Abstract: A magnetic-guiding laminate is used to improve wireless communication between a transmitter and a receptor disposed on a substrate, regardless of the substrate materials. The laminate can comprise one or more layers of magnetic or non-magnetic material with different magnetic property. For example, the laminate can comprise a paramagnetic layer disposed on a diamagnetic layer, where the paramagnetic layer attracts the magnetic field toward the RFID antenna, and the diamagnetic layer prevents the magnetic field from dispersing in the substrate. Alternatively, the laminate can comprise multiple paramagnetic layers, wherein at least two layers have different magnetic properties, such as different permeability values.

Abstract: Embodiments of the present invention include a composite electromechanical machine which can operate as a motor or a generator (including dynamo or alternator). In an aspect, the present composite electromechanical machine includes at least a double-sided magnetic plane (e.g., rotor or stator) wherein the double-sided magnetic plane includes a plurality of magnet protruding from both sides and exerting substantially equal magnetic field to both sides of the double-sided magnetic plane. The magnets can be permanent magnets or electromagnets having windings. Other embodiments can also be included.

Abstract: An integrated robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly can comprise a multiple end effector for moving a plurality of workpieces, a single end effector for moving a single workpiece, a rotation chuck incorporated on the robot body to provide alignment capability, and an optional identification subsystem for identify the object during transport. The present invention robot assembly can be used in a sorter or stocker equipment, in processing equipment, and a transfer system.

Abstract: The present invention discloses apparatuses and methods for simultaneous viewing and reading top and bottom images from a workpiece. The present ID reader can comprise an enclosure covering a top and bottom section of the workpiece with optical elements to guide the light from the workpiece images to a camera. The optical element can be disposed to receive images from a high angle with respect to the surface of the workpiece. The present ID reader can further comprise a light source assembly to illuminate the image. The light source assembly can utilize a coaxial light path with the images, preferably for bright field illumination. The light source assembly can also utilize a non-coaxial light path, preferably for dark field illumination. In an embodiment, the simultaneous images reaching the camera are separate into two distinct images on two different sections of the camera. In another embodiment, the simultaneous images reaching the camera are superimposed into one image on the camera.

Abstract: Embodiments of the present invention include a composite electromechanical machine which can operate as a motor or a generator (including dynamo or alternator). In an aspect, the present composite electromechanical machine comprises at least double-sided magnetic planes (e.g., rotor or stator) disposed on both sides of a central frames. Other embodiments can also be included.

Abstract: A redundantable robotic mechanism is disclosed for improving reliability of tranport equipment. The redundantable robot assembly typically comprises independent robots with separate controls, motors, linkage arms, or power, thus providing the capability of operation even if parts of the assembly are not operational or when parts of the assembly are removed for repair. The redundantable robot assembly can be also designed to allow in-situ servicing, e.g. servicing one robot when the other is running. The disclosed redundantable robot assembly provides virtual uninterrupted process flow, and thus greatly increases the yield for the manufacturing facility.

Abstract: Embodiments of the present invention include a composite electromechanical machine which can operate as a motor, a generator (including dynamo or alternator), or any combination thereof. In an aspect, the present composite electromechanical machine comprises at least a double-sided magnetic plane (e.g., rotor or stator) to form two rotor/stator pairs, together with a controller to configure the multiple rotor/stator pair. The controller can configure or convert the multiple rotor/stator pairs into motors, generators, or nonoperation, and also can change the windings characteristics of the magnetic planes. The controller can add new functionality and characteristics to the present composite electromechanical machine. Other embodiments can also be included.

Abstract: In an embodiment, the present invention discloses a flexible and reconfigurable architecture with efficient memory data management, together with efficient data transfer and relieving data transfer congestion in an integrated circuit. In an embodiment, the output of a first functional component is stored to an input memory of a next functional component. Thus when the first functional component completes its processing, its output is ready to be accessed as input to the next functional component. In an embodiment, the memory device further comprises a partition mechanism for simultaneously accepting output writing from the first functional component and accepting input reading from the second functional component. In another embodiment, the present integrated circuit comprises at least two functional components and at least two memory devices, together with a controller for switching the connections between the functional components and the memory devices.

Abstract: The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process coats the component surfaces to facilitate the bonding of the bond pads. In another aspect, the present process coats the bond pads with shelled capsules to facilitate the bonding of the bond pads.

Abstract: The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. The process can separate the integrated circuits into an analog portion and a digital portion with the analog portion comprising passive components utilizing dielectric materials different than silicon dioxide and active components utilizing channel materials different than substrate single crystal silicon.

