Abstract: A light emitting diode light source and reflective elements are directly attached or surface mounted to a foldable connector which, when folded, forms both a light recycling cavity and an optical taper at the end of the light recycling cavity.

Abstract: Direct attach or surface mount LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs. The direct attach or surface mount LEDs are mounted on the substrate. The substrate is then scribed on the backside to form cut channels which form the folds. The direct attach or surface mount LEDs are then attached onto the metal layer on the substrate. The substrate is then folded into a light recycling cavity where the direct attach or surface mount LEDs are facing the inside of the cavity.

Abstract: Thin freestanding nitride films are used as a growth substrate to enhance the optical, electrical, mechanical and mobility of nitride based devices and to enable the use of thick transparent conductive oxides. Optoelectronic devices such as LEDs, laser diodes, solar cells, biomedical devices, thermoelectrics, and other optoelectronic devices may be fabricated on the freestanding nitride films. The refractive index of the freestanding nitride films can be controlled via alloy composition. Light guiding or light extraction optical elements may be formed based on freestanding nitride films with or without layers. Dual sided processing is enabled by use of these freestanding nitride films. This enables more efficient output for light emitting devices and more efficient energy conversion for solar cells.

Abstract: A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips.

Abstract: LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs and to form bonding pads for wirebonds to connect the LEDs to external circuitry. The LEDs are mounted on the substrate. The substrate is then scribed on the backside to form the folds. The LED dies are then attached onto the metal islands (pads) defined on the substrate and wirebonds are used to connect the top side of the LED to adjacent patterned metal islands (pads) on the substrate. The substrate is then folded into a light recycling cavity where the LEDs are facing the inside of the cavity.

Abstract: A method for fabricating substrate-free LED chips has a multilayer semiconductor structure at least 10 microns thick provided on a growth substrate. One or more arrays of parallel streets are etched into the multilayer semiconductor structure using a first pulsed laser beam. By scanning a second pulsed laser beam through the growth substrate to the multilayer semiconductor structure, the LED chips are detached from the growth substrate while simultaneously forming surface features on the chips.

Abstract: LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs and to form bonding pads for wirebonds to connect the LEDs to external circuitry. The LEDs are mounted on the substrate. The substrate is then scribed on the backside to form the folds. The LED dies are then attached onto the metal islands (pads) defined on the substrate and wirebonds are used to connect the top side of the LED to adjacent patterned metal islands (pads) on the substrate. The substrate is then folded into a light recycling cavity where the LEDs are facing the inside of the cavity.

Abstract: A light emitting diode light source with mirrored surfaces is formed on a planar substrate which, when folded, forms both a light recycling cavity and an optical taper at the end of the light recycling cavity.

Abstract: Thin freestanding nitride films are used as a growth substrate to enhance the optical, electrical, mechanical and mobility of nitride based devices and to enable the use of thick transparent conductive oxides. Optoelectronic devices such as LEDs, laser diodes, solar cells, biomedical devices, thermoelectrics, and other optoelectronic devices may be fabricated on the freestanding nitride films. The refractive index of the freestanding nitride films can be controlled via alloy composition. Light guiding or light extraction optical elements may be formed based on freestanding nitride films with or without layers. Dual sided processing is enabled by use of these freestanding nitride films. This enables more efficient output for light emitting devices and more efficient energy conversion for solar cells.

Abstract: A solid-state light source includes at least one stack of light emitting elements. The elements are an inorganic light emitting diode chip and at least one wavelength conversion chip or the elements are a plurality of light emitting diode chips and one or more optional wavelength conversion chips. The wavelength conversion chip may include an electrical interconnection means. The light emitting diode chip may include at least one GaN-based semiconductor layer that is at least ten microns thick and that is fabricated by hydride vapor phase epitaxy. A method is described for fabricating the solid-state light source.

Abstract: A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips.

Abstract: A LED light source is integrated with a heatsink and a collimator. Four isolated heatsinks form an optical taper in which a single color LED is mounted. The LEDs are arranged to form a reflective light recycling cavity. Up to four different colors can be combined inside the light recycling cavity to form a uniform and homogenous mixing of the colors at the exit aperture of the light recycling cavity and/or the exit aperture of the collimator/heatsink.

Abstract: The invention is method for fabricating light emitting diodes. A layered semiconductor structure is provided on a growth substrate. The method includes using a pulsed laser to form an interfacial layer between the layered semiconductor structure and the growth substrate for subsequent substrate detachment and to simultaneously form light extracting elements on the layered semiconductor structure. The method reduces the number of steps required to fabricate a light emitting diode.

Abstract: A light emitting diode includes a first doped semiconductor layer, an active region and a second doped semiconductor layer. The first reflective electrode of the light emitting diode is connected to the edge surfaces of the first doped semiconductor layer. The second reflective electrode includes an optically transparent layer and is connected to the second doped semiconductor layer. The second reflective electrode may include a plurality of electrically conductive contacts extending from a reflective conductive metallic layer through a transparent layer. A method is described for fabricating the light emitting diode.

Abstract: An optical element such as an interference filter will have adjacent layers of different indexes of refraction but formed of the same optical material. An optical element such as a diffraction grating or beam-splitter will have adjacent sections of different indexes of refraction in the same optical material layer. An optical element such as a waveguide will have a core layer of a higher index of refraction partially or completely surrounded by a cladding layer of a lower index of refraction formed of the same optical material.

Abstract: A moveable platform for a laptop computer has an angled support base to angle the laptop keyboard and elevate the laptop display monitor. The angled support base forms an airgap between the moveable platform and the desktop to dissipate the heat from the laptop computer. A separate cooling fan system integral with the support base can also dissipate the laptop computer heat. Spherical roller assemblies on the bottom of the platform move the laptop computer around the desktop. The spherical roller assemblies have a Teflon™ spherical ball surrounded by a plurality of Delrin™ spherical ball bearings in a Nylon™ semi-spherical cavity. These non-metallic materials provide smooth quiet operation with minimal frictional resistance and are non-abrasive to the desktop surface. A braking mechanism at the front of the moveable platform lifts the front spherical roller assemblies from contact with the desktop to lock the moveable platform and laptop computer into position on the desktop.

Abstract: An illumination system has a light source and a wavelength conversion layer within a light-recycling envelope. The wavelength conversion layer is a solid phosphor layer. The light source is a light-emitting diode or a semiconductor laser. The light source will emit light of a first wavelength range that is transmitted through the wavelength conversion layer in order to convert a portion of the light of a first wavelength range into light of a second wavelength range. Light of both the first and second wavelength ranges will exit the light-recycling envelope through an aperture. The recycling of the light by the light-recycling envelope will enhance the output radiance and luminance of the light exiting the illumination system.

Abstract: A projection display system has at least one light-recycling illumination system and at least one imaging light modulator. The light-recycling illumination system includes a light source that is enclosed within a light-recycling cavity. The light source is a plurality of light-emitting diode that emits light, and a fraction of that light will exit the light-recycling cavity through an aperture. The light-recycling cavity recycles a portion of the light emitted by the light source back to the light source in order to enhance the luminance of the light exiting the aperture. The fraction of the light that exits the aperture is partially collimated and is directed to the imaging light modulator. The imaging light modulator spatially modulates the partially collimated light to form an image.