Abstract: An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.

Abstract: A method and apparatus to non-interactively test telephone networks and more specifically to localize faults such as resistive faults in the subscriber loop of the telephone network is presented. The method and apparatus determine whether the fault is in the tip line or ring line of a phone line. The existence of a fault voltage, if any, is also determined. The resistance of the tip line to ground and the resistance of the ring line to ground is measured. A fault resistance is calculated from this information, from which the location of the fault is determined.

Abstract: An electro-optical connector is described that provides a separable electrical interface for connecting to a circuit board. The optical connection between the fiber and the connector are semi-permanent. Also described is an electro-optical system that transfers signals between two circuit board over an optical fiber where the separable interface within the system is electrical rather than optical. Further described is a fixture with pivoting actuation and retraction for connecting a z-axis pressure mount connector to a circuit board.

Abstract: An electrical connector for transferring a plurality of differential signals between electrical components. The connector is made of modules that have a plurality of pairs of signal conductors with a first signal path and a second signal path. Each signal path has a pair of contact portions, and an interim section extending between the contact portions. For each pair of signal conductors, a first distance between the interim sections is less than a second distance between the pair of signal conductors and any other pair of signal conductors of the plurality. Embodiments are shown that increase routability.

Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.

Abstract: A high speed, high density electrical connector for use with printed circuit boards is described. The connector is manufactured with wafer assemblies that are supported by a stiffener. Each wafer includes two pieces; a first piece supports both signal and ground conductors and a second piece supports signal conductors. The disclosed embodiments are principally configured for carrying differential signals, though other configurations are discussed. For differential signals, the signal conductors are arranged in pairs. The two pieces are attached together such that the signal pairs are formed with the broadside of, the conductors disposed adjacent. The connector attaches to at least one circuit board using pressure mounted contacts.

Abstract: An optical backplane assembly made from a backplane and daughter cards attached to the backplane. The backplane includes optical vias coupled to optical signal traces in the backplane. Reflective elements are positioned in the vias to direct the optical signals to optical traces on the daughter cards. The required precision to position the reflective elements is achieved by determining the centers of the optical signal traces. Light emitting elements within the backplane are used to determine the locations of the optical signal traces.

Abstract: The present invention includes a mechanism for applying expert knowledge and machine-learning routines to a continuous stream of information. The present method comprises learning a set of dependability models, one for each classification model, that characterize the situations in which each of the classification models is able to make correct predictions. At appropriate intervals the method produces new fault localization knowledge in the form of decision-tree based classification and dependability models. Such knowledge is used to enhance the existing classification knowledge already available. Each of these classification models has a particular sub-domain where it is the most reliable, and hence the best choice to use. For future unlabeled examples, these dependability models are consulted to select the most appropriate classification model, and the prediction of that classification model is then accepted.

Abstract: A high speed, high density electrical connector for use with printed circuit boards is described. The connector is in two pieces, each piece including columns of signal contacts and shield plates which interconnect when the two pieces are mated. The shield plates are disposed in each piece of the connector such that, when mated, the shield plates are substantially perpendicular to the shield plates in the other piece of the connector. The shields have a grounding arrangement that is adapted to control the electromagnetic fields for various system architectures, simultaneous switching configurations and signal speeds. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer.

Abstract: An electrical connector for transferring a plurality of differential signals between electrical components. The connector is made of modules that have a plurality of pairs of signal conductors with a first signal path and a second signal path. Each signal path has a pair of contact portions, and an interim section extending between the contact portions. For each pair of signal conductors, a first distance between the interim sections is less than a second distance between the pair of signal conductors and any other pair of signal conductors of the plurality. Embodiments are shown that increase routability.

Abstract: A method tests a subscriber line. The method includes providing a classifier to predict a performance characteristic of the line based at least in part on a value of an auxiliary variable. Each value of the auxiliary variable represents a property of the line. The method also includes performing electrical measurements on the subscriber line, using the measurements to predict a value of the auxiliary variable, and predicting the performance characteristic of the line. The act of predicting the characteristic applies the classifier to the predicted value of auxiliary variable.

