Abstract: Systems and methods for detecting and tracing a denial-of-service attack are disclosed. One aspect of the systems and methods includes providing a plurality of attack detection modules and a plurality of broker modules operable to communicably couple to a network. The attack detection modules operate to detect a potential denial-of-service attack on network segment. An attack signature for the potential denial of service attack may be forwarded to one or more broker modules on the network segment. The broker modules collectively analyze the data in order to determine a source or sources for the attack.
Abstract: A method and apparatus for making a package having improved heat conduction characteristics and high frequency response. A relatively thick package substrate, such as copper, has a wiring layer bonded to one face, leaving the opposite face exposed, for example, to be a surface for connection to a heat sink. One ore more chips are bonded to the wiring layer, and an array of connectors, such as solder balls are provided around the periphery of the chip(s) for connection to a printed circuit board. In some embodiments, the printed circuit board has a hole that the chip(s) extend into to allow smaller external-connection solder balls. In some embodiments, a second heat sink is connected to the back of the chip through the PCB hole.
Abstract: A computer-implemented system and method for performance profiling on a target device. The computer-implemented method includes configuring the target device to operate in a first mode or a second mode, and receiving a write command from a host device. When the target device is configured to operate in the first mode, the method includes sending an authorization to send write data to the host device, and receiving write data from the host device. When the target device is configured to operate in the second mode, the method includes allocating a reserved write buffer on the target device, and receiving write data from the host device using the write buffer.
Abstract: Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.
Abstract: Packet sequence numbers of request packets and response packets of transactions transferring data to or from a network interface are tracked. For every request packet transmitted by the network interface, the packet sequence number of the packet is written to a location in a circular send queue pointed to by a write pointer and a valid bit at the location is set. The write pointer is incremented if the packet is a read request packet. Alternatively, a read indicator at the location in the circular send queue pointed to by the write pointer is cleared if the packet is not a read request packet. For every response packet received by the network interface, the packet sequence number of the response packet is checked against the packet sequence number stored at the location in the circular send queue pointed to by the read pointer of the circular send queue.
Type:
Grant
Filed:
June 30, 2000
Date of Patent:
September 11, 2007
Assignee:
Intel Corporation
Inventors:
Brian M. Leitner, Dominic Gasbarro, Tom Burton, Dick Reohr, Ni Jie
Abstract: A retainer secures one or more printed wiring assemblies in a processor unit. In one embodiment, the retainer has one or more protuberances that abut against a wiring assembly to secure it in place, or sit within a cutout section in the wiring assembly to secure the assembly in a serviceable position.
Abstract: A system and method for detecting changes in the refractive index of a fluid in a small test volume. A change in the refractive index can indicate a change in the chemical composition of the fluid. The test volume has a depth comparable to or less than the wavelength of incident light. In one embodiment, an internal surface of the volume is coated with a binding partner selected to bind with a targeted molecule. When the targeted molecule binds to the binding partner, the optical properties of the system change. The refractive index is determined by illuminating the test volume with laser light and measuring transmitted or reflected light.
Abstract: One aspect of the present subject matter relates to a partially depleted silicon-on-insulator structure. The structure includes a well region formed above an oxide insulation layer. In various embodiments, the well region is a multilayer epitaxy that includes a silicon germanium (Si—Ge) layer. In various embodiments, the well region includes a number of recombination centers between the Si—Ge layer and the insulation layer. A source region, a drain region, a gate oxide layer, and a gate are formed. In various embodiments, the Si—Ge layer includes a number of recombination centers in the source/drain regions. In various embodiments, a metal silicide layer and a lateral metal Schottky layer are formed above the well region to contact the source region and the well region. Other aspects are provided herein.
Abstract: An implantable cardiac device is configured and programmed to assess a patient's cardiopulmonary function by evaluating the patient's heart rate response. Such evaluation may be performed by computing a heart rate response slope, defined as the ratio of an incremental change in intrinsic heart rate to an incremental change in measured activity level. The heart rate response slope may then be compared with a normal range to assess the patient's functional status.
Type:
Grant
Filed:
August 9, 2004
Date of Patent:
September 11, 2007
Assignee:
Cardiac Pacemakers, Inc.
Inventors:
Veerichetty Kadhiresan, Donald Hopper, Richard Fogoros, Lemont Baker
Abstract: Many integrated circuits include a type of transistor known as a bipolar junction transistor, which has an emitter contact formed of polysilicon. Unfortunately, polysilicon has a relatively high electrical resistance that poses an obstacle to improving switching speed and current gain of bipolar transistors. Current fabrication techniques involve high temperature procedures that melt desirable low-resistance substitutes, such as aluminum, during fabrication. Accordingly, one embodiment of the invention provides an emitter contact structure that includes a polysilicon-carbide layer and a low-resistance aluminum, gold, or silver member to reduce emitter resistance. Moreover, to overcome manufacturing difficulties, the inventors employ a metal-substitution technique, which entails formation of a polysilicon emitter, and then substitution or cross-diffusion of metal for the polysilicon.
Abstract: The expression and subcellular localization of peripheral-type benzodiazepine receptors (PBR) is shown in this application to correlate with the metastatic potential of cells, and increased cell proliferation. Inhibition of PBR expression, function or stability results in a decrease in cell proliferation. Compositions and methods for regulating and/or monitoring PBR and its expression are useful for the detection, diagnosis, prognosis and treatment of solid tumors, in particular, breast cancer.