Abstract: The present disclosure provides a methodology for reducing congestion of a processing unit, preferably by configuring a plurality of functional blocks to run in parallel or in series without the influence or input from the processing unit. In an embodiment, the present method chains a plurality of functional blocks together by software so that one functional block starts after the completion of another functional block. The configuration of the chain can be series, parallel, and any combination thereof, arranged to meet the circuit's objective. The chaining can be configured and re-configured, preferably by software input. The chaining can also be performed at design time or at run time. The chaining can also be modified, preferably at design time, but can also be modified at run time.

Abstract: Scalable storage can be achieved with linear array storage of wafers, comprising two linear arrays of storage compartments on opposite walls, with a middle transfer mechanism. Together with a buffer station for automatic material handling system, a scalable bare wafer stocker can provide flexible and uninterrupted services to a fabrication facility.

Abstract: The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process forms interconnect wires on a thermal decomposable adhesive, and after positioning the wires at proper bond pad locations, releases the interconnect wires onto the bond pads.

Abstract: The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process extrudes interconnect wires over a desired location of the bond pads, and then subsequently laser cuts a correct length of the interconnect wires.

Abstract: An integrated high speed robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly typically comprises an end effector for moving the object in and out of a chamber, a rotation chuck incorporated on the robot body to provide centering and theta alignment capability, and an optional identification subsystem for identifying the object during transport. The present invention also discloses a transfer robot system, employing a plurality of integrated robot assemblies; a transfer system where a transfer robot system can service a plurality of connected chambers such as FOUP or FOSB; a front end module (FEM); or a sorter system. Through the use of these incorporated capabilities into the moving robot, single object transfer operations can exceed 500 parts per hour.

Abstract: The invention disclosed herein relates to fuel cell electrode pair assemblies, not having interposing proton exchange membranes, configured to receive and react with liquid anolyte and liquid catholyte microfluidic flowstreams. In one embodiment, the present invention is directed to a fuel cell electrode pair assembly, not having an interposing proton exchange membrane, configured to receive and react with a liquid microfluidic anolyte flowstream (e.g., laminarly flowing methanol solution) and a liquid microfluidic catholyte flowstream (e.g., laminarly flowing nitric acid solution), wherein the fuel cell electrode pair assembly comprises: a porous flow-through anode; a porous flow-by cathode confronting and spaced apart from the anode; and a central plenum interposed between and connected to the anode and the cathode.

Abstract: A radio frequency device comprises a radio frequency transponder having a radio frequency circuit and a radio frequency antenna, and a sensor conductively connected to the radio frequency antenna so that a measurement can be retrieved from the sensor by communicating with the transponder. The radio frequency antenna comprises a first portion which is used primarily for receiving and/or sending of radio frequency signals, and a second portion which is used primarily for conductively connecting the sensor to the first portion of the radio frequency antenna and which enables placing the sensor in a spaced-apart spatial relation to the first portion of the radio frequency antenna.

Abstract: A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low temperature amalgam curing, the chip and the substrate form a flexible substrate IC packaging with high conductivity, controllable interface layer thickness, micron-scale contact density and low process temperature. Adhesion between the chip and the substrate can be further enhanced by coating other areas with non-conducting adhesive.

Abstract: Embodiments of the present invention include a composite electromechanical machine which can operate as a motor or a generator (including dynamo or alternator). In an aspect, the present composite electromechanical machine consists of at least two rotating elements (rotor) and one stationary element (stator) where the two rotating elements are coupled through a gear mechanism. The gear mechanism can combine the torque of the inner and the outer rotor, preferably using helical gears which have lower noise level and higher contact area. The gear mechanism can also act as a locking mechanism to keep the outer rotor in place. The gear mechanism can have a first gear coupled to the inner rotor and a second gear coupled to the outer rotor. In an embodiment, the first and second gears are coupled together to connect the inner and the outer rotors. The gear mechanism can further include a third gear coupled to the double-sided stator.

Abstract: A water vapor ejector comprises a desiccant disposed in a communication path to a green house enclosure. In the day time and under sunlight exposure, the green house enclosure heats up, which dries the desiccant and generates a flow to the outside ambient through a pressure difference. The moisture trapped in the desiccant is then released to the outside ambient. In the night time, the green house enclosure cools, which generates a flow to the inside of the enclosure. The desiccant traps the moisture within the flow, ensuring a moisture-free enclosure. The cycle re-starts in the next morning when the enclosure heats up. The diurnal cycle removes the water vapor present in the enclosure and delivered to the exterior of the enclosure.