Patents Represented by Attorney Stephen F. K. Yee
  • Patent number: 4961944
    Abstract: A food package for cooking of the food in a microwave oven is formed of a heat-resistant synthetic resin impermeable to oil and moisture and has at least one opening for allowing steam to escape when the internal pressure in the package is increased beyond a certain value by the steam generated during heating. The number of openings and the size of each opening are selected with consideration of the package volume or size and the type of food to be packaged so as to adjustably maintain within the package a pressure and a temperature each of which are within a range of predefined values during cooking in the oven. The package distends with increase of the internal pressure to provide a visual indication that cooking is complete. A method of cooking the packaged food comprises using the described package which adjustably maintains the internal pressure in the package within the range of about 1.00 to about 1.15 atm and the temperature within the range of about 100.degree. to about 105.degree. C.
    Type: Grant
    Filed: September 20, 1988
    Date of Patent: October 9, 1990
    Assignee: Gourmec Laboratory Co., Ltd.
    Inventors: Takeji Matoba, Masahiro Morita
  • Patent number: 4938410
    Abstract: A soldering apparatus of the reflow type contains a preheating chamber and a reflow chamber which are provided with a plurality of heaters for heating printed circuit boards with chips temporarily mounted thereon with solder pastes during conveyance by a conveyor. The heaters are provided with a screening member and/or a partition member so as to prevent direct radiation of radiant heat from the heaters into the chambers and onto the printed circuit boards and to provide a uniform air flow to be blown uniformly onto the printed circuit boards. The heaters are arranged so as to heat them in such a manner as to increase temperatures in the direction from an inlet to an outlet so as to become higher with a predetermined temperature differential from the previous heater, thus removing bubbles generated upon fusion of the solder pastes and minimizing heat shock to the chips as they are heated.
    Type: Grant
    Filed: January 18, 1989
    Date of Patent: July 3, 1990
    Assignee: Nihon Den-Netsu Keiki Co., Ltd.
    Inventor: Kenshi Kondo
  • Patent number: 4915984
    Abstract: A process for producing almost perfect graphite films and fibers at lower graphization temperatures wherein a film or fiber of a polymer selected from a defined group is subjected to a preliminary heat treatment at a temperature of 400.degree. to 700.degree. C., under tension, in vacuo or in an inert gas, and then heat treating the film or fiber at a temperature of at least 1600.degree. C. in vacuo or in an inert gas, to graphitize the film or fiber. The process can be modified to produce graphite films having excellent electric conductivity and mechanical properties, by heat treating a polymer selected from a second defined group at a temperature of at least 1800.degree. C. in vacuo or in an inert gas, impregnating the film with a binder component, and then heat treating the impregnated film at a temperature of not more than 1400.degree. C.
    Type: Grant
    Filed: June 7, 1988
    Date of Patent: April 10, 1990
    Assignees: Reserach Development Corp., Matsushita Electric Industrial
    Inventor: Mutsuaki Murakami
  • Patent number: 4913334
    Abstract: A device for correcting warp of printed circuit boards in carrierless soldering apparatus wherein the printed circuit boards are soldered while being held by holding claws of a conveying means is disclosed, which comprises a sliding means involving a single or plural warp-correcting means, sliding plates for installing the warp-correcting means thereon, and a single or plural pairs of slide beds provided in parallel to the direction of movement of the printed circuit boards, and a driving means for reciprocating the slide means in parallel to the direction of movement of the printed circuit boards.
    Type: Grant
    Filed: January 18, 1989
    Date of Patent: April 3, 1990
    Assignee: Nihon Den-Netsu Keiki Co., Ltd.
    Inventor: Kenshi Kondo
  • Patent number: 4889273
    Abstract: A soldering apparatus capable of forming a flowing layer of a molten solder with which an article to be soldered is contacted and the height of the upper surface of which is automatically controlled between predetermined upper and lower levels by continuously detecting the upper surface with two detectors. Each detector has a vertical pipe whose top is connected to a source of a pressurized gas and whose bottom is opened downward so that the pressure within the pipe is increased or released when the upper surface of the solder is positioned above or below the open bottom end of the pipe. A pressure switch is provided in each pipe to detect the increase and decrease of the pressure within the pipe to detect the upper surface of the solder layer.
    Type: Grant
    Filed: June 16, 1988
    Date of Patent: December 26, 1989
    Assignee: Nihon Den-Netsu Keiki Co., Ltd.
    Inventor: Kenshi Kondo
  • Patent number: 4876077
    Abstract: A process for producing graphite includes heat treating, in an inert gas or in vacuo, at least one polymer selected from the group consisting of a polyphenyleneoxadiazole, polybenzothiazoles, a polybenzobisthiazole, a polybenzoxazole, a polybenzobisoxazole and a polythiazole, at a temperature of at least 1600.degree. C., preferably at least 2000.degree. C., for at least 30 minutes, preferably at least 60 minutes, to convert the polymer to a highly-graphitized graphite. The process produces almost perfect graphite in any shape, such as film-shaped for large-area graphite, fibrous or powdered.