Abstract: A process comprising, providing an agricultural biofuel to a fluidized bed reactor and combusting the agricultural biofuel to produce heat and/or steam is disclosed. In one embodiment, the agricultural biofuel is selected from the group consisting of agricultural crops, crop residues, grain processing facility waste, value-added agricultural facility byproducts, livestock production facility waste, livestock processing facility waste and food processing facility waste. In one embodiment, the heat and/or steam is used to generate electricity. In other embodiments, the heat and/or steam is used to power the grain processing facility, livestock production facility, livestock processing facility or food processing facility. In another embodiment, one or more environmental controls are used. In a particular embodiment, ethanol byproducts are used as the agricultural biofuel.
Type:
Grant
Filed:
February 24, 2003
Date of Patent:
September 4, 2007
Assignees:
Harris Contracting Company, Alliant Energy Corporate Services, Inc., VCN Roll, Inc.
Inventors:
Brian Copeland, Gregory Scott Coil, Robert A Latta, Jr., Thomas Anthony Lenaghan
Abstract: The invention provides methods for separating outer birch bark from inner birch bark. The invention also provides methods for isolating betulin; lupeol; betulinic acid; 9,10-epoxy-18-hydroxyoctadecanoic acid; 9,10,18-trihydroxyoctadecanoic acid; polyphenolic polymers and fatty acids from birch bark.
Type:
Grant
Filed:
October 14, 2004
Date of Patent:
September 4, 2007
Assignee:
Regents of the University of Minnesota
Inventors:
Pavel A. Krasutsky, Robert M. Carlson, Vitaliy V. Nesterenko, Igor V. Kolomitsyn, Chris F. Edwardson
Abstract: A high precision force and displacement measuring device adapted to operate in at least two directions, including signal multiplexing scheme providing multiple signal channels to be transmitted through a single pick-up plate and sense amplifier, while maintaining high isolation between the channels, as well as identical electrical response characteristics of all channels. The device may be used in conjunction with a movable stage (such as on an optical microscope) to perform mechanical measurements on Micro Electro-Mechanical Systems (MEMS) devices.
Abstract: The present invention provides for wood based panels (e.g., OSB or plywood) that are termite resistant, fungal resistant, or a combination thereof; and methods of manufacturing the same.
Type:
Grant
Filed:
September 24, 2004
Date of Patent:
September 4, 2007
Assignee:
Potlatch Corporation
Inventors:
Donald Hejna, Bruce Trebnick, Ron S. Salisbury, Thomas G. Herion
Abstract: A package coating is processed by applying a plurality of aqueous mixtures over a substrate. The aqueous mixtures each include a combination of pigments and binders. A packaging article is also disclosed that is made from the package coating on a substrate. Additionally, a packaging system is included that contains commercial product.
Type:
Grant
Filed:
October 28, 2003
Date of Patent:
August 28, 2007
Assignee:
Potlatch Corporation
Inventors:
Melvin Jokela, Cathy Kortesmaki, Ann Williams
Abstract: A wireless local area network (WLAN) device (200, FIG. 2) includes a medium access control (MAC) device (204) and a physical (PHY) device (202). The PHY device receives and transmits frames (FIG. 3) over a wireless medium. The MAC device detects (604, FIG. 6) when receipt is completed of a physical layer convergence procedure (PLCP) header (304, FIG. 3) of a received frame. Based on information that the MAC device extracts (606) from the PLCP header, the MAC device predicts (618) header information for a response frame before receipt of the received frame has completed. The PHY device begins transmitting (1110, FIG. 11) the response frame preamble (302, FIG. 3) upon expiration of an interframe space (IFS).
Abstract: A method that uses software-pipelining to translate programs, from higher level languages into equivalent object or machine language code for execution on a computer, including sparse arrays/matrices. In one example embodiment, this is accomplished by transforming sparse array matrix source code and software-pipelining the transformed source code to reduce recurrence initiation interval, decrease run time, and enhance performance.
Abstract: Some embodiments relate to a semiconducting device that includes a substrate, a die and an interconnect device. The die and interconnect device are attached to an upper surface of the substrate. The semiconducting device further includes a first wire that is bonded to the substrate and to the interconnect device and a second wire that is bonded to the interconnect device and to the die. Other example embodiments include a stack of dice that has a bottom die attached to the upper surface of the substrate and a top die stacked onto the other dice in the stack of dice. The interconnect device is attached to an upper surface of any die in the stack of dice such that a first wire is bonded to the substrate and to the interconnect device and a second wire is bonded to the interconnect device and to the top die.
Type:
Grant
Filed:
September 28, 2004
Date of Patent:
August 28, 2007
Assignee:
Intel Corporation
Inventors:
Ruel B. Pieda, Carmelito M. Libay, Joan Rey V. Buot
Abstract: An inventive security framework for supporting kernel-based hypervisors within a computer system. The security framework includes a security master, one or more security modules and a security manager, wherein the security master and security modules execute in kernel space.
Type:
Grant
Filed:
December 2, 2003
Date of Patent:
August 28, 2007
Assignee:
Secure Computing Corporation
Inventors:
Richard O'Brien, Raymond Lu, Terrence Mitchem, Spencer Minear