Patents Represented by Attorney Takeuchi & Kubotera, LLP
  • Patent number: 7354338
    Abstract: An apparatus for transferring a stick with a food product such as a sausage suspended therefrom includes: a stick supplying device for transferring onto a stick a sausage suspended from a loop forming device and for subsequently supplying the stick with the sausage suspended therefrom to a stick supporting and relaying device; the stick supporting and relaying device for temporarily placing thereon and supporting the stick; the transferring device for transferring the stick from the stick supporting and relaying device to a conveying device; the conveying device for conveying the stick to a stick delivering device; the stick delivering device for sequentially delivering to a swiveling device each leading one of a plurality of sticks which have been conveyed in parallel by the conveying device; the swiveling device for swiveling the stick about a swiveling axis; and a stick taking-off device for sequentially taking off the stick from the swiveling device.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: April 8, 2008
    Assignee: Hitec Co., Ltd.
    Inventors: Tatsuo Nakamura, Katsuya Tanabe, Takayuki Fujimaki
  • Patent number: 7338291
    Abstract: An intermediate electrical connector device, which easily enables “floating”, includes an intermediate board (20) having two connecting sections (23A) and (24A), which are respectively formed at the edges (23) and (24), to connect between two connecting bodies (40) and (40?), and a holding body to hold the intermediate board between two connecting sections. The holding body is divided into a plurality of sub-members (10) and (10?) at a surface perpendicular to the fitting direction between the two connecting bodies. The intermediate board is held by one of the sub-members through at least partial fitting, and forms space from another sub-member. The sub-members can be displaced relative to each other on the surface perpendicular to the fitting direction at least one direction parallel and perpendicular to the intermediate board.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: March 4, 2008
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Toshiyukj Takada
  • Patent number: 7334476
    Abstract: An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: February 26, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Shunji Ichikawa
  • Patent number: 7333757
    Abstract: A developing device includes a developer support member and a developing blade having a curved portion abutting against the developer support member. When Rc represents a minimum curvature radius of the curved portion of the developing blade and R represents a curvature radius at an abutting point where the curved portion abuts against the developer support member, a ratio of R to Rc (R/Rc) meets the following relation. 1.0?R/Rc?1.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: February 19, 2008
    Assignee: Oki Data Corporation
    Inventor: Hirotaka Oshika
  • Patent number: 7333229
    Abstract: In order to provide a print control unit capable of selecting predefined information corresponding to a document to be printed without depending upon an artificial operation, the print control unit comprises an information storing section which links identification information for identifying a kind of document and predefined information for controlling a printing job of the document and stores an information package of the linked identification and predefined information, an identification information retrieving section which retrieves the identification information of the document to be printed, and a predefined information selecting section which selects the predefined information linked with the identification information retrieved by the identification information retrieving section, from the information package stored in the information storing section.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: February 19, 2008
    Assignee: Oki Data Corporation
    Inventor: Tomohiro Itai
  • Patent number: 7333755
    Abstract: A developing device includes a developing unit for attaching developer to a latent image formed on an image bearing body to form a visible image; a developer supply unit for supplying the developer to the developing unit; and a plurality of developer transporting units for transporting the developer in an axial direction. At least one of the developer transporting units transports the developer in a direction different from a direction that another developer transporting unit transports the developer.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: February 19, 2008
    Assignee: Oki Data Corporation
    Inventor: Shigenori Koido
  • Patent number: 7332714
    Abstract: In a quadrupole mass spectrometer which measures partial pressure strength according to a gas type in a vacuum system from ion current intensity, a quadrupole mass spectrometer with a total pressure measurement electrode has a total pressure measurement electrode for examining an ion density disposed in a demarcation space which is comprised of a grid electrode and an ion focusing electrode. And, a vacuum system is provided with only the quadrupole mass spectrometer which measures partial pressure strength according to a gas type in the vacuum system from an ion current intensity and does not have an ionization vacuum gauge other than the quadrupole mass spectrometer.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: February 19, 2008
    Assignee: Vaclab Inc.
