Abstract: Systems and methods are disclosed to perform semiconductor processing with a process chamber; a flash lamp adapted to be repetitively triggered; and a controller coupled to the control input of the flash lamp to trigger the flash lamp. The system can deploy a solid state plasma source in parallel with the flash lamp in wafer processing.
Type:
Grant
Filed:
April 21, 2001
Date of Patent:
August 26, 2003
Assignee:
Simplus Systems Corporation
Inventors:
Tue Nguyen, Tai Dung Nguyen, Craig Alan Bercaw
Abstract: A semiconductor processing system includes a chamber adapted to process a wafer, the chamber having an opening to facilitate access to the interior of the chamber. The system has a lid coupled to the chamber opening, the lid having an open position and a closed position. An actuator is connected to the lid to move the lid between the closed position and the open position. The system may include a floating pivot coupled to the lid and the actuator to align the lid with the opening when the lid closes.
Abstract: An integrated precursor delivery system which integrates a precursor delivery system with a processing chamber is provided for improving the precursor delivery lines to the processing chamber, and for keeping the delivery lines intact during servicing the processing chamber. The apparatus provides an integrated precursor delivery system mounted on the processing chamber lid with the chamber lid being removable for allowing manual access to the inside of the processing chamber. With the precursor delivery system is in the close vicinity of the processing chamber, the delivery lines are shortest possible, minimizing the chance of precursor contamination. With the delivery system and the chamber lid in one unit, the removal of the chamber lid will no longer require breaking the delivery lines, leading to better contamination control. The present invention is particular suitable for liquid precursors since liquid is much more difficult to evacuate than gas.
Abstract: A vapor supply apparatus, for use in a semiconductor device manufacturing process, provides high flow conductance and high thermal conductance showerhead plate for supplying various precursors to a reaction chamber. The high flow conductance and high thermal conductance showerhead plate comprises a thick plate for high thermal conductance and variable size delivery hole for high flow conductance. A variation of the high flow conductance and high thermal conductance showerhead plate having the delivery holes tilted outward can be used as a baffle to diffuse the precursor to a large area. A showerhead system using high flow conductance and high thermal conductance showerhead plates is well suitable for delivering liquid precursors.