Abstract: A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.
Abstract: A thermal regenerative granular-moving bed apparatus for a gas de-pollutant process includes a plurality of recycling granular material, a heat-and-clean unit, a heat-recycling unit, and a granular material-cleaning unit. The heat-and-clean unit heats the granular material to further heat a polluted gas, de-pollutes the gas, and detains pollutants or particles from the de-polluting. The heat-recycling unit constructed on top of the heat-and-clean unit has the hot up-flowing de-polluted gas heat-exchange with the down-flowing cold granular material. The granular material-cleaning unit transports the granular material from a lower-end of the heat-and-clean unit to an upper end of the heat-recycling unit and re-activates the granular material during the transportation.
Type:
Grant
Filed:
July 28, 2004
Date of Patent:
January 13, 2009
Assignee:
Industrial Technology Research Institute
Inventors:
Ching-Yu Peng, Tzu-Yueh Yang, Hom-Ti Lee
Abstract: A combination structure of base plate and escutcheon comprises a base plate, a fastener and an escutcheon. The base plate has a plate and a ring-like wall surrounding the plate, and the fastener has a fastening portion, a fixing portion and a flexible portion connecting the fastening portion and the fixing portion. The fixing portion is installed on the ring-like wall and the base plate is covered with the escutcheon. The escutcheon has a sidewall, an opening and a limited-portion. The opening is formed on the sidewall and exposes the fastening portion of the fastener. The limited-portion of the escutcheon is restrained by the fastening portion of the fastener to prevent the escutcheon disengaging from the base plate.
Abstract: An auto-focus lens module that uses electromagnetic force as well as spring force as driving force to control movement of the lens for auto-focusing consists of a rectangular base, two copper plates, an insulation spacer, four magnets, a lens holder, a lens, a coil, a spring, and a rectangular top cover. The lens holder, the lens and the coil form a lens set. The spring is sleeved outside the coil and is elastically supporting between the outer circular flange and the top cover while the four magnets are respectively located outside the spring, on four corners of the rectangular case. Thus the components of the lens module according to the present invention are simplified, the volume of the device is minimized, and the lens holder moves stably for focusing.
Abstract: A printhead cleaning device for a large printer provided at a lateral side of a printing rail of the printer, it comprises a base and a swinging platform, wherein the base has four peripheral sides forming a receiving space, the swinging platform is movably and pivotally connected to the base; the swinging platform has thereon a plurality of elongate holes, so that the residual ink on the printhead set can be collected in the receiving space of the base through the elongate holes, every two elongate holes have therebetween a scraper in the shape of a taper sectionally and made of soft material, so that when the base is pushed upwards by a pushing device to its predetermined position, the scrapers on the swinging platform can have scraping actions against the moving printhead of the printhead set.
Abstract: A sprinkling head structure of a sprinkler includes a sprinkling head and a guide section. The sprinkling head is a substantially hollow cylindrical body. A first face of the sprinkling head is formed with multiple first outgoing openings which are annularly arranged. A second face of the sprinkling head is formed with multiple second incoming openings respectively corresponding to the first outgoing openings. The guide section is disposed inside the sprinkling head, including multiple passages and at least one channel. The passages communicate with two faces of the guide section. First ends and second ends of the passages respectively correspond to the first openings and second openings. The channel directly communicates with at least two of the passages. The water flow can be at the same time discharged from at least two of the first openings.
Abstract: A method of forming bump protective collars is disclosed. A wafer has an active surface with a plurality of bonding pads and a passivation layer. A plurality of reflowed bumps are formed over the bonding pads. A photoresist is coated on the active surface. Using the reflowed bumps as a photo mask, the photoresist is exposed and developed. After removing the photoresist, a plurality of bump protective collars are formed on the passivation layer and around the reflowed bumps for improving the reliability of the reflowed bumps.
Type:
Grant
Filed:
September 22, 2006
Date of Patent:
January 6, 2009
Assignee:
Advanced Semiconductor Engineering, Inc.
Abstract: An audio jack includes an insulative housing (10) including a tapered, inclined rear end (13) having four sides wherein two horizontal sides are wider than the other two vertical sides, all four sides being inclined and coupled together; first, second, third, and fourth terminals (21, 22, 23, and 24) disposed in respective grooves (131, 132, 133, and 134) and each having an outer terminal (212, 222, 231, or 241) inclined and projected from the rear end (13); a plate (20) in the housing (10) served as a plug stopper; and a metal shell (30) enclosing the housing (10) and including inclined legs 32. The housing (10) further comprises two internal cavities (1311, 1321) positioning two of the first, second, third, and fourth terminals (21, 22, 23, and 24) respectively. The third and fourth terminals (23 and 24) are served as a switch upon insertion and removal of a plug (4).
Abstract: A flip-chip package comprises a substrate with an opening. A dummy die is disposed onto the substrate corresponding to the opening so as to form a composite chip carrier with a chip cavity. The dummy die has a redistribution layer which includes a plurality of flip-chip pads for flip-chip connection of a chip and a plurality of connecting pads around the dummy die for connecting the substrate. The dummy die mounts at least a chip by flip chip connection for being an electrical interface medium between the chip and the substrate in order to achieve thinner package thickness, high heat dissipation, fine pitch flip-chip mounting and eliminating flip-chip stress on the chip.
Type:
Grant
Filed:
August 27, 2003
Date of Patent:
January 6, 2009
Assignee:
Advanced Semiconductor Engineering, Inc.
Abstract: A multifunctional forceps set which integrates two important surgical procedures of incision and ligation into a continuous working procedure. The forceps set is co-used with two loop ligatures formed of braided sutures and transfigured from a surgeon's knot. In use, the loop ligatures are side by side loaded in the forceps mouth of the forceps and controlled by the forceps to minify the size of the loop and accomplish ligation function. The forceps set is developed from consolidation of surgical scalpel, forceps and device simulating finger's functions. Also, the forceps set can rapidly perform the procedures of double grasping, incision between grasping, proper ligating divided pedicles and cutting residual sutures of post-ligation. The forceps set enables surgeons to use familiar technique in a challenging operative field such as endoscopic surgery.