Abstract: A vibration absorption for a fan includes a frame, fans, positioning outer jackets, and pins, wherein the positioning outer jacket is inserted into a latching hole of fan, an outer-projected circular ring of pin is attached to a first groove of frame, and a circular ring of ping is attached to a second groove of frame, so as to reduce a vibration force of fans and to increase a flow rate and a flow speed of air flowing out of the fans.

Abstract: A mechanism for adjusting a saddle of a fitness apparatus that employs two telescopic adjusting elements for an easy adjustment of the inclination of the saddle tube of the fitness apparatus as well as the position of the saddle in all directions. Moreover, both of the telescopic adjusting elements each are provided with a positioning element and a plurality of the adjusting holes for an easy locking and a rapid releasing effect.

Abstract: An amorphous silicon (Si) film is taken to form a metal silicide of Si—Al(aluminum) under a high temperature. Al atoms is diffused into the amorphous Si film for forming the metal silicide of Si—Al as nucleus site. Then through heating and annealing, a microcrystalline or nano-crystalline silicon thin film is obtained. The whole process is only one process and is done in only one reacting chamber.

Abstract: A method for making an optical device comprises steps of: 1) Providing a substrate, a polymerizable liquid crystal material having a plurality of liquid crystal molecules, and a mold having rows of trenches; 2) Imprinting the polymerizable liquid crystal material on said substrate by the mold; 3) Proceeding a cross-linking process to cure the liquid crystal material so as to have long axes of the liquid crystal molecules be aligned along the rows of trenches. The optical device made from the present method conforms to an A-plate type retardation plate. Moreover, the optical device is capable of aligning liquid crystal molecules adjacent to it.

Abstract: A computer casing structure is composed of a chassis, which is provided with a front panel on which is mounted with a lower long through-hole and an upper long through-hole; a metallic shield, which is punched with a plurality of through-holes and is locked and positioned into the lower long through-hole; a CD-ROM module, which is positioned at a rear side of the upper long through-hole; and a main board, a front edge of which is provided with a plurality of I/O connection ports, and which is fixed in the chassis, with the I/O connection ports being corresponding to the through-holes of the metallic shield. By mounting the CD-ROM module, a hard disk drive module, and I/O connectors on the same front panel and installing a data transmission port on a rear panel, convenience in operation is developed, and an effect of ventilation and heat dissipation is improved.

Abstract: An airtight mechanism of a mold-holding unit for forming a vacuum environment around a held mold, including: a base section; an elongated support section, one end of the support section being vertically fixedly connected with the base section; a top section bridged between the other end of the support section above the base section and in alignment therewith, a mold-holding space being defined between the top section and the base section, in which the mold is held; an airtight tubular chamber reciprocally linearly movable along an axes of the support section between an airtight position and an open position, whereby when positioned in the airtight position, the airtight tubular chamber is positioned in the mold-holding space around the held mold; a first closed end piece disposed on the base section and having a first closed connecting loop, whereby one end of the airtight tubular chamber in the airtight position coaxially airtight abuts against the first closed connecting loop; and a second closed end piece

Abstract: A gateway includes a local area network (LAN) port, a mobile communication interface and a controlling module. The gateway uses the LAN port to communicate with a LAN outside the gateway, and uses the mobile communication interface connecting to an mobile communication apparatus to communicate with a telecommunication network outside the gateway. The controlling module built in the gateway includes a detecting module and a driving module. The detecting module is used for detecting if the mobile communication apparatus connects to the mobile communication interface. As soon as the detecting module finds the mobile communication apparatus, the driving module is activated to utilize the mobile communication apparatus to communicate with the telecommunication network, and thereby the gateway can establish a communication between the LAN and the telecommunication network.

Abstract: A gas sprayer mounted on an edge removing robotic arm is disclosed, wherein the edge removing robotic arm circles around along the edges of a substrate and sprays a chemical solvent over the edge surface of the substrate to dissolve photoresist materials attached to the edges of the substrate; the edge removing robotic arm has a pumping conduit for sucking out the chemical solvent sprayed over the surface of the substrate and dissolved photoresist particles; the gas sprayer is mounted on the top of the edge removing robotic arm and comprises a hooked nozzle extending forward around the front end of the edge removing robotic arm and facing an opening of the pumping conduit to spray gas out so as to prevent the chemical solvent sprayed out from the edge removing robotic arm from splashing onto the interior of the substrate.

Abstract: A method and a circuit for preventing over-heat of heat-generating device which are provided with a trigger circuit and a microprocessor on a heater circuit. And the trigger circuit is connected with a power source and a heat-generating device for heating the heat-generating device. The above-mentioned heater circuit is connected with a thermo fuse, a resistor and a reactive trigger circuit. Another end of the reactive trigger circuit is connected with the microprocessor for advancedly detecting whether the microprocessor is in abnormal condition. Once the microprocessor is damaged, the power source, the thermo fuse and the resistor make a loop and the resistor is heated to ruin the thermo fuse for terminating heating. Also, when the microprocessor works normally, the heater circuit and a switch for controlling temperature on reactive trigger circuit are detected to determine whether to terminate the heater circuit.

Abstract: A brushless generator has a high rotation speed, a high usage efficiency, no iron loss and a small mechanical loss while the electric power output of the generator is increased

Abstract: A PIFA in one embodiment includes a radiating member including a feed point, a shorting point, a first radiating element having a starting point and a terminating point coiled as a longer path terminated at an outer edge of a ground plane and being open for generating a resonance mode having a low frequency, and a second radiating element having a starting point connected to the starting point of the first radiating element, and a terminating point extended to form a shorter path terminated at the outer edge of the ground plane, the terminating points of the first and second radiating elements adjacent for generating a resonance mode having a high frequency; low and high frequency medium frequency regulators for adjusting resonance frequencies of two different resonance modes a substrate; a feed member; and a shorting member.

Abstract: A substrate improving immobilization of ball pads for BGA packages mainly comprises a substrate core, a plurality of ball pads and a solder resist layer. Each of the ball pads has a metal pad and at least a metal nail. The metal pads are adhered on a surface of the substrate core and the metal nails are embedded into but not penetrate the substrate core. The solder resist layer is formed over the substrate core and exposes the metal pads. By utilizing the shapes of the ball pads to increase bonding area between the ball pads and the substrate core, a separation or crack occurring at the interface between the metal pads and the substrate core can be substantially avoided.