    Inventors: Fumio Watanabe, Reiki Watanabe
  • Patent number: 7329154
    Abstract: An electrical connector includes a housing and a plurality of terminals having a plate shape to be attached to the housing in parallel with a narrow pitch. The plurality of the terminals has holes at opposing portions thereof in a pitch direction such that opposing areas between adjacent terminals is reduced. The housing has a groove bridging over the plurality of the terminals in the pitch direction such that a space is formed between the adjacent terminals.
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: February 12, 2008
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Ryozo Koyama
  • Patent number: 7329818
    Abstract: In a transmission circuit board, ground terminal portions (10) are disposed at every other two rows in both end columns. Each of signal circuit layers (20) includes at least a pair of adjacent signal connecting portions electrically connected to a pair of the wiring portions (21, 22) arranged in parallel in a row direction and the column direction different from those on an adjacent signal circuit layer. Each of the ground layers is electrically connected to at least one of the ground terminal portions (10) in the both end columns.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: February 12, 2008
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Tsutomu Matsuo
  • Patent number: 7323394
    Abstract: A method of producing an element separation structure includes the steps of: forming a first thermal oxide film on the substrate; forming a silicon nitride film on the first thermal oxide film; removing the first thermal oxide film and the silicon nitride film in an element separation structure forming region; forming a groove portion in the element separation structure forming region; forming a groove portion oxide film in the groove portion; forming a pre-filling oxide film for filling the groove portion; removing the pre-filling oxide film; forming a resist layer on the silicon nitride film and the pre-filling oxide film; forming a resist mask on the element separation structure forming region; removing the silicon nitride film and the first thermal oxide film; forming a second thermal oxide film on the substrate; and removing the second thermal oxide film and leveling the pre-filling oxide film to form a filling portion.
    Type: Grant
    Filed: September 15, 2005
    Date of Patent: January 29, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Taikan Iinuma
  • Patent number: 7323352
    Abstract: A light waveguide element is made by forming only an upper clad layer (40) and a core layer (32) without etching an optical axis height-adjusting sections. By using plasma chemical vapor deposition (CVD) which is good at controlling the film thickness, it is possible to provide without difficulty a light waveguide element with a height-adjusting section that has a precise film thickness, making it possible to provide precise optical axis vertical alignment upon mounting. By forming alignment markers in the same photolithography as that of the core formation, it is possible to provide precise horizontal optical axis alignment.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: January 29, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Yutaka Uno
  • Patent number: 7320606
    Abstract: The terminals of a pair of connectors are made by deforming sheet metal in the thicknesswise direction so that they are located within an interference area prior to connection. The terminal (12) of a connector (10) has a flat indentation (12B-1), while the terminal (22) of another connector (20) has a projection (22A-1) within an area corresponding to the flat indentation (12B-1). The flat indentation (12B-1) and the projection (22A-1) are located within the interference area upon connection.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: January 22, 2008
    Assignee: Hirose Electric, Co., Ltd.
