Patents Represented by Attorney TraskBritt, PC
  • Patent number: 7604072
    Abstract: Drill bits and methods for sampling sensor data associated with the state of a drill bit are disclosed. A drill bit for drilling a subterranean formation comprises a bit body and a shank. The shank further includes a central bore formed through an inside diameter of the shank and configured for receiving a data analysis module. The data analysis module comprises a plurality of sensors, a memory, and a processor. The processor is configured for executing computer instructions to collect the sensor data by sampling the plurality of sensors, analyzing the sensor data to develop a severity index, comparing the sensor data to at least one adaptive threshold, and modifying a data sampling mode responsive to the comparison. A method comprises collecting sensor data by sampling a plurality of physical parameters associated with a drill bit state while in various sampling modes and transitioning between those sampling modes.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: October 20, 2009
    Assignee: Baker Hughes Incorporated
    Inventors: Paul E. Pastusek, Eric C. Sullivan, Daryl L. Pritchard, Keith Glasgow, Tu Tien Trinh, Paul J. Lutes
  • Patent number: 7600589
    Abstract: A shank configuration for rotary drill bits, is disclosed for positioning of the shank in relation to the bit body. A tapered surface or feature of the shank may be configured and sized to matingly engage a complementarily shaped surface or feature of the drill bit body and thereby become centered or positioned in relation thereto. A deformable element may be disposed between the shank and bit body. Also, the shank may comprise a material having a carbon equivalent of less than about 0.35%. A multi-pass weld procedure may be employed to affix the shank and bit body to one another wherein welds may be formed so that one weld originates at a circumferential position that differs from the origination circumferential position of its immediately preceding weld by at least about 90%. Further, a stress state may be developed within the multi-pass weld. A method of manufacture is also disclosed.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: October 13, 2009
    Assignee: Baker Hughes Incorporated
    Inventors: Anton F. Zahradnik, Eric C. Sullivan, R. Scot Smith, Daniel E. Ruff, Danielle V. Roberts, Alan J. Massey
  • Patent number: 7594552
    Abstract: An expandable reamer apparatus and methods for reaming a borehole, wherein a laterally movable blade carried by a tubular body may be selectively positioned at an inward position and an expanded position. The laterally movable blade, held inwardly by blade-biasing elements, may be forced outwardly by drilling fluid selectively allowed to communicate therewith by way of an actuation sleeve disposed within the tubular body. Alternatively, a separation element may transmit force or pressure from the drilling fluid to the movable blade. Further, a chamber in communication with the movable blade may be pressurized by way of a downhole turbine or pump. A ridged seal wiper, compensator, movable bearing pad, fixed bearing pad preceding the movable blade, or adjustable spacer element to alter expanded blade position may be included within the expandable reamer. In addition, a drilling fluid pressure response indicating an operational characteristic of the expandable reamer may be generated.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: September 29, 2009
    Assignee: Baker Hughes Incorporated
    Inventors: Steven R. Radford, Kelly D. Ireland, Daryl L. Pritchard
  • Patent number: 7557452
    Abstract: A conductive structure configured to connect a contact pad of a semiconductor device with a corresponding contact pad of a substrate. The conductive structure includes two interconnectable members, one securable to each of the corresponding contact pads. Each member includes a dielectric jacket having an aperture that laterally confines conductive material of a conductive center thereof over the contact pad to which the member is secured. The conductive center of a female member of the conductive structure only partially fills the aperture of the jacket thereof so as to form a receptacle for an end of the male member of the conductive structure. One or both of the male and female members may also be configured to limit the insertion of the male member into the receptacle of the female member. The members of the conductive structure may be preformed structures which are attached to a surface of a semiconductor device or other substrate.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: July 7, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Vernon M. Williams, Ford B. Grigg, Bret K. Street
  • Patent number: 7557603
    Abstract: A method, system, and output driver calibration circuit determine calibration values for configuring adjustable impedance output drivers. The calibration circuit includes a pull-up calibration circuit configured to generate an averaged pull-up count signal for calibrating p-channel devices in the output driver with the averaged pull-up count signal being an average of a plurality of pull-up count signals. The calibration circuit further includes a pull-down calibration circuit configured to generate an averaged pull-down count signal for calibrating n-channel devices in the output driver with the averaged pull-down count signal being an average of a plurality of pull-down count signals.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: July 7, 2009
    Assignee: Micron Technology, Inc.
    Inventor: Dong Pan
  • Patent number: 7552682
    Abstract: A fuze for a weapon configured as a projectable device is provided to reduce the mechanical amplification of impact and penetration shock to a fuze-mounted accelerometer when a projectable device including the fuze encounters a target. The fuze includes a fuze housing having an outer surface, a flange extending radially from the outer surface of the fuze housing, and an acceleration sensor connected to the flange. The flange may include one or more axial holes to enable attachment of the fuze to a projectable device. A penetrating weapon projectable device and a method for installing a fuze for a projectable device are also provided.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: June 30, 2009
    Assignee: Alliant TechSystems Inc.
    Inventors: Stanley N. Schwantes, Bradley M. Biggs, Michael A. Johnson
  • Patent number: 7549374
    Abstract: A fuze mounting assembly for a penetrating weapon configured as a projectable device, the fuze mounting assembly having fasteners, a fuze well and a fuze. The fuze includes an integral bolt flange for securing to the fuze well with the fasteners, wherein an amplification of acceleration of less than 3.0 is satisfied when the penetrating weapon is subjected to impact and penetration shock. Additionally, a projectable device having the fuze is provided. Also, a fuze mounting and a method for mounting a fuze are provided.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: June 23, 2009
    Assignee: Alliant Techsystems Inc.
