Abstract: A system and method are disclosed for intelligent formatting of VoIP telephone numbers. The intelligent VoIP formatting system includes a presentation and user interface layer, an E.164 formatting engine, a location routine, and a database of telephone number data which are used to deconstruct input telephone numbers and reconstruct them as E.164 compliant telephone numbers.
Abstract: Methods for a multiple die package for integrated circuits are disclosed. An insulator layer is provided and one or more vias are formed within it. The insulator may be provided without vias, and vias formed later. At least one integrated circuit is provided and electrically coupled to at least one lead of a first leadframe overlying one surface of the insulator. At least one second integrated circuit is provided and electrically coupled to a second leadframe overlying a second surface of the insulator. Electrical connections between the two leadframes and the first and second integrated circuits are made through the insulator at selected locations, by coupling at least one lead of the first and second leadframes one to another. The leads of the first and second leadframe may be physically coupled by a welding process within vias in the insulator. A method for a removable storage card is also described.
Abstract: A method for digitally signing information in real-time, based on a user request for the information. In one embodiment, the method is useful in a Web server, and can be implemented using a server-side API filter. One embodiment of the method includes receiving a data request from a user and determining whether the data requested should be marked. If the data should be marked, the method includes marking the data with a signature identifying at least one component of the user request; and storing information identifying the user with the request and the at least one component. Multiple types of marking techniques can be used on a single data file.
Type:
Grant
Filed:
December 5, 2005
Date of Patent:
October 4, 2011
Assignee:
Microsoft Corporation
Inventors:
Robert L. Beck, Benjamin K. Fullerton, Eric W. Scott
Abstract: A string of nonvolatile memory cells connected in series includes fixed charges located between floating gates and the underlying substrate surface. Such a fixed charge affects distribution of charge carriers in an underlying portion of the substrate and thus affects threshold voltage of a device. A fixed charge layer may extend over source/drain regions also.
Type:
Grant
Filed:
March 23, 2010
Date of Patent:
October 4, 2011
Assignee:
SanDisk Technologies Inc.
Inventors:
Takashi Orimoto, George Matamis, Henry Chien, James Kai
Abstract: Programmatic root cause analysis of application performance problems is provided in accordance with various embodiments. Transactions having multiple components can be monitored to determine if they are exceeding a threshold for their execution time. Monitoring the transactions can include instrumenting one or more applications to gather component level information. For transactions exceeding a threshold, the data collected for the individual components can be analyzed to automatically diagnose the potential cause of the performance problem. Time-series analytical techniques are employed to determine normal values for transaction and component execution times. The values can be dynamic or static. Deviations from these normal values can be detected and reported as a possible cause. Other filters in addition to or in place of execution times for transactions and components can also be used.
Abstract: A non-volatile storage system connects a signal driver to a first control line that is connected to a first non-volatile storage element, charges the first control line using the signal driver while the signal driver is connected to the first control line, disconnects the signal driver from the first control line while the first control line remains charged from the signal driver, connects the signal driver to a second control line that is connected to a second non-volatile storage element, charges the second control line using the signal driver while the signal driver is connected to the second control line, and disconnects the signal driver from the second control line. Charging the control lines causes the respective non-volatile storage elements to experience a program operation.
Abstract: A pattern that includes trenches of different depths is formed on a substrate using nanoimprint lithography. A subsequent metal deposition forms lines of different thicknesses according to trench depth, from a single metal layer. Vias extending down from lines are also formed from the same layer. Individual bit lines are formed having different thicknesses at different locations.
Abstract: Techniques are disclosed herein for applying different process steps to single-level cell (SLC) blocks in a memory array than to multi-level cell (MLC) blocks such that the SLC blocks will have high endurance and the MLC blocks will have high reliability. In some aspects, different doping is used in the MLC blocks than the SLC blocks. In some aspects, different isolation is used in the MLC blocks than the SLC blocks. Techniques are disclosed that apply different read parameters depending on how many times a block has been programmed/erased. Therefore, blocks that have been cycled many times are read using different parameters than blocks that have been cycled fewer times.
Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
Type:
Grant
Filed:
May 19, 2005
Date of Patent:
September 20, 2011
Assignee:
SanDisk Technologies Inc.