Abstract: A reed relay or other device is connected electrically in series within a signal channel. The signal channel can include a first length of transmission line separated from a second length of transmission line. Both lengths may be of the microstrip type and have a controlled characteristic impedance. A first signal lead of the device electrically connects the lengths of transmission line. A first branch of the first signal lead is connected to the first length of transmission line, and a second branch of the first signal lead is connected to the second length of transmission line. The signal leads are electrically connected to each other at a location adjacent an operative portion of the devices. The series inductance of the first signal lead substantially cancels the shunt capacitance of the reed to substantially maintain the characteristic impedance of the transmission line.

Abstract: A telecommunication test network including both a broadcast network and a point-to-point network is disclosed. The test network includes a programmable test system controller coupled to the broadcast network, a plurality of remote measurement units coupled to the point-to-point network, and a gateway computer linking the broadcast and point-to-point networks. The test system controller is programmed to establish communication channels with the remote measurement units, thereby enabling the test system controller to control the remote units and to analyze parameters measured by the remote units. These communication channels are established using standard protocols and without requiring custom programming in the gateway computer.

Abstract: A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk.

Abstract: A module for use in automatic test equipment is disclosed. The module is especially useful for performing power measurements on high frequency devices. The module includes a power sensor and a plurality of EEPROM's that store reflection coefficient data for the power sensor. Computerized control circuitry in the automatic test equipment uses the stored data to reduce impedance mismatch uncertainties in the power measurements.

Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.

Abstract: A method detects a fault in a subscriber line having two wires with separate input impedances. The method includes driving the subscriber line from one end with an alternating voltage, making one-ended electrical measurements on the driven liner and determining from the measurements a quantity proportional to the phase difference of the two input impedances. The method also includes identifying a fault in response to the phase difference having a signature associated with presence of a fault in the line.

Abstract: A method and automatic test system for determining qualification of a twisted pair transmission line to propagate data signals. The method includes measuring phase imbalance in the twisted pair transmission line. The phase imbalance is determined by resistance imbalance in the twisted pair transmission line. The resistance imbalance is determined by applying a common mode voltage to the twisted pair transmission line; and, determining phase imbalance in the twisted pair in response to the applied common mode voltage. The method includes applying a common mode voltage to the twisted pair transmission line; determining phase imbalance if the twisted pair in response to the applied common mode voltage; detecting a peak in the determined phase imbalance; determining a frequency of the detected peak; determining line qualification in accordance with the determined frequency.

Abstract: Analog test instrument architecture for performing functional testing of electronic circuit assemblies is disclosed. The analog test instrument includes a plurality of identical channels, each channel including circuitry for driving test stimuli and measuring responses at one node of a circuit assembly under test. The driver and measurement circuitry in each channel implement functions that traditionally have been implemented in a test system using discrete instruments. The analog test instrument further includes a master clock reference, which is used for synchronizing the operation of the driver and measurement circuits. Each channel further includes triggering circuitry for distributing trigger events within the channel and to the other channels; and, an input buffer, which is shared by the measurement circuits in the channel. The synchronized operation, distributed trigger events, and shared input buffers are used to improve the correlation of measurements made during functional testing.

Abstract: A self retained pressure connector is provided that includes a spring action contact surface at a first end and a compliant interference fit contact surface at a second end. The compliant interference fit contact is supported within a conductive hole in a printed circuit board and the spring action surface contact provides an electrical connection to a conductive element disposed on a second surface. The conductive element may, in alternate embodiments, be a surface pad on the second surface or a second self retained pressure connector rotated ninety degrees from the first self retained pressure connector. A differential self retained pressure connection is also described in which a dielectric material is used to electrically isolate a first half of the connector from a second half of the connector.