Abstract: An integrated circuit die or chip may be positioned within an integrated circuit package by providing a spacer connected to the die and extending upwardly therefrom. When the die is overmolded, the spacer contacts the mold and spaces the die with respect to the mold. By forming the spacer using conventional wire bonding techniques, no additional process steps are necessary in forming the spacer and no additional parts are needed. The spacer wire bonds may be formed with wires which extend upwardly above the remaining wires, protecting the remaining wires from being contacted by the mold or from being positioned too close to the upper surface of the resulting molded package.

Abstract: A method for testing an electronic device includes causing the device to perform an operation. Using circuitry of the device, a duration of time is asynchronously measured in association with the step of causing. The operation is controlled in response to the expiration of the duration.

Abstract: A self-aligning global positioning system (GPS) antenna aligns with the earth's surface so as to maintain the integrity of the GPS tracking signal received by a GPS receiver. The antenna element may be maintained within a sealed container which floats inside a spherical reservoir filled with liquid. As a result, the GPS antenna moves along the inside surface of the spherical reservoir in a buoyant arrangement which self-levels the active element of the antenna with the earth's surface.

Abstract: The present invention, in one embodiment, is a method for moving a vacuum lifter off an object. The method includes releasing a vacuum holding a surface of the object against a sealing plate of the vacuum lifter and rolling the vacuum lifter along the surface on a roller. The roller is connected to the vacuum lifter.

Abstract: An encapsulated integrated circuit package uses a heat dissipating dam which is secured about the die to the die support. A dam constrains the outward movement of liquid glob top material during the manufacturing process. In addition, the dam provides heat dissipating properties for the integrated circuit package and may improve the structural integrity of the package as well. The dam may be efficiently applied to the die support using automated techniques, such as adhesive tape bonding.

Abstract: A voltage regulator includes an energy storage element to produce an output voltage, a switch and a controller. The switch energizes and de-energizes the energy storage element at a switching frequency. The controller is coupled to the switch and receives an indication of the output voltage. The controller controls the switching frequency to regulate the output voltage based on the indication.

Abstract: A semiconductor assembly includes two leads, a primary die and a secondary support structure. Impedance networks of the secondary support structure establish an impedance between each lead and a different bond pad of the primary die. Although the distances between each bond pad and lead are substantially different, the impedances between each bond pad and lead are substantially the same.

Abstract: A nonvolatile memory cell which is highly scalable includes a cell formed in a triple wall. The control gate is negatively biased. By biasing the P-well and drain (or source) positively within a particular voltage range when erasing, GIDL current and degradation from a hole trapping can be diminished and hence scalable technology may be achieved.

Abstract: A hand-operated juicer includes a base, an upright support mounted on the base, an upper squeeze unit that is connected to an upper end of the upright support, and a lower squeeze unit that is disposed below the upper squeeze unit above the base. The upper squeeze unit has a manually operable rod member and a squeeze cap that is connected to a lower end of the rod member. The rod member is movable vertically to enable the squeeze cap to abut against the lower squeeze unit. The squeeze cap is made of stainless steel, and has an upper socket portion, a lower skirt portion diverging downwardly from the upper socket portion, and a tubular adaptor that is mounted removably in the upper socket portion and that is connected detachably to the lower end of the rod member.

Abstract: A method and apparatus is described for compensating circuits. A different locked loop circuit is placed adjacent to a different one of each of the circuits to be compensated. A periodic signal is distributed to each of the locked loop circuits, and each locked loop circuit generates an output signal that is indicative of the frequency of the signal. The output signal of each locked loop circuit is used to compensate the adjacent circuit.

Abstract: Apparatus and method of tracking a wordline signal using a tracking circuit having a first detector biased between a first power supply voltage and a ground voltage, and a second detector biased between a second power supply voltage and the ground voltage. The first power supply voltage is greater than the second power supply voltage. The wordline signal is driven to the first power supply voltage.

Abstract: A chassis which comprises a first frame and a second frame is provided. The first frame includes a front surface and a pair of first flanges formed on opposing edges of the front surface. The second frame includes a pair of side surfaces. Each side surface has an edge with a second flange and a plurality of aligned guide elements. The second flanges and the guide elements define guide channels for slidably receiving the first flanges. A cover assembly for the chassis comprises a panel having a first inner surface, a hook, and a standoff projecting from the first inner surface. The hook has a leg portion and an arm portion which may be inserted into a slot in one of the surfaces of the chassis.

Abstract: A disposable screen used in a screen printing system for printing onto electronic devices is formed of a non-metallic material. The screen is patterned from a foil. The material can be selected from a group consisting of plastic, nylon, paper, and resin. A disposable screen is mounted in the screen printing system, after which a paste material (including solder or an adhesive such as polyimide, bismaleimide, or a thermoset or thermoplastic compound) can be printed through the screen to a target structure. The used screen is discarded after one or more uses and a new screen is mounted in the screen printing system. A teaching sheet having a disposable transparent film is also used to set up the screen printing system. The film is detachably attached to a frame. After one or more prints, the used film is detached and replaced with a new film.

Abstract: An equalizer 26 is interposed between a load detecting lever 22 and one end of each plunger 3, 4, a clamp member 23 is provided to position the equalizer at a predetermined position of the load detecting lever 22, a connecting portion rotatably connected to a housing 2 concentrically with respect to a support portion 2a supporting the load detecting lever 22 is provided on the clamp member, an arm 24 is formed at the connecting portion of the clamp member 23, and the arm 24 is supported by the support portion 2a of the housing 2 by using a pin 27 common to the load detecting lever 22.

Abstract: A cardiac lead is provided that is capable of deforming in situ to accommodate difficult myocardial structures. The lead includes a connector for coupling to a cardiac stimulator and a flexible tubular sleeve coupled to the connector. The sleeve is composed of a thermally-sensitive shape-memory polymeric material and is deformable in situ into a permanent shape. An electrode is coupled to the sleeve and a conductor wire is coupled to the connector and to the first electrode.

Abstract: An implantable cardiac defibrillator is provided. The implantable cardiac defibrillator includes a can, a storage cell for powering the defibrillator, and a circuit module disposed in the can for controlling the defibrillator. The circuit module has a first substrate, a first die coupled to the first substrate, a second die, and a second substrate coupled to and disposed between the first die and the second die. The second substrate has a first plurality of conductors to carry electrical signals to and from the first die and a second plurality of conductors to carry electrical signals to and from the second die. The die may be any of a number of types of electronic components, such as power transistors, memory chips, or others. The stacking of the die saves board space, allowing for further miniaturization or incorporation of additional electronic components.

Abstract: A switching regulator for use with a computer system having a power conservation mode includes a switch circuit, a sampling storage device, a sampling circuit and a controller. The switch circuit is coupled to an input voltage source to produce an output voltage, and the switch circuit provides an indication of a parameter of the regulator. When the computer system is not in a power conservation mode, the controller operates the sampling circuit to provide the indication to the sampling storage device at a switching frequency. When the computer system is in the power conservation mode, the controller operates the sampling circuit to continuously provide the indication to the sampling storage device for substantially the duration of the power conservation mode. Based on the indications provided to the sampling storage device, the controller interacts with the switch circuit to regulate the output voltage.

Abstract: Semiconductor devices may be made by forming a silicided layer on a silicon material such as that used to form the extractor of a field emission display. The silicided layer may be self-aligned with the emitter of a field emission display. If the silicided layer is treated at a temperature above 1000.degree. C. by exposure to a nitrogen source, the silicide is resistant to subsequent chemical attack such as that involved in a buffered oxide etching process.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card. The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.