    Type: Grant
    Filed: December 15, 1987
    Date of Patent: October 24, 1989
    Assignees: Research Development Corp. of Japan, Matsushita Elec. Industries Co. Ltd.
    Inventor: Mutsuaki Murakami
  • Patent number: 4876437
    Abstract: A soldering apparatus of a type in which printed circuit boards having temporarily mounted thereon chip parts with solder paste are heated within a heating chamber to cause the solder paste to reflow. The heating chamber is partitioned into preheating chamber or chambers and a reflowing chamber, with each preheating chamber being divided into gas flow channels and center space through which the board is transferred and in which a heater, flow control plates and a fan are provided so that the hot air heated with the heater in each preheating chamber is forcibly recirculated within each chamber to preheat the board uniformly. The preheated board is transferred to the reflowing chamber provided with far infrared radiation lamps to cause the solder paste to reflow.
    Type: Grant
    Filed: July 14, 1988
    Date of Patent: October 24, 1989
    Assignee: Nihon Den-Netsu Keiki Co., Ltd.
    Inventor: Kenshi Kondo
  • Patent number: 4874081
    Abstract: A printed circuit board transferring device is disclosed which includes a pair of endless roller chains defining a printed circuit board transferring path therebetween, a plurality of support members fixed to the chains for movement therewith and each adapted to support printed circuit boards thereon, a clamp plate member provided on each of the support members and moveable between close and open positions, and engaging plates provided on both sides of the transfer path and engageable with upper surfaces of the clamp plate members to maintain the clamp plate members in the close positions, so that the printed circuit boards supported on the supporting members are clamped between the supporting members and the clamp plate members during the engagement of the clamp plate members with the engaging plates.
    Type: Grant
    Filed: November 2, 1988
    Date of Patent: October 17, 1989
    Assignee: Nihon Den-Netsu Keiki Co., Ltd.
    Inventor: Kenshi Kondo
  • Patent number: 4873292
    Abstract: An antithrombogenic synthetic polymer has repeat structural units represented by the following structural formula consisting of portions I and II: ##STR1## a microdomain structure composed of crystalline phases and amorphous phases, each phase having an average size of 5 to 10 nm, and a molecular weight in the range of about 10,000 to about 300,000. The polymer exhibits little adhesion of blood platelets thereto, an excellent antithrombogenic property and a sufficient mechanical strength.
    Type: Grant
    Filed: February 9, 1988
    Date of Patent: October 10, 1989
    Assignee: Research Development Corporation of Japan
    Inventors: Naoya Ogata, Kohei Sanui, Nobuhiko Yui, Kazunori Kataoka, Teruo Okano, Yasuhisa Sakurai
  • Patent number: 4863550
    Abstract: In a laminating apparatus wherein a predetermined length of a film cut from a continuous web is laminated onto a substrate having positioning holes, a method for forming alignment or indexing holes in the film which correspond with the positioning holes in the substrate includes detecting the position of the positioning holes, establishing the location on the film where the alignment holes are to be formed, and punching the holes in the film. The apparatus includes a hole-forming device positioned to move along the film transfer path, the operation of the device being regulated by a sensor for detecting the position of the positioning holes, a control device for setting the position of the hole-forming device relative to the film in response to the sensor signal, and a mechanism for displacing the hole-forming device to the proper location for forming the alignment holes.
    Type: Grant
    Filed: June 7, 1988
    Date of Patent: September 5, 1989
    Assignee: Somar Corporation
    Inventors: Takao Matsuo, Norihasu Sawada
  • Patent number: 4857384
    Abstract: Disclosed are an exothermic conducting paste mainly comprising a synthetic resin and a heat stable metal oxide which is positive in temperature coefficient of electric resistance and has an electric specific resistance of not more than 5.times.10.sup.3 .mu..OMEGA.cm at ordinary temperature, and an electric resistance heating unit wherein a desirably shaped solid or solid surface is coated or impregnated with said paste. This heating unit has an uniform temperature distribution, is adjustable to any desired temperature below 350.degree. C., and further can be formed in various shapes.
    Type: Grant
    Filed: May 29, 1987
    Date of Patent: August 15, 1989
    Assignee: Awaji Sangyo K. K.
    Inventors: Mitsushi Mio, Hisao Negita
  • Patent number: 4852374
    Abstract: An electrical shock-preventable key unit has a case for slidably accommodating a key body, a slide plate and an electrical shock preventing system. The slide plate engages with the key body and slides reciprocally to position it in the extended position or in the retracted position. The electrical shock preventing system comprises a conductive member provided on the case, a resistor for attenuating the current due to static electricity, and a conductive contact piece which comes into contact with the key body in the extended position, and operates to prevent the user from receiving an electrical shock upon locking or unlocking.
