Abstract: A semiconductor device comprising a gate having an approximately 0.05 &mgr;m channel length, an oxide layer below the gate, a self-aligned compensation implant below the oxide layer, a halo implant surrounding the self-aligned compensation implant below the oxide layer; and gate and drain regions on opposite sides of the halo implant and below the oxide layer.
Type:
Grant
Filed:
July 13, 1998
Date of Patent:
November 25, 2003
Assignee:
International Business Machines Corporation
Abstract: A method and structure for an integrated circuit structure that includes introducing precursors on a substrate, oxidizing the precursors and heating the precursors. The introducing and the oxidizing of the precursors is preformed in a manner so as to form an amorphous glass dielectric on the substrate. The process preferably includes, before introducing the precursors on the substrate, cleaning the substrate.
Type:
Grant
Filed:
January 8, 2003
Date of Patent:
November 25, 2003
Assignee:
International Business Machines Corporation
Inventors:
Michael P. Chudzik, Lawrence Clevenger, Louis L. Hsu, Deborah A. Neumayer, Joseph F. Shepard, Jr.