Abstract: The present invention relates to heat curing impregnation sealant compositions, which are readily separable from water upon mixing.

Abstract: Non-staining, active metal-working compositions are disclosed. The compositions contain active sulfur to provide extreme pressure properties for metal-working fluids. A metal corrosion inhibitor is disclosed that reduces the corrosivity of free sulfur on non-ferrous metallic objects.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: Cyanoacrylate composition, having a cure indicator within the composition, is disclosed herein. The cyanoacrylate composition is “self-indicating” with respect to its ability to allow the end user to visually inspect the composition to determine whether, and the extent to which, cure has occurred. The composition includes a cyanoacrylate component, and a dye dissolved in the cyanoacrylate component. The cyanoacrylate composition has an initial color, oftentimes colorless or substantially so to the naked eye, and when cured, the cured cyanoacrylate composition has a different or second color. Observation of the second or different color is indicative that cure has occurred and the extent of the color change can be used to determine the degree of cure that has occurred.

Abstract: An article of manufacture which comprises a material for sealing threaded pipe joints comprising a multifilament yarn ready-coated with a joint sealing composition and packaged in a dispenser from which the coated yarn may be supplied for direct application to a threaded area of a pipe.

Abstract: A method of preparing a bonded assembly of two substrates at least one of which is transparent or translucent to UV or visible light, comprises a) applying, to at least one of the substrates, a photo/anaerobic dual cure composition comprising: i) a (meth)acrylate-capped urethane oligomer, ii) at least one (meth)acrylate diluent monomer, iii) an anaerobic curing system, and iv) a free-radical photoinitiator; b) joining the two substrates c) irradiating the adhesive through said transparent or translucent substrates with light of a wavelength effective to activate the photoinitiator for a time sufficient to at least fixture the adhesive, and then d) allowing the assembly to further cure at ambient conditions without for at least 24 hrs without subjecting the fixtured assembly to substantial peel stresses.

Abstract: An anaerobic adhesive composition having enhanced toughness and resistance to crack propagation, particularly subsequent to thermal exposure, comprising a combination of three monomers consisting of (a) at least one (meth) acrylate monomer, (b) at least one (meth)acrylate-terminated urethane modified acrylonitrile/butadiene prepolymer, and (c) at least one (meth)acrylate-terminated acrylic/polyisocyanate adduct.

Abstract: Thermosetting resin compositions useful as underfill sealants for mounting a semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: A method for sealing graphite plates formed from mechanically processed graphite sheets of exfoliated graphite particles is provided. The graphites sheets are infused with a sealant to fill about 90 volume percent of the pores contained in the sheet. Upon curing the sealant, a substantially gas impermeable graphite plate is provides. Such a plate is useful in fuel cell construction.

Abstract: An improved method is disclosed for heat curing a polymerizable impregnant composition within an impregnated porous article. The amount of the article's porosity that is filled with the impregnant composition is maximized by applying successively discrete temperature and pressure increments in a system comprising at least one porous impregnated article and a curing chamber having a heat transfer medium therein. During such curing, both temperature and pressure are controlled for an initial duration and subsequently increased by successive increments wherein each successive temperature and pressure exceeds a previous temperature and pressure, respectively, until a maximum temperature and pressure is achieved. The maximum temperature and pressure are maintained until the impregnant composition is cured, resulting in an improved product having greater structural integrity and surface quality.

Abstract: Silicone compositions are disclosed which exhibit excellent adherence to magnesium-based substrates such as magnesium alloys and which exhibit excellent resistance to organic solvents. These compositions include at least one polymerizable silicone component, at least one amino-containing silane adhesion promoter which enhances adhesion of the composition to magnesium-based substrates, and at least one viscosity modifier, which enhances the resistance of the compositions to organic solvents. Methods of making these compositions, articles of manufacture including these compositions, and a method for providing enhanced adhesion to magnesium-based substrates using these compositions are also disclosed.

Abstract: The present invention is directed to (meth)acrylate compositions useful for bonding substrates including metals, plastics, and glass to similar or different substrates, in particular, low energy surfaces. The invention also provides an initiator system for (meth)acrylate based adhesives; a kit for bonding substrates, at least one of which includes a low energy surface; a resultant bonded assembly; and a method of bonding low energy substrates. A (meth)acrylate composition within the present invention includes a (meth)acrylate component and an initiator system including an organometallic compound, a peroxy compound, an aziridine functionalized compound, and a compound having an acid functional group.

Abstract: The present invention provides a toughened thermosetting resin composition useful as an underfilling sealant composition which fills the underfill space in a semiconductor device, and includes a semiconductor chip mounted on a carrier substrate, enabling the semiconductor device to be securely connected to a circuit board by short-time heat curing. The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a cyanate ester component and an imidazole component.

Abstract: Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided in the present invention. The compounds include a cyclic hydrocarbon moiety including an oxirane or thiirane group and an aromatic ether moiety including an oxirane or thiirane group. The cyclic hydrocarbon moiety and the aromatic ether moiety are joined to each other through an oxycarbonyl-containing linkage or a thiocarbonyl-containing linkage, preferably a secondary or tertiary linkage. Compositions incorporating such compounds are capable of curing by exposure to a specific temperature, and are decomposable at a temperature in excess of the curing temperature, thus providing a composition which is reworkable.

Abstract: This invention relates to a dual curing silicone composition with an enhanced depth of cure. This composition incorporates an acylphosphine oxide or diacylphosphine oxide, the compatibility of which with the silicone is promoted through the use of a polar carrier. The composition may also include a second photoinitiator that is different than the acylphosphine oxide.

Abstract: Compounds of the formula: wherein R1 is H or methyl, R2 is H or alkyl, R3 is C2-C4 alkylene, n is 0-4, n′ is 1-4, x is one or more, y is one or more, x+y=z, and A is a z-valent organic group linked to the group or groups on the left thereof through a carbon atom and is linked to the group or groups on the right thereof through an ether or ester oxygen atom, or, provided that x and y are both 1, a direct bond.

Abstract: A dispensing closure assembly provides for the dispensing of fluid from a fluid container. The dispensing closure assembly includes a cap and a dispensing cover which is movably supported with respect to the cap. The dispensing cover includes a distal tip through which the fluid is dispensed. The cover further includes an outer surface extending from the distal tip and continuous therewith defining a fluid drainage surface where residual fluid drains. A finger contacting surface is provided on the cover and space from the fluid draining surface. A fluid containment well is defined between the fluid drainage surface and the finger contacting surface for retaining fluid drained therealong preventing fluid contact along the finger contacting surface.

Abstract: Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combination of nitrogen containing compounds and transition metal complexes, and a polysulfide toughening agent.