Abstract: The present invention provides a guide assembly for use in processing a work piece with features that incorporate a cam-style locking clamp to promote ease of use in securing and releasing a guide of the assembly. In more specific embodiments, the invention is a delivery guide assembly for use in, for example, a rolling mill for processing steel and steel rods that promotes rapid removal of a delivery stripper and addresses the problems identified with known delivery guide assemblies.

Abstract: An electronic device includes a conductive n-type substrate, a Group III nitride active region, an n-type Group III-nitride layer in vertical relationship to the substrate and the active layer, at least one p-type layer, and means for providing a non-rectifying conductive path between the p-type layer and the n-type layer or the substrate. The non-rectifying conduction means may include a degenerate junction structure or a patterned metal layer.

Abstract: A method is disclosed for fabricating a silicon nitride regions in silicon carbide. The method includes the steps of implanting a sufficient dose and energy of nitrogen ions into a silicon carbide substrate maintained at a temperature above about 350° C. to produce an as-implanted layer of a silicon nitride composition in the silicon carbide, and annealing the as-implanted layer to form a silicon nitride composition. In some embodiments, the formed region of silicon nitride provides an insulating layer. In some embodiments, the silicon nitride region is buried under a surface layer of silicon carbide. Methods of separating silicon carbide by implantation and lift-off are additionally disclosed.

Abstract: A physically robust light emitting diode is disclosed that offers high-reliability in standard packaging and that will withstand high temperature and high humidity conditions. The diode comprises a Group III nitride heterojunction diode with a p-type Group III nitride contact layer, an ohmic contact to the p-type contact layer, and a sputter-deposited silicon nitride composition passivation layer on the ohmic contact. The contact layer, the ohmic contact and the passivation layer are made of materials that transmit light generated in the active heterojunction.

Abstract: The invention is a support apparatus for a child's safety seat. The support apparatus allows the user to adjust the tilt of a child safety seat while maintaining a child in a safe position. The support apparatus comprises a base portion, an upper portion connected to one end of the base portion, and a bottom portion connected to an opposite end of the base portion. The upper and bottom portions may be attached to the base by adjustable hinges, or they may be attached in a fixed position. A foot support is attached to the bottom portion. The bottom portion engages the floor of a vehicle for added support. A child safety seat adapted to receive the invention is also disclosed.

Abstract: An LED chip includes a bond pad suitable for thermosonic or thermocompression bonding such as Sn, AuSn or other metals. The physical dimensions of the bond pad are selected to discourage or prevent solder squeeze-out during thermocompression or thermosonic bonding with or without flux. In some embodiments, an AuSn bond pad is designed to accept 30 g to 70 g of force or more without squeeze-out.