizing an estimated sleep clock frequency and an estimated change in the sleep clock frequency. The disclosed apparatus includes a sleep clock frequency estimator to output a fast clock derived sleep clock frequency estimate and a sleep clock change frequency estimator to output an estimate of a change in frequency of the sleep clock. The apparatus further includes a combiner that weights at least one of the fast clock derived sleep clock frequency estimate to obtain a weighted sleep clock frequency estimate and the estimate of the change in frequency of the sleep clock to obtain a weighted estimate of the change in frequency of the sleep clock. The combiner also determines a new estimate of the sleep clock frequency using at least one of the weighted sleep clock frequency estimate and the weighted estimate of the change in frequency of the sleep clock. Complementary methods are also disclosed.

Abstract: A semiconductor device includes a substrate forming a trench, the trench including a storage node disposed within the trench. A wordline is disposed within the substrate and adjacent to a portion of the substrate. A vertically disposed transistor is included wherein the wordline functions as a gate, the storage node and a bitline function as one of a source and a drain such that when activated by the wordline the transistor conducts between the storage node and the bitline. The invention further includes a method of fabricating the semiconductor device with vertical transistors.

Abstract: Methods and reticles for evaluating lenses are disclosed. In one instance, a reticle which permits light to pass therethrough is provided which includes a first surface with a grating profile formed thereon. The grating profile includes a plurality of grouped stepped portions. Each group of the stepped portions includes a first step which prevents light from propagating therethrough, a second step which propagates light therethrough and a third step which propagates light therethrough at an angle 60 degrees out of phase with the light propagated through the second step.

Abstract: An automatic method for the generation of a logical hardware test pattern in memory circuits is based on a given physical pattern. The method includes backwards transformation from a given set of logical data patterns. Since the method is automatic, no knowledge of data scrambling inside the memory circuit is required.

Abstract: Sensing of information from a memory cell via a plateline is disclosed. The memory cell comprises a bitline coupled to a junction of a cell transistor while the other junction is coupled to an electrode of the capacitor. The bitline is coupled to a constant voltage source. A plateline is coupled to the other capacitor electrode.

Abstract: A semiconductor memory cell, in accordance with the present invention includes a deep trench formed in a substrate. The deep trench includes a storage node in a lower portion of the deep trench, and a gate conductor formed in an upper portion of the deep trench. The gate conductor is electrically isolated from the storage node. An active area is formed adjacent to the deep trench and is formed in the substrate to provide a channel region of an access transistor of the memory cell. A buried strap is formed to electrically connect the storage node to the active area when the gate conductor is activated. A body contact is formed opposite the deep trench in the active area and corresponding in position to the buried strap to prevent floating body effects due to outdiffusion of the buried strap. Methods for forming the body contact are also described.

Abstract: A device and method for fabricating a gate structure are disclosed. A first conductive material is deposited in a trench formed in a substrate and the first conductive material is recessed to a level below a top surface of the substrate in the trench. A dielectric layer is conformally deposited in contact with the first conductive material in the trench and in contact with sidewalls of the trench. A hole is formed in the dielectric layer to expose the first conductive layer, and the hole is filled with a conductive material. A gate stack is formed over the trench such that an electrical connection is made to the first conductive layer in the trench by employing the conductive material through the dielectric layer.

Abstract: A method of forming on a common semiconductor body (substrate) silicon oxide layers of different thicknesses uses plasma treatment on selected portions of an original thermally grown silicon oxide layer. The plasma treated portions are completely etched away to expose a portion of the surface of the body while non-selected portions of the original silicon oxide layer are little effected by the etch. A thermally grown second layer of silicon oxide is formed with the result being that the silicon oxide layer formed in the exposed portions of the body is thinner than elsewhere. The use of dual thickness silicon oxide layers is useful with dynamic random access memories (DRAMs) as gate oxide layers of field transistors of memory cells of the DRAM typically require different electrical characteristics than transistors of support circuitry of the DRAM.

Abstract: A dynamic clamp is used in conjunction with capacitors with thinner dielectric or with deep trench capacitors to solve the problem of dielectric breakdown in high stress capacitors. The dynamic clamp is realized using a two stage pump operation cycle such that, during a first stage pump cycle, a middle node of a pair of series connected capacitors is pre-charged to a supply voltage and, during a second stage pump cycle, the middle node is coupled by a boost clock. Thus, at any moment in the pump operation cycle, the voltage across the capacitors is held within a safety range.

