Abstract: There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.

Abstract: A liquid material is applied by spin coating it onto a first main surface of a flat plate to form a coating of the liquid material thereon. The flat plate includes a second main surface which is opposite to the first main surface and a hole which passes through the flat plate. The application of the liquid material is carried out using an inner guide member, which is placed in the hole, and the spin coating is carried out while the flat plate is placed on a stage such that the inner guide member is placed generally adjacent to an inner peripheral side surface of the flat plate and an upper surface of the inner guide member and the first main surface are located at generally the same level. Thereby, a coating is obtained which extends on the upper surface of the inner guide member and the first main surface of the flat plate.

Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

Abstract: A pneumatic actuator includes a cylinder, an output shaft disposed rotatably in the cylinder, a pinion disposed in the output shaft, a piston rod furnished with rack teeth to be meshed with the pinion, and pistons disposed one each at opposite ends of the piston rod, wherein the pneumatic actuator further includes a pressure-inspecting chamber enclosed with the cylinder and the piston and a pressure-detecting hole establishing communication between the pressure inspecting chamber and the exterior.

Abstract: A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.

Abstract: An optical disc recording apparatus for recording a video object onto an optical disc. A recording area of the optical disc is divided into a plurality of zones which each include a plurality of adjacent tracks. The optical disc recording apparatus includes: a reading unit for reading from the optical disc the sector information showing data assignment for sectors on the optical disc; a recording unit for recording the video object onto the optical disc; and a control unit for controlling the reading unit and the recording unit. The control unit detects at least one series of consecutive unassigned sectors on the optical disc by referring to the read sector information. Each series has a total size greater than a minimum size and is located within a single zone. The minimum size corresponds to a data amount that ensures uninterrupted reproduction of the video object. The control unit also controls the recording unit to record the video object into the detected series.

Abstract: A process for preparing highly purified silicon and aluminum and silumin (aluminum silicon alloy) in the same electrolysis furnace, by subjecting silicate and/or quartz containing rocks to electrolysis in a salt melt containing fluoride, whereby silicon and aluminum are formed in an electrolysis bath, and the aluminum formed, which may be low alloyed, flows to the bottom and is drawn off; transferring cathode with deposit to a Si-melting furnace, whereby the deposit with Si on the cathode flows down to the bottom of the melting furnace, and the cathode is removed before melting Si in said furnace, or during the electrolysis, shuffling the deposit formed on the cathode(s) down into the molten electrolysis bath, and transferring the molten or frozen bath containing Si from the cathode deposit to a Si-melting furnace after Al has flowed down to the bottom of the electrolysis furnace and been drawn off; melting the cathode deposit and/or molten or frozen bath, which contain silicon and slag, in the Si-melting fur

Abstract: A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.

Abstract: A paper container comprises: a container main body in the form of a rectangular parallelepiped that accommodates a number of papers or the like, such as tissue papers, that are placed one upon another, being folded; and an opening portion which is formed on a top of the container main body, wherein respective cuts 5 for a pair of up and down movable flaps 3a, 3b, and pairs of side flaps 4a, 4b, 4c, 4d are formed with a waved blade (corrugated) cutting tool whose blade portion has a pitch of 0.1 to 3.0 mm.

Abstract: A ceramic green sheet is irradiated with a laser beam of a high-peak short-pulse type to form a hole in the sheet. With the laser beam, a minimum oscillation output is more than 60% of a maximum oscillation output. This prevents material of the ceramic green sheet from melting partially and remaining around the hole. Therefore, a multi-layer assembly of ceramic green sheets built by joining the sheets in layers and baking these joined sheets hardly has a structural defect around a via-electrode provided in the hole.

Abstract: A lens element 1 is formed by making use of an optical substrate, and includes a lens portion 2, an edge portion 6 in the form of a circular arc provided along the circumference of the lens portion 2, and a handling portion 4 which is integrated with the lens portion 2 and the edge portion 6 as well and extends with a width wider than that of the lens portion 2. The handling portion 4 can be caught and held by chucking vacuum suction and so forth. The lens element 1 can be handled by catching the handling portion 4 without directly touching the lens element 1, and thus the lens element 1 is neither damaged nor contaminated, and stably handled with ease.

Abstract: A display device comprises an inspection circuit for inspecting a data reception related circuit to generate inspection information, an inspection result image generation circuit for generating image data indicating the inspection information, a display switching circuit for superimposing inspection result image data on test video data, and a display unit for displaying the test video data superimposing the inspection result image data. As a result, it is possible to carry out inspection after assembly of the display device without disassembling the display device. This in turn makes it possible to carry out a test in a simple manner on the data reception related circuit inside the display device without changing noise environment inside the display device.

Abstract: In order to mount a semiconductor element of a small electrode pitch, an inner lead portion of a lead frame is made thin and narrow to reduce a pitch. Even a semiconductor element in which an electrode arrangement pitch is smaller than conventionally can be mounted by flip chip bonding, the number of components such as a wire is reduced, and a possibility of wire cutting or the like caused by vibration or the like during semiconductor device assembling is reduced. A fine inner lead formation scheduled area of a conductor plate is half-etched to make a plate thickness smaller than that in a peripheral area. Then, the fine inner lead formation scheduled area is patterned to form a fine inner lead portion 22. Especially, a width of a tip 22a of the fine inner lead portion 22 is set smaller than those of a middle inner lead portion 23 and an outer lead portion 25.

Abstract: A signal light pulse to be converted into a two-dimensional space signal and a reference ultra-short light pulse are directed to a dispersion device, a second-harmonic is generated by introducing a one-dimensional frequency light distribution obtained by a one-dimensional Fourier transform lens, the second-harmonic is then subjected to time-to-space conversion through a one-dimensional Fourier transform lens so as to obtain a light wave distribution, and the light wave distribution is then subjected to filtering by a time-frequency filter provided on a filter plane of a one-dimensional space frequency filtering optical system and is further converted into a two-dimensional space signal corresponding to a time-frequency expanded two-dimensional light distribution which represents a relation between time and frequency of the signal pulse light.

Abstract: A mechanical digging device with a handle-like support is provided with a digging part near its bottom end and two grip arms on its upper end, a support part embodied on the bottom end of the support and a rotating device mounted on the support and connected to the digging part for laterally tilting the material on the digging part. The rotating device penetrates the support and the longitudinal axis of the rotating device extends parallel to the longitudinal axis of the digging part.

Abstract: Fuel injection equipment is provided which realizes characteristics of fuel injection proper for all over the operation range of an engine, can further reduce nitrogen oxide(NOx) emission, and is high in mechanical durability. The fuel injection equipment for an internal combustion engine comprises an injection pump having a plunger part and a fuel passage equipped with a main electromagnetic valve, a fuel supply part for supplying the fuel to the fuel injection pump, a fuel injection pipe for sending the fuel to an injection nozzle part, and a secondary electromagnetic valve attached to an overflow pipe for returning to said fuel supply part the redundant fuel not to be injected from said unit injector, wherein an orifice is attached to said overflow pipe.

Abstract: A first film plate 20 and a second film plate 40, each made of flexible resin film, are attached to a top surface and a bottom surface of a key top 30 made of mold-resin, respectively, so as to cover the key top 30. The first film plate 20 is pressed upward to form a recessed portion 23, the key top 30 is molded within this recessed portion 23. The second film plate 40 is arranged on the bottom surface of the key top 30. All of the first film plate 20, the key top 30, and the second film plate 40 are transparent. Decorative layers 21 and 41 are formed on the first film plate 20 and the second film plate 40, respectively.

Abstract: A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projection region is determined on the basis of an area in which the projecting region acts on the workpiece.