Abstract: An aqueous etchant solution made from water, hydrogen fluoride and a polyammonium fluoride salt selected from the group consisting of ethylenediammonium difluoride and diethylenetriammonium trifluoride.
Abstract: A light-sensitive mixture useful as a negative-working photoresist composition comprising:(a) at least one novolak resin; and(b) at least one 6-acetoxy cyclohexadienone compound of the formula (I) below: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 are individually selected from hydrogen and lower alkyl groups having from 1 to 4 carbon atoms with the proviso that at least three of the R.sub.1 to R.sub.5 groups are lower alkyl groups.
Abstract: In the process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps:(a) contacting said printed wiring board having said through holes with a liquid dispersion of carbon blaock comprised of:(1) carbon black particles having an average particle size of less than about 3.
Abstract: A process for removing unwanted photoresist material from the peripheral areas of a photoresist substrate comprising the steps of:(a) spin coating a photoresist solution onto a surface of a substrate, thereby applying a photoresist coating which comprises a uniform film over substantially all of said substrate surface except for unwanted photoresist material deposits at the peripheral areas of said surface;(b) contacting said peripheral area of the coated substrate with a sufficient amount of a solvent mixture comprising a mixture of ethyl lactate and methyl ethyl ketone present in a volume ratio of about 65:35 to about 25:75, respectively, to selectively dissolve said unwanted deposits without adversely affecting said uniform film; and(c) separating said dissolved deposits from said coated substrate.
Type:
Grant
Filed:
January 6, 1988
Date of Patent:
December 12, 1989
Assignee:
Olin Hunt Specialty Products Inc.
Inventors:
Thomas E. Salamy, Marvin L. Love, Jr., Mark E. Towner
Abstract: A process and apparatus for producing an aqueous solution of chlorine dioxide and chlorine wherein the likelihood of autodecomposition of chlorine dioxide is significantly reduced or practically eliminated and, in the unlikely event that such CLO.sub.2 autodecomposition occurs, it is quickly detected and the process is automatically corrected.
Abstract: An aryl N,N'-bis cinnamamide compound having a formula comprising: ##STR1## wherein x equals an integer from 0 to 3; y equals an integer from 0 to 2; z equals an integer from 0 to 2; each R is individually selected from the group consisting of a lower alkyl group having 1 to 4 carbon atoms, a lower alkoxy group having from 1 to 4 carbon atoms, a halo group, a nitro group, an aryl group having 6 to 18 carbon atoms, and a fused unsubstituted or substituted aromatic ring when x is 2 or 3; and each R' and R" is individually selected from the group consisting of a lower alkyl group having from 1 to 4 carbon atoms, a lower alkoxy group having from 1 to 4 carbon atoms, a halo group, a nitro group or an aryl group having from 6 to 18 carbon atoms. These compounds are useful as U.V. light absorbers in plastics and cosmetics (e.g. sunscreens).
Abstract: A thermal CVD process for forming silicon nitride-type or silicon dioxide-type films onto a substrate comprising the steps of:(a) introducing di-tert-butylsilane and at least one other reactant gas into a CVD reaction zone containing said substrate on which either a silicon nitride-type or silicon dioxide-type film is to be formed;(b) maintaining the temperature of said zone and said substrate from about 450.degree. C. to about 900.degree. C.;(c) maintaining the pressure in said zone from about 0.1 to about 10 Torr; and(d) passing said gases into contact with said substrate for a period of time sufficient to form a silicon nitride-type or silicon dioxide-type film thereon.
Abstract: A plasma CVD process for forming silicon nitride-type or silicon dioxide-type films onto a substrate comprising the steps of:(a) introducing di-tert-butylsilane and at least one other reactant gas into a CVD reaction zone containing said substrate on which either a silicon nitride-type or silicon dioxide-type film is to be formed;(b) maintaining the temperature of said zone and said substrate from about 100.degree. C. to about 350.degree. C.;(c) maintaining the pressure in said zone from about 0.1 to about 5 Torr; and(d) passing said gas mixture into contact with said substrate while exciting said gas mixture with a plasma for a period of time sufficient to form a silicon nitride-type or silicon dioxide-type film on said substrate, wherein said plasma is excited by a RF power at about 10 to 500 Watts.
Abstract: A conductive silver/silver chloride composition consisting essentially of:(a) about 6 to about 10.5 parts by weight of a vinylidene chloride thermoplastic polymer having a glass transition value of above about 100.degree. F.;(b) at least a sufficient amount of an organic solvent capable of dissolving polymer (a);(c) about 47 to about 57 parts by weight of silver flake; and(d) about 8 to about 16 parts by weight of silver chloride.
Abstract: An improvement to the process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises:(a) contacting said printed wiring board with an aqueous polyelectrolyte homopolymer conditioner solution having a charge density from about 0.2 to about 2.5 milliequivalents (positive charge) per gram of dissolved polymer and having a pH in range from about 3 to about 5, followed by;(b) contacting said printed wiring board with a dispersion of carbon black comprising:(1) carbon black particles having an average particle diameter of less than about 3.
Abstract: Disclosed is a process for producing methylphosphonic dichloride comprising reacting dimethyl methylphosphonate with a chlorinating agent selected from the group consisting of thionyl chloride and phosgene in the presence of a catalytic amount of an inorganic halide selected from the group consisting of ammonium halide and metallic halides where the metal cation is selected from the metals of Groups IA, IIA, IIIB, IVB, VB, VIB, VIIB, VIIIB, IB, IIB and IIIA of the Periodic Table.