Inventors:
Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
Abstract: A signaling circuit having a selectable-tap equalizer. The signaling circuit includes a buffer, a select circuit and an equalizing circuit. The buffer is used to store a plurality of data values that correspond to data signals transmitted on a signaling path during a first time interval. The select circuit is coupled to the buffer to select a subset of data values from the plurality of data values according to a select value. The equalizing circuit is coupled to receive the subset of data values from the select circuit and is adapted to adjust, according to the subset of data values, a signal level that corresponds to a data signal transmitted on the signaling path during a second time interval.
Type:
Grant
Filed:
November 12, 2008
Date of Patent:
September 20, 2011
Assignee:
Rambus Inc.
Inventors:
Jared L Zerbe, Vladimir M Stojanovic, Fred F Chen
Abstract: Techniques are disclosed herein for re-ordering floating objects in an electronic document. An electronic document having floating objects is displayed in a first mode. Each floating object has an x-y location in the document and has a position on a z-order stack. In the first mode the floating objects are displayed in an x-y plane based on the z-order stack. Then, the electronic document is displayed in a second mode in which the electronic document is depicted as x-y plane slices. Each x-y plane slice corresponds to one position on the z-order stack. The x-y plane slices are displayed in particular order to depict the position of the floating objects on the z-order stack. A re-ordering of the x-y plane slices is displayed based on a request. Then, the electronic document is displayed in the first mode again based on the re-ordering of the x-y planes.
Abstract: Methods of forming integrated circuit packages having an LED molded into the package, and the integrated circuit package formed thereby. An integrated circuit including one or more semiconductor die, passive components and an LED may be assembled on a panel. The one or more semiconductor die, passive components and LED may all then be encapsulated in a molding compound, and the integrated circuits then singularized to form individual integrated circuit packages. The integrated circuits are cut from the panel so that a portion of the lens of the LED is severed during the singularization process, and an end of the lens remaining within the package lies flush with an edge of the package to emit light outside of the package.
Abstract: A method is disclosed for three-dimensional rendering of a live event such as an automobile race over a client device such as a personal computer. Moving and stationary objects at the event may be rendered using computer-generated graphics of the moving and stationary objects and real time positional data giving the position of the moving objects over time. The positional data may be streamed to the client device and displayed in real time or substantially real time.
Type:
Grant
Filed:
February 1, 2007
Date of Patent:
September 13, 2011
Assignee:
Sportvision, Inc.
Inventors:
Rand Pendleton, Kenneth A. Milnes, Marvin S. White
Abstract: A distance measurement method for use in a laser range finding device to measure a distance between the laser range finding device and a target is disclosed. The method comprises the following steps. A laser signal is sent to the target in a first time point. A reflected laser signal reflected by the target is then received. A digital signal having a plurality of signal values ranging from 0 to N is obtained by sampling the reflected laser signal with a sampling signal, wherein N is an integer larger than two. A maximum signal value among the signal values is obtained. The distance is calculated according to the first time point and a second time point where the maximum signal value is generated.
Abstract: When performing a data sensing operation, including a verify operation during programming of non-volatile storage elements (or, in some cases, during a read operation after programming), a first voltage is used for unselected word lines that have been subjected to a programming operation and a second voltage is used for unselected word lines that have not been subjected to a programming operation. In some embodiments, the second voltage is lower than the first voltage.
Abstract: A non-volatile storage system performs programming for a plurality of non-volatile storage elements and selectively performs re-erasing of at least a subset of the non-volatile storage elements that were supposed to remain erased, without intentionally erasing programmed data.
Abstract: A method of loading a plurality of pipette tips on a plurality of mandrels of a pipetter is provided. A plurality of pipette tips are inserted in a plurality of receptacles of a tip loading assembly. The plurality of pipette tips are oriented with respect to each other by a plate. The tip loading assembly includes, but is not limited to, an insertion surface. The insertion surface includes the plurality of receptacles configured to accept the plurality of pipette tips. A receptacle from among the plurality of receptacles includes a receptacle wall and a beveled surface that extends from at least a portion of the insertion surface. A retention force is applied to the plate. The plurality of pipette tips are attached to a plurality of mandrels of a pipetter and are separated from the plate.
Type:
Grant
Filed:
August 7, 2006
Date of Patent:
September 6, 2011
Assignee:
Amgen Inc.
Inventors:
Brian Rasnow, Chuck Z. Li, Stephen Robert Wilson
Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.
Type:
Grant
Filed:
October 20, 2006
Date of Patent:
September 6, 2011
Assignee:
SanDisk Technologies Inc.
Inventors:
Warren Middlekauff, Robert Miller, Charlie Centofante