    Inventors: Stanley N. Schwantes, Bradley M. Biggs, Michael A. Johnson
  • Patent number: 7549485
    Abstract: An expandable reamer apparatus and methods for reaming a borehole are disclosed, including at least one laterally movable blade carried by a tubular body selectively positioned at an inward position and an expanded position. The at least one laterally movable blade, held inwardly by at least one blade-biasing element, may be forced outwardly by drilling fluid selectively allowed to communicate therewith or by at least one intermediate piston element. For example, an actuation sleeve may allow communication of drilling fluid with the at least one laterally movable blade in response to an actuation device being deployed within the drilling fluid. Alternatively, a chamber in communication with an intermediate piston element in structural communication with the at least one laterally movable blade may be pressurized by way of a movable sleeve, a downhole turbine, or a pump.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: June 23, 2009
    Assignee: Baker Hughes Incorporated
    Inventors: Steven R. Radford, Kelly D. Ireland, Robert A. Laing, Daryl L. Pritchard, James L. Overstreet, Greg W. Presley, Scott S. Shu, Mark E. Anderson, Mathias Mueller
  • Patent number: 7516568
    Abstract: A calendar is formed of a plurality of substrates. A first substrate carries indicia thereon which identifies selected time periods, such as days or months of the year. A second substrate is positioned adjacent to the first substrate. The second substrate defines a plurality of cavities dimensioned to individually retain a respective information carrying article, such as a web. Each of the cavities is corresponding supplied with a respective information carrying article. Each indicia on the first substrate is positionally associated with a respective cavity in the second substrate. A third substrate, positioned adjacent to the second substrate, is positioned to retain the information carrying articles releasably within the second substrate.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: April 14, 2009
    Inventor: Paul Wightman
  • Patent number: 7496990
    Abstract: The present invention relates to a lawn mower with a handle assembly comprising a lower frame and an upper frame which can be rotated to adjust its position with respect to the lower frame.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: March 3, 2009
    Assignee: Positec Power Tools (Suzhou) Co., Ltd
    Inventor: Yong Qiao
  • Patent number: 7355273
    Abstract: An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and which extend from an active surface to a back surface of the semiconductor substrate. The redistribution lines are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.
    Type: Grant
    Filed: April 20, 2005
    Date of Patent: April 8, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Timothy L. Jackson, Tim E. Murphy
  • Patent number: 7339423
    Abstract: The present invention comprises switched capacitor amplifiers including positive feedback on semiconductor devices, wafers, and systems incorporating same and methods for amplifying signals using positive feedback, while maintaining a stable gain and producing an improved signal-to-noise ratio. One embodiment includes a switched capacitor amplifier comprising a CMOS amplifier, a feed-in switched capacitor, and a feedback switched capacitor. The feed-in switched capacitor couples an input signal to the non-inverting input of the CMOS amplifier. Similarly, the feedback switched capacitor couples the amplifier output to the non-inverting input to create a positive feedback loop. A capacitance of the feedback switched capacitor relative to a capacitance of the feed-in switched capacitor comprises a feedback proportion.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: March 4, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Leonard Forbes, David R. Cuthbert
  • Patent number: 7329945
    Abstract: A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: February 12, 2008
    Assignee: Micron Technology, Inc.
    Inventor: Walter L. Moden
  • Patent number: 7326354
    Abstract: The invention relates to an active barrier (1) and a method for its use. The active barrier (1) is used to contain and to collect polluting material floating over bodies of water, such as river, lakes, lagoons, bays or open oceans. More specifically, the active barrier is used in a situation in that pollution is caused by a liquid lighter than the water and immiscible with it, such as oil. The invention comprises a plurality of floating containment modules (3) which are interlinked to form the active barrier (1). When the latter is used in the open ocean it is required to use two supporting units (2), e.g. two vessels, to surround the mass of floating polluting material. Each containment module (3) is provided with collecting tubes (33), into which impeller modules (411) displace in a predetermined direction. The impeller modules (411) may be continuous or spaced apart.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: February 5, 2008
    Inventor: Rodrigo Carvalho Ferreira
  • Patent number: 7307353
    Abstract: A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminates over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: December 11, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Hugh E. Stroupe
  • Patent number: 7304516
    Abstract: An apparatus and method for generating phase-related clocks are disclosed. A clock input is delayed by an alignment magnitude to generate a first phase signal. The first phase signal is delayed by the phase alignment magnitude to generate a first phase delay signal. The clock input is delayed by a phase delay magnitude to generate a second phase signal and the second phase signal is delayed by about the phase delay magnitude to generate a last phase delay signal. A phase difference is detected between the first phase delay signal and the last phase delay signal and adjustments are made to at least one of the phase delay magnitude and the alignment magnitude.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: December 4, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Gary M. Johnson
  • Patent number: 7297637
    Abstract: A method for grounding a semiconductor substrate pedestal during a portion of a high voltage power bias oscillation cycle to reduce or eliminate the detrimental effects of feature charging during the operation of a plasma reactor.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: November 20, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Chuck E. Hedberg, Kevin G. Donohoe
  • Patent number: 7294790
    Abstract: Apparatus is provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: November 13, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Mark T. Van Horn, Richard N. Hedden, David R. Cuthbert, Aaron M. Schoenfeld
  • Patent number: D594631
    Type: Grant
    Filed: January 28, 2009
    Date of Patent: June 23, 2009
    Assignee: Nike, Inc.
    Inventor: Dana Reinisch
  • Patent number: D600872
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: September 22, 2009
    Assignee: Inhomevations
    Inventor: Sandra Phillips