Abstract: An integrated circuit has primary devices and redundant devices being selective substituted for the primary devices through at least one fuse. The fuse includes a first layer having at least one fuse link region, a second layer over the first layer and cavities in the second layer above the fuse link region.

Abstract: In the formation of a semiconductor structure, where spacer formation is strongly dependent on the structure (e.g. taper), the improvement of a spacer formation on a poly stud planarized to pad nitride where an oxide is formed on top of the poly prior to the pad nitride strip, so that after pad nitride removal, the poly is etched back and nitride is deposited conformal followed by anisotropic nitride RIE etch, so that the oxide protects the nitride underneath from being etched.

Abstract: A method for etching trenches includes providing a patterned mask stack on a substrate. A trench is etched in the substrate by forming a tapered-shaped trench portion of the trench, which narrows with depth in the substrate by employing a first plasma chemistry mixture including O2, HBr and NF3. An extended portion of the trench is formed by etching a second profile deeper and wider than the tapered-shaped trench portion in the substrate by employing a second plasma chemistry mixture including O2, HBr and SF6 or F2.

Abstract: An integrated circuit comprising a vertically oriented device formed with a substantially SELF ALIGNED process, in which the trench, active area (e.g., 128, 228), and gate (e.g., 132, 232) of a DRAM cell may be formed using a minimal number of masks and lithographic steps. Using this process, a DRAM cell comprising a vertical transistor and a buried word line (e.g., 132, 232) may be formed. A gate dielectric (e.g., 130, 230) may be disposed adjacent the active area, and the portion of the buried word line adjacent the gate dielectric may function as the vertically oriented gate for the vertical transistor. The DRAM memory cell may comprise one of a variety of capacitors, such a trench capacitor underlying the vertical transistor, or a stack capacitor (e.g., 241) overlying the vertical transistor. When a stack capacitor is used, a buried bit line (e.g., 208) underlying the vertical transistor may also be used.

Abstract: A synchronized data capture circuit configured to synchronize capturing of data in a first plurality of data signals with a first plurality of timing signals to output a synchronized data capture signal. The synchronized data capture circuit includes a timer generator having a first timer generator output. The timer generator is coupled to receive the first plurality of timing signals and to serially output on the first timer generator output, as a first high frequency timing pulse stream, first timing pulses responsive to timing pulses of the plurality of timing signals. The first high frequency timing pulse stream has a timing pulse stream frequency that is higher than a timing input frequency associated with one of the first plurality of timing signals. The synchronized data capture circuit also includes first plurality of data driver circuits coupled to receive the first plurality of data signals and the plurality of timing signals.

Abstract: In a controller for controlling a generator system on a memory chip, the controller operates as a state machine in accordance with a state diagram including a plurality of N states. A state storage device is responsive to input signals from a transition arrangement including a 1-out-of-N code indicating a change in the state diagram from a current state to a next state of the plurality of N states. The state storage device generates a revised plurality of N state output signals comprising a true State signal and a complementary true State signal for the next state of the plurality of N states. The state storage device is also responsive to an asynchronous Reset signal received from an external source for generating a Reset and a complementary Set output signal.

Abstract: An optical alignment system used in the manufacture of semiconductor integrated circuits determines and adjusts the alignment between features which have been formed on a semiconductor wafer and features on a mask which is being projected onto the semiconductor wafer. Light which illuminates the semiconductor wafer is scattered and diffracted into a dark-field detector system. This results in the generation of electrical signals which are used to position the mask relative to the semiconductor wafer. The use of polarized light in the present system results in an increase in the magnitude of the desired signals and a decrease in the magnitude of the spurious signals. To improve the quality of the signals, the angle of polarization of the light is adjusted to a specific relationship with respect to the geometry of the alignment marks on the semiconductor wafer.

Abstract: A semiconductor body-having a pair of vertical, double-gated CMOS transistors. An insulating layer extending horizontally beneath the surface of the semiconductor body such insulating layer being disposed beneath the pair of transistors. The transistors, together with additional such transistors, are arranged to form a Synchronous Dynamic Random Access Memory (SRAM) array. The array includes a plurality of SRAM cells arranged in rows and columns, each one of the cells having a WORDLINE connected to a WORLDINE CONTACT. The WORDLINE CONTACT is common to four contiguous one of the cells. One of the cells having a plurality of electrically interconnected MOS transistors arranged to provide an SRAM circuit. Each one of the cells has a VDD CONTACT and a VSS CONTACT. One of such CONTACTs is disposed centrally within each one of the cells and the other one of the CONTACTs being common to four contiguous ones of the cells.