Abstract: In a high speed BJT device, the method for producing the device includes forming a self-aligned BJT through the use of a single mask by making use of a single layer of polysilicon. The method includes forming a window in the polysilicon to define a base poly region and an emitter poly region. An underlying oxide/nitride stack is etched in a two etch process to define base and emitter regions for growing a small base and a small emitter. This displays small base-collector and base-emitter junction regions to reduce the capacitance.
Type:
Grant
Filed:
June 15, 2001
Date of Patent:
February 24, 2004
Assignee:
National Semiconductor Corp.
Inventors:
Mohamed N. Darwish, Alexei Sadovinkov, Reda Razouk
Abstract: In a receiver input back-drive protection circuit and method, a pass gate is provided between the high pad voltage and the receiver input and a clamping circuit is provided, to present a reduced voltage to the receiver input during stress mode.
Abstract: In a stand-alone snapback NMOS ESD protection structure method of manufacturing, the breakdown voltage is reduced and the structure is made more resilient to hot carrier and soft leakage degradation in the gate region by blocking the NLDD and partially blocking the n+ drain region between the gate and drain region.
Type:
Grant
Filed:
March 12, 2002
Date of Patent:
December 9, 2003
Assignee:
National Semiconductor Corp.
Inventors:
Vladislav Vashchenko, Ann Concannon, Peter J. Hopper, Marcel ter Beek