Abstract: The disclosed embodiments reveal an analog MEMS device with a pivotal micromirror that is supported by one or more beams that provide non-linear resistance. An electrode can electrostatically attract the micromirror, while the beam(s) provide resistance to deflection. When the forces equalize, the micromirror is held at a target angle. The beam support disclosed in the embodiments is superior to conventional torsion hinge supports, because it provides non-linear support for the micromirror, better matching the non-linear nature of the electrostatic force.
Abstract: A low-profile, high power ball grid array, or land grid array, device including a plastic tape having first and second surfaces, a portion of the first surface covered with an adhesive layer. First and second openings are stamped through the tape and adhesive layer, the first openings configured for solder balls and the second openings configured to accommodate circuit chips. A copper foil is laminated on the adhesive layer, and the portion of this copper foil in the second openings is mechanically shaped into a position coplanar with the second surface, whereby it becomes useable as a chip mount pad, exposed after encapsulation for low resistance heat dissipation. The circuit chips are mounted by means of a thermally conductive material on each of the chip mount pads. Encapsulating material surrounds the mounted chips in low profile. For ball grid array devices, solder balls are attached to the copper foil exposed by the first openings in the tape.
Abstract: System and method for reducing failures due to hinge memory in a microdisplay display system. A preferred embodiment includes setting the state of each micromirror in a digital micromirror device based on an image being displayed, recording a usage history for the micromirrors, and providing a sequence of states to each micromirror when the display system is in an inactive mode. The sequence of states provided to a micromirror is based on the micromirror's usage history. The operation of the micromirrors while a display system containing the digital micromirror device is not in active use can help to reverse or eliminate hinge memory, thereby extending the lifetime of the digital micromirror device.
Type:
Grant
Filed:
August 29, 2006
Date of Patent:
March 25, 2008
Assignee:
Texas Instruments Incorporated
Inventors:
Michael Richard Douglass, Andrew B. Sontheimer, David Joseph Mehrl
Abstract: The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.
Abstract: Transcoding as from MPEG-2 SDTV to MPEG-4 CIF reuses motion vectors and downsamples in the frequency (DCT) domain with differing treatments of frame-DCT and field-DCT blocks, and alternatively uses de-interlacing IDCT with respect to the row dimension plus deferred column downsampling for reference frame blocks.
Abstract: A folded-cascode operational amplifier including a differential input stage (19) and a class AB output stage (20) includes a first slew boost current mirror (13) and a second slew boost current mirror (14) having inputs connected to drains of the input transistors, respectively. Each current mirror amplifies excess tail current steered into it as a result of a large, rapid input signal transition. The amplified excess tail current is used to boost the slew rate of the class AB output stage in accordance with a first polarity of the difference between the first (Vin+) and second (Vin?) input voltages. The drains of the input transistors are maintained at a voltage less than a transistor threshold voltage above the ground except during slewing operation of the operational amplifier to effectively isolate the current mirrors except during slewing operation.
Abstract: In one embodiment, a laser module comprising an optical element, a frequency converter, a selective reflector, and one or more surface-emitters, each coupled to a common substrate, wherein the emitters, the optical element, the frequency converter, and the selective reflector are positioned with respect to each other such that at least a portion of the coherent light emitted from the surface-emitters travels through the optical element, through the frequency converter and through the selective reflector. In a method embodiment, a method for frequency converting light generated by a surface-emitter, wherein the light passes through an optical element, a frequency converter, and a selective reflector, each coupled to a common substrate.
Type:
Grant
Filed:
August 22, 2006
Date of Patent:
March 4, 2008
Assignee:
Texas Instruments Incorporated
Inventors:
Bradley M. Haskett, Steven M. Penn, Terry A. Bartlett
Abstract: Described embodiments provide for an optical communications assembly or other optical assembly in which the post-dispersion optical signals are controlled in dispersive and non-dispersive directions. In one embodiment, the assembly includes an optical signal collimator configured to emit an optical signal based on an input communication signal. In addition, the assembly includes a dispersive device that receives the optical signal and disperses multiple wavelength channels of the optical signal in a dispersive direction. The assembly further includes a first light-directing device configured to control the dispersion of the multiple wavelength channels in the non-dispersive direction. A second light-directing device is provided to control dispersion in the dispersive direction.
Type:
Grant
Filed:
October 31, 2003
Date of Patent:
February 26, 2008
Assignee:
Texas Instruments Incorporated
Inventors:
Donald A. Powell, Terry A. Bartlett, Bryce Sawyers
Abstract: Polyphase filtering, such as resampling for image resizing, on a processor with parallel output units is cast in terms of data access blocks and data coverage charts to increase processor efficiency. Automatic generation of implementations corresponding to input resampling factors by computation cost comparisons.