Abstract: Disclosed are selected 4-acyl-2,6-dialkylphenyl adducts of mono- and polysaccharides, which are useful an antioxidants in organic materials (e.g. polyolefins) normally subject to oxidative degradation.
Abstract: A process for the production of an aqueous solution containing chlorine dioxide and chlorine, which comprises:(a) feeding to a reaction zone a first reactant stream comprising an aqueous solution containing an alkali metal chlorate and an alkali metal chloride;(b) feeding to said reaction zone a second reaction stream comprising an acid admixture of phosphoric acid and sulfuric acid, wherein the weight ratio of said phosphoric acid to said sulfuric acid as expressed as H.sub.3 PO.sub.4 :H.sub.2 SO.sub.4, is from about 1:16 to about 1:3;(c) mixing said first and second reactant streams in said reactant zone; said streams being fed into said reaction zone at rates sufficient to form a reaction product stream comprising an aqueous solution of chlorine dioxide and chlorine in said reaction zone; and(d) withdrawing the resulting aqueous reaction product stream from said reaction zone.
Abstract: A phenolic resin composition comprising units of formula (I): ##STR1## wherein R.sub.1 is a halogen and R.sub.2 is a lower alkyl group having 1 to 4 carbon atoms and said units of formula (I) are made by condensing the corresponding halogen-substituted resorcinol of formula (A): ##STR2## wherein R.sub.1 is defined above, with the corresponding para-lower alkyl-substituted 2,6-bis(hydroxymethyl)-phenol of formula (B): ##STR3## wherein R.sub.2 is defined above, and wherein the mole ratio of A:B is from about 0.5:1 to 1.7:1. This phenolic resin may be mixed with photoactive compounds (e.g. 1,2-naphthoquinone diazide sensitizers ) to prepare a light-sensitive composition useful as a positive-working photoresist.
Type:
Grant
Filed:
November 23, 1987
Date of Patent:
June 6, 1989
Assignee:
Olin Hunt Specialty Products Inc.
Inventors:
Andrew J. Blakeney, Alfred T. Jeffries, III, Thomas R. Sarubbi
Abstract: An aqueous developing solution useful in developing positive-working photoresists comprising:______________________________________ A. Soluble Alkali Metal Phosphate 1.50-3.00% by weight B. Soluble Alkali Metal Silicate 1.00-2.00% by weight C. Mono (lower alkanol) amine 0.40-5.00% by weight D. Soluble Alkylene Glycol 0.25-3.00% by weight E. Lower Alkanol 0.05-1.00% by weight F.
Type:
Grant
Filed:
January 6, 1988
Date of Patent:
May 9, 1989
Assignee:
Olin Hunt Specialty Products Inc.
Inventors:
Richard J. West, Stephen F. Marcotte, Jr., Faris A. Modawar
Abstract: Described are anionic surfactants which are made by (1) reacting maleic acid, fumaric acid, itaconic acid or mixtures thereof with at least one selected epoxy-capped poly(oxyalkylated) alcohol in the presence of a peroxy-type free radical initiator to form a carboxylic acid group-containing addition product and (2) neutralizing said addition product with a sufficient amount of a neutralizing agent to convert at least a major proportion of said carboxylic acid groups to salt groups. These surfactants exhibit excellent surface activity as well as being highly soluble in caustic solutions.
Abstract: Light-sensitive 1,2-naphthoquinone-2-diazide-4-sulfonic acid monoester of a cycloalkyl-substituted phenol corresponding to the formula: ##STR1## wherein n is from about 2 to about 10 and their use in light-sensitive mixtures (e.g. positive-working photoresist compositions) also containing alkali-soluble resins such as phenol-formaldehyde novolaks and cresol-formaldehyde novolaks as well as substrates coated therewith.
Abstract: A process for preparing doped barium and strontium hexaferrite compounds having the formula (I):Afe.sub.12-r-s M.sub.r N.sub.s O.sub.19 (I)wherein A is barium or strontium; M is cobalt, zinc, nickel; N is titanium or ruthenium and r and s are individually in the range from about 0.1 to about 1.2, said process comprising:(a) forming particles of a doped Fe.sub.3 O.sub.4 /ACO.sub.3 co-precipitate wherein A is defined above from (i) a ferric compound, (ii) a ferrous compound, (iii) a barium or strontium compound, (iv) a cobalt, zinc or nickel compound, (v) a titanium or ruthenium compound and (vi) alkali metal carbonate;(b) suspending the doped Fe.sub.3 O.sub.4 /ACO.sub.3 particles in a concentrated aqueous solution of an alkali halide;(c) spray drying said suspension to form a dried powder comprising said doped Fe.sub.3 O.sub.4 /ACO.sub.3 particles distributed onto the surfaces of the high temperature-melting alkali halide crystals;(d) calcining said dried powder at a temperature from about 700.degree. C.
Type:
Grant
Filed:
October 24, 1986
Date of Patent:
November 1, 1988
Assignee:
Olin Corporation
Inventors:
Jerry J. Kaczur, J. Paul Deininger, Larry D. Carpenter
Abstract: A process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises:(a) preparing a liquid dispersion of carbon black comprised of:(1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion;(2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and(3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion;(b) applying said liquid dispersion to the surface of the non-conducting material;(c) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said non-conductive surface in a substantially continuous layer; and(d) electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and said non-conductive surface.
Abstract: An improvement to the process for electroplating the walls of through holes in a laminated printed wiring board which comprises:(a) contacting said printed wiring board with an aqueous alkaline silicate solution, followed by;(b) contacting said printed wiring board with a dispersion of carbon black comprising:(1) carbon black particles having an average particle diameter of less than about 3.