Abstract: The present invention is directed to radical-curable adhesive compositions which include a (meth)acrylate component; a thermal resistance-conferring component; and a radical cure-inducing composition. Reaction products of the compositions of this invention exhibit superior resistance of thermal degradation.

Abstract: A single stroke fluid dispense system, including a dispense member having a dispense end defining a dispense end opening and a container well communicating with the dispense end opening for receiving a fluid to be dispensed. A closure cap is supported over the dispense end opening of the dispense member and further defines a fluid passageway therethrough in fluid communication with the container well. A compression assembly for forcing the fluid through the fluid passageway of the closure cap is also provided. A sealing piston assembly maintains the closure cap in sealing engagement with the dispense member. The closure cap may further defined a burst port at one end of the fluid passageway facing the container well which is especially useful for dispensing fluid from a flexible rupturable container. The compression assembly maintains fluid integrity between the container and the closure cap about the rupture port throughout dispensement so as to thwart fluid from leaking into the container well.

Abstract: A radiation-curable composition which includes a cyanoacrylate component or a cyanoacrylate-containing formulation; a metallocene component; and a polymerizingly effective amount of a photoinitiator to accelerate the rate of cure is provided.

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

Abstract: A silicone composition that is oil resistant when cured is described. More particularly, this composition includes a silanol terminated silicone fluid, an organic plasticizer, a filler and a crosslinker, wherein the cured composition remains adhesive after exposure to oil. The present compositions provide superior adhesive properties after exposure to oil than conventional RTV silicone adhesives having M-stopped silicone plasticizers. Methods of making and using cured elastomeric products made from the present compositions are also provided.

Abstract: The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses, as well as films containing such arrays and recesses. The present invention also relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable or non-curing/non-solidifiable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between leads or pads.

Abstract: The invention provides a method and apparatus for controlling in a path-dependent manner the force generated by a piston. A first piston travels in a first cylinder—divided into a first and second chamber by the first piston—together with a pressure fluid. A second cylinder is provided in which a second piston travels. Like the first cylinder, the second cylinder is also divided by the second piston into a first and a second chamber, in this case by the second piston. The first and second pistons are coupled mechanically. The pressure in the second chamber of the second cylinder is regulated such that it is always equal to the counterpressure in the first chamber of the second cylinder and the second chamber of the first cylinder.

Abstract: The present invention provides anaerobic adhesive compositions, reaction products of which demonstrate controlled-strength at ambient temperature conditions and enhanced resistance to thermal degradation at elevated temperature conditions. The compositions are (meth)acrylate- and/or polyorganosiloxane-based and may include one or more of a variety of other components, such as certain coreactants, a maleimide component, a diluent component reactive at elevated temperature conditions, mono- or poly-hydroxyalkane components, and other components.

Abstract: The present invention relates to epoxy compositions; in particular the present invention relates to stable low temperature curing epoxy-based compositions.

Abstract: A dispensing device provides for dispensing of flowable material such as adhesives. The dispensing device includes a housing having a chamber with an inlet port and an outlet port for receiving and dispensing the flowable material. A valve assembly is supported within the housing having a moveable valve stem for opening and closing the outlet port. A flexible sleeve circumferentially surrounds a portion of the valve stem for isolating the flowable material from the moveable valve stem.

Abstract: The present invention is directed to a radical-curable adhesive composition which includes a (meth)acrylate composition; a thermal resistance-conferring agent; and a radical cure-inducing composition. Reaction products of compositions in accordance with this invention exhibit superior resistance to thermal degradation.

Abstract: The present invention provides a thermosetting resin composition useful as an underfilling sealant composition which rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by short-time heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component and a latent hardener component. The latent hardener component includes a cyanate ester component and an imidizole component.

Abstract: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation, and optionally through exposure to moisture as well. The cured products demonstrate high resistance to flammability and combustibility. The flame-retardant components is a combination of hydrated alumina and an organo ligand complex of a transition metal or an organosiloxane ligand complex of a transition metal or a combination thereof.

Abstract: The present invention provides a thermosetting resin composition useful as an underfilling sealing resin which enables a semiconductor device, such as a CSP/BGA assembly which includes a semiconductor chip mounted on a carrier substrate, to be securely connected to a circuit board by short-time heat curing and with good productivity, which demonstrates excellent heat shock properties (or thermal cycle properties), and permits the CSP/BGA assembly to be easily removed from the circuit board in the event of semiconductor device or connection failure.

Abstract: The device has a casing (1) having a base end (2), a top portion (3) opposite the base end and side wall portions (4) intermediate the base end and the top portion; a squeezer (11) insertable in the casing (1); the squeezer comprising two opposing jaws (12, 13) for gripping and expressing a substance from the tube (24). The casing (1) has an aperture (5) in the top portion (3) through which a discharge outlet (26) of a tube (24) is extendable and further having apertures (8) in opposing parts of the side wall portions through which the jaws (12, 13) are actuatable. The casing (1) is open at its base end and the squeezer (11) is insertable into the casing through its open base end. The jaws of the squeezer are attached at one end to a carrier (14) and the carrier and the casing have interengaging formations for retention of the squeezer in the casing. The squeezer (11) and the carrier (14) are integrally formed so as to form a unitary body.

Abstract: Aerosol compositions containing fluorinated oils are disclosed. At least one fluorinated component compatible with the fluorinated oil and a propellant are included in the aerosol composition. Fluorinated oil-containing non-aerosol compositions are also disclosed. In a particularly desirable form, the compositions are single-phase.

Abstract: This invention relates to cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, the combination of two accelerators to improve fixture speeds on certain substrates.

Abstract: The invention provides a conductive, resin-based composition, which includes a resinous material, and a conductive filler dispersed therein. The conductive filler includes a first conductive filler component and a second conductive filler component. The particles of the first conductive filler component are harder than those of the second conductive filler component, when measured using the Mohs hardness scale. The composition is subjected to shear mixing forces which shearingly disperse the first and second conductive filler components throughout the resinous material in such a way that the particles of the second conductive filler component occupy the interstitial voids within the network of first conductive filler component particles contained in the resinous material and thereby enhance conductivity.

Abstract: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation. The cured products demonstrate high resistance to flammability and combustibility.

Abstract: The present invention relates to an epoxy resin composition used for cap seal of a hard disc drive spindle motor, which hardly causes outgassing even when using in a hard disc for high-speed rotation and has high reliability. The composition comprises an epoxy resin having at least one glycidyl group in a molecule as a component (A), a monomer having at least one unsaturated bond group in a molecule (polyfunctional vinyl monomer or monofunctional vinyl monomer) as a component (B), an epoxy resin curing agent as a component (C), a photopolymerization initiator as a component (D), and a partially-esterified unsaturated epoxy resin wherein 10-90% of an epoxy equivalent of a bisphenol type epoxy resin is (meth)acrylated as a component (E).