Abstract: By allowing the block rate to vary, the existing Asymmetric Digital Subscriber Line (ADSL) system is modified to better address extended reach and higher data rates. A method is disclosed for providing improved reach from the ADSL standard by reducing the block rate from the ADSL standard and providing improved data rate for short loops by increasing the block rate from the ADSL standard.
Abstract: The present invention provides a method of forming a interconnect barrier layer 100. In the method, physical vapor deposition of barrier material 200 is performed within an opening 140 located in a dielectric layer 135 of a substrate 110. RF plasma etching of the barrier material 200 that is deposited in the opening 140 occurs simultaneously with conducting the physical vapor deposition of the barrier material 200.
Type:
Grant
Filed:
May 11, 2005
Date of Patent:
February 19, 2008
Assignee:
Texas Instruments Incorporated
Inventors:
Asad M. Haider, Alfred J. Griffin, Jr., Kelly J. Taylor
Abstract: A speech encoder/decoder for wideband speech with a partitioning of wideband into lowband and highband, convenient coding of the lowband, and LP excited by noise plus some periodicity for the highband. The embedded lowband may be extracted for a lower bit rate decoder.
Abstract: A complementary-color-filtered array interpolation by first interpolate each color subarray so each pixel has four colors and then adjust each color at a pixel with addition or subtraction of a color imbalance factor for the pixel. For yellow and cyan the adjustment is subtraction but for magenta and green the adjustment is addition.
Abstract: A method of image compression with non-redundant complex wavelet transforms applied using a triband decomposition. Variant transforms for real and complex inputs allow for elimination of redundancy.
Abstract: A method provides forward compatibility hooks for DFS and TPC for WLAN, so that the same mechanisms can be employed (with only minor changes/additions) for other regulatory domains, other bands, and/or other purposes. The current IEEE 802.11 h standard defines mechanisms for dynamic frequency selection (DFS) and transmit power control (TPC) that may be used to satisfy regulatory requirements for operation in the 5 GHz band in Europe. The present method provides a format to allow other bands, and relates to the supported channels element, channel switch announcement element, and the Basic/CCA/RPI histogram request/report. The method optionally reserves more than 3-bits in the Basic report (Map subfield).
Abstract: A method of image compression with wavelet transforms applied locally rather than globally by image component partitioning into independently transformed macroblocks plus overlapping data for filter length compensation.
Abstract: A processor (1700) including a pipeline (1710, 1740) having a fetch pipeline (1710) with branch prediction circuitry (1840) to supply respective predicted taken target addresses for branch instructions, an execution pipeline (1740) with a branch execution circuit (1870), and storage elements (in 1860) and control logic (2350) operable to establish a first-in-first-out (FIFO) circuit (1860) with a write pointer WP1 and a read pointer RP1. The control logic (2350) is responsive to the branch prediction circuitry (1840) to write a predicted taken target address to a storage element (in 1860) identified by the write pointer (WP1) and the predicted taken target address remains stationary therein. The FIFO circuit (1860) bypasses a plurality of pipestages between the branch prediction circuitry (1840) and the branch execution circuit (1870). The control logic (2350) is operable to read a predicted taken target address (PTTPCA) from a storage element (in 1860) identified by the read pointer RP1.
Abstract: System and method for an optical position sensor architecture for use in servo systems. A preferred embodiment comprises a light source configured to produce a light with an intensity dependent upon a control signal, a first light sensor and a second light sensor positioned adjacent to one another, each light sensor configured to produce a current based upon an amount of light incident upon each light sensor. The preferred embodiment also comprises a slotted device coupled to the load and positioned between the light source and the first light sensor and the second light sensor. The slotted device regulates an amount of light striking the first light sensor and the second light sensor based upon a position of the load. The slotted device features a slot that has a radius with a linearly increasing radius as a function of rotation angle so that the optical position sensor has linear behavior.
Abstract: An apparatus and method of synthesizing an output clock signal from a source clock signal. The clock synthesizer includes a phase generator, a phase selector, a phase interpolator, and control circuitry for controlling the phase selector/interpolator. The phase generator receives a high speed clock, and generates P phases of the source clock to define P phase sectors. The phase selector selects respective pairs of phases such that each pair bounds a respective phase sector. The phase interpolator introduces at least one phase of the source clock between each pair of phases to provide Q phases of the source clock within each sector. The phase interpolator uses the phases of the source clock to produce lagging (leading) phase shifts of 360/P(Q?1) degrees, thereby generating the output clock having a stepped up or stepped down frequency.
Abstract: A thin film resistor and at least one metal interconnect are formed in an integrated circuit. A first dielectric layer is formed over a metal interconnect layer. A thin film resistor is formed on the first dielectric layer and a second dielectric layer formed over the thin film resistor. Thin film resistor vias and the at least one trench are formed concurrently in the second dielectric layer. A trench via is then formed in the at least one trench. The trench via, the at least one trench and the thin film resistor vias are filled with a contact material layer to form thin film resistor contacts and at least one conductive line coupled to the metal interconnect layer.