    Inventor: Kazuya Midorikawa
  • Patent number: 7321745
    Abstract: A developer supply device provided is in contact with a developer carrying device. It comprises a surface member having at least one opening elongated in an axial direction of the developer supply device. The number of cellular walls counted in the circumferential direction is increased without increasing the number of openings so that the power of scraping the developer is increased. As a result, the dirty background on the print is minimized, thus enhancing the image quality.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: January 22, 2008
    Assignee: Oki Data Corporation
    Inventor: Masahiro Kawano
  • Patent number: 7320552
    Abstract: An image forming apparatus, which is able to output menu items and set values provided for the respective menu items, outputs the set value changed from the factory default set value and the menu item corresponding to the set value distinctly from unchanged set values and menu items corresponding to the unchanged set values, thereby minimizing the time and errors in checking the changed menu item and set value.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: January 22, 2008
    Assignee: Oki Data Corporation
    Inventor: Tomio Tanaka
  • Patent number: 7318746
    Abstract: A card socket assembly includes a plurality of sockets situated in multiple stages for receiving cards and a pair of fixing members disposed at both sides of the sockets for fixing the sockets to a circuit board. Each of the fixing members includes a fixing portion to be fixed to the circuit board and a holding portion for holding the socket. The holding portion of one of the fixing members includes a first holding member for holding all of the sockets. The holding portion of the other of the fixing members includes a second holding member for holding one of the sockets and an elastic holding member for holding the others of the sockets separately and elastically.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: January 15, 2008
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Masakazu Ezaki
  • Patent number: 7314385
    Abstract: A cover equipped electrical connector includes a housing (11) to be provided on a circuit board (P); a terminal (20) having a contact section (23) and a connection section (24) projecting from the housing (11) onto the circuit board (P); a pressure member (13) movable between an open position where a flat type cable is inserted into the housing (11) and a closed position where the pressure member (13) presses the flat type cable against the contact section (23); a cover member (30) movable between a stand-by position where the connection section (24) is exposed and a cover position where it covers the connection section (24); and a support member (36) for supporting the pressure member (13) and the cover member (30).
    Type: Grant
    Filed: September 15, 2005
    Date of Patent: January 1, 2008
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Hidehiro Tsukumo
  • Patent number: 7311557
    Abstract: A receptacle electrical connector (30) for receiving an electrical connector (10) having a resilient arm (14), includes a receptacle housing (31) having at least one peripheral wall (34); and at least one first cut-off portion (38) provided in the peripheral wall (34) at a position corresponding to that of the resilient arm (14) to permit an insertion of the resilient arm of the electrical connector.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: December 25, 2007
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Takayuki Oma, Takeshi Miyazaki, Hirokazu Umehara
  • Patent number: 7310325
    Abstract: A mobile terminal device searches a beacon signal sent from an access point through a wireless LAN, and obtains beacon frame information for certification and connection permission. The mobile terminal device then holds network information necessary for data communication with the access point, and measures a period of time between each time the data communication is performed. The mobile terminal device terminates electric power supplied to hardware for performing the data communication with the access point when the data communication is not performed within a predetermined period of time and network connection is terminated. The electric power is supplied to the hardware when it is necessary to send data to the access point through an input operation of the mobile terminal device while the electric power to the hardware is terminated. Accordingly, the mobile terminal device can be frequently disconnected from the network for a very short period of time.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: December 18, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Kohta Maeno
  • Patent number: 7307434
    Abstract: The voltage application probe (54) and the voltage measurement probe (56) are connected to the voltage application pad (74) and the voltage measurement pad (76) of the semiconductor device (70). The voltage application pad (74) and the voltage measurement pad (76) are connected by the conductor (78), measuring the voltage applied to the voltage application pad (74) through the voltage measurement probe (56). The voltage compensation circuit (14) in the voltage development device (10) operates to make the voltage applied to the voltage application pad (74) equal to the set voltage for the voltage development device (10). Even when the resistance between the voltage application probe (54) and the voltage application pad (74) increases, the accurate setting voltage is applied to the voltage application pad (74).
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: December 11, 2007
    Assignee: Oki Electric Industry Co., Ltd
    Inventor: Shinobu Watanabe
  • Patent number: 7306485
    Abstract: A waterproof device includes a first housing member for covering a front portion of a connector from which a cable extends rearwardly; an elastic member for covering at least a portion of the cable; a cylindrical second housing member attached to the first housing member such that it covers and presses the elastic member against the cable; and a third housing member detachably attached to the first housing member so as to press the second housing member against the first housing member such that the second housing member covers a rear portion of the connector.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: December 11, 2007
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Yasuhiro Masuzaki