    Type: Grant
    Filed: February 25, 1988
    Date of Patent: August 1, 1989
    Inventor: Motohiro Gotanda
  • Patent number: 4848642
    Abstract: An apparatus for soldering printed circuit boards moving along a predetermined path of travel, comprises an upwardly extending nozzle member having an opening at its top end from which molten solder is caused to overflow to form an overflowing molten solder with which the underside surface of the printed circuit board is contacted, and an adjustable outlet member rotatably disposed in the opening to define an outlet extending in the direction transverse to the path of travel, so that by adjusting the angular position of the outlet member the orientation of the outlet may be varied for adjustment of the direction and height of the overflowing solder.
    Type: Grant
    Filed: December 15, 1987
    Date of Patent: July 18, 1989
    Assignee: Nihon Den-Netsu Keiki Co., Ltd.
    Inventor: Kenshi Kondo
  • Patent number: 4842560
    Abstract: A watercraft is provided with a propulsion system having a hydraulic power plant driving a propeller through a transmission. The power to operate hydraulic pumps in the power plant is derived from wave motion by buoyant members connected to the power plant by outrigger arms. Undulation of the waves is converted to fluid pressure by the vertical movement of the buoyant members reciprocating pistons in the hydraulic pumps. Pressurized fluid is applied to a fluid motor driving the transmission. A steering assembly is operatively associated with one of the buoyant members.
    Type: Grant
    Filed: December 28, 1987
    Date of Patent: June 27, 1989
    Inventor: Choong G. Lee
  • Patent number: 4843365
    Abstract: A magnetoresistance element comprises one or more magnetoresistors whose resistances are varied with the change in magnitude of the magnetic field produced by a multipolar magnet disposed on a moving object. The magnetoresistors are provided adjacent to the object and arranged to have a sensitivity which is distributed along the moving direction of the object with a predetermined distribution breadth and which has one or more peak values, so as to provide an output a signal having a sinusoidal waveform.
    Type: Grant
    Filed: February 25, 1988
    Date of Patent: June 27, 1989
    Assignee: Mitsubishi Kasei Corporation
    Inventor: Yuzo Seo
  • Patent number: 4839463
    Abstract: A cumulatable ultrafine polymer particle consisting of one molecular chain of the polymer is prepared by spreading a dilute solution of the polymer at the interface between the atmosphere and a subphase solution having a weak affinity for the polymer, and evaporating the spreading solvent or dissolving it into the subphase. A composite material comprising the polymer particles is produced by contacting the particles formed on the subphase solution with the surface of a substrate. The particles are cumulated on the substrate in a ratio of area occupied by the particles of at least 10%. The particles may be cumulated in multiple layers on the substrate.
    Type: Grant
    Filed: March 19, 1986
    Date of Patent: June 13, 1989
    Assignee: Research Development Corporation of Japan
    Inventor: Jiro Kumaki
  • Patent number: 4824076
    Abstract: A cable winch having a pair of cable-gripping assemblies movably mounted on a support member adapted to be secured to a fixed point. An operating handle is pivoted to the support member, and linkages interconnect the handle with each of the assemblies to effect movement of the assemblies on the support member. A cable is winched by the assemblies alternately gripping, pulling, releasing and re-gripping the cable as the handle is operated. A kicker bar is pivotally supported adjacent to one of the gripping assemblies and coacts therewith to ensure that the movable gripping surface of the assembly positively releases its grip on the cable to ensure passage of the cable therethrough, while the remaining gripping assembly maintains its grip on the cable.
    Type: Grant
    Filed: September 11, 1987
    Date of Patent: April 25, 1989
    Assignee: Research and Trading Corporation
    Inventor: David L. Ward
  • Patent number: 4818593
    Abstract: Unit layer polyheteroaromatic films of thickness less than 50 nm are obtained when an aldehyde monomer or aldehyde monomer precursor is spread onto an aqueous subphase containing an aromatic amine monomer, said aromatic amine monomer possessing amine or group VI heteroatom alcohols moieties in ortho (XH, NH.sub.2) pairs, where X is N or a group VI heteroatom. The resulting film can be transferred and built up as multilayer films on various substrates.
    Type: Grant
    Filed: February 3, 1987
    Date of Patent: April 4, 1989
    Assignee: Research Development Corp. of Japan
    Inventor: Alan K. Engel
  • Patent number: 4806293
    Abstract: Method of producing a molded article of a foamed thermoplastic resin. A molten mass of an expandable thermoplastic resin is accumulated in an accumulator while it is prevented from foaming. A predetermined quantity of the accumulated thermoplastic resin is ejected rapidly from the accumulator into the atmosphere so that the thermoplastic resin commences foaming. The ejected thermoplastic resin is placed in a mold cavity before the foaming expansion has been completed and is compressed. The expansion and molding of the ejected thermoplastic resin is completed in the mold while controlling the compression pressure to obtain a foamed molded article.
    Type: Grant
    Filed: April 10, 1987
    Date of Patent: February 21, 1989
    Assignee: Japan Styrene Paper Corporation
    Inventors: Hiroyuki Akiyama, Yoshimi Sudo, Masahiko Kishida, Mitsuru Nishida
  • Patent number: D311548
    Type: Grant
    Filed: October 24, 1988
    Date of Patent: October 23, 1990
    Inventor: Theodore G. Thompson, Jr.