Abstract: A semiconductor optical amplifier for eliminating cross talk. The semiconductor optical amplifier includes a waveguide ridge that is formed on a broad area semiconductor laser. The ridge has angled facets and guides incident optical signals through the active region. When lasing, the broad area semiconductor laser locks the carrier density and photon density such that an incident optical signal does not affect the carrier density or the photon density. Thus, the broad area laser and the semiconductor optical amplifier share the same active region or gain medium and cross talk is eliminated when multiple optical signals are incident on the semiconductor optical amplifier.

Abstract: Systems and methods for transmitting messages, such as real-time messages, from an entity outside a firewall to a recipient inside the firewall. The messages include the address of a bridgehead server exposed through the firewall and information identifying the recipient client. The network protected by the firewall can include one or more bridgehead servers, one or more messaging servers associated with each bridgehead server, and one or more clients assigned to each messaging server. When a bridgehead server receives a message, it resolves the address of the messaging server to which the recipient client is assigned. The message is forwarded to the messaging server and, in turn, to the recipient client. The sender of the message does not need to know the identity or address of the messaging server.

Abstract: Described are methods and apparatus that allow cable customers who wish to add a cable modem (or other device) to a local network to choose both the cable modem through which they access the Internet and the Internet Service Provider (ISP) that will provide them that access. A system of hardware connects the local network to the Internet. This hardware includes cable-modem infrastructure that denies Internet access to devices on the local network that are not registered with an authorized ISP. The hardware also facilitates the registration process, allowing devices new to the local network to establish Internet-access agreements with ISPs, and thereby gain access to the Internet.

Abstract: Methods are disclosed for forming shaped structures from silicon and/or germanium containing material with a material removal process that is selective to low stress portions of the material. In general, the method initially provides a layer of the material on a semiconductor substrate. The material, which has uniform stress therein, is then masked, and the stress in a portion of the material is reduced, such as by implanting ions into an unmasked portion. The mask is removed, and either the high stress masked portion or the low stress unmasked portion of the material is selectively removed, preferably by an etching process. The portion of the material not removed remains and forms a shaped structure. The various methods are used to form raised shaped structures, shaped openings, polysilicon plugs, capacitor storage nodes, surround-gate transistors, free-standing walls, interconnect lines, trench capacitors, and trench isolation regions.

Abstract: A communications card allows computers to be electrically connected to electronic devices and communications systems. The communications card includes a modular jack with a plurality of contact pins. The contact pins include a plug engaging portion that does not include any sections that are angled more than about 90° in order to minimize the stresses in the contact pins. The contact pins also include a connector portion that allows the contact pins to be electrically connected to a printed circuit board disposed within the communications card. Preferably, the plug engaging portion includes an elongated arm that aids in absorbing stress and deflection of the contact pins. Advantageously, the contact pins are designed to minimize the height of the modular jack such that the modular jack can be used with communications cards that comply with the PCMCIA Type III standards.

Abstract: A micro-fluidic cell for optical detection of gases provided according to the present invention includes a concentration cell and a detection cell, and increases the sensitivity of optical detection of gases, selectivity of components, and accuracy of quantitative determination, and also achieves a low electric power consumption and a small-sized, light-weight configuration of the entire apparatus.

Abstract: A cover suitable for use in conjunction with a wheelchair wheel. The cover includes a durable nylon fabric and includes a barrier and a cover portion, the barrier being interposed between an inner surface of the cover portion and the tread and sidewalls of the wheel so that foreign matter present on the wheel does not contaminate or otherwise harm any persons or surfaces with which the covered wheel may come into contact. The cover further includes an outer surface and first and second edges. A plurality of straps attached to the first edge of the cover, and configured to be removably attached to the second edge of the cover, permit the cover to be readily attached to, and detached from, the wheel. Finally, a plurality of lateral seams on the outer surface of the cover facilitate traction when the wheelchair passes over relatively smooth surfaces.

Abstract: A method and computer program product for overcoming the inefficiencies associated with inter-buffer data transfers between separate processing components such as kernel mode drivers that are chained together. Provided is a standard mechanism for allocating and managing data buffers needed for processing data in a system, wherein multiple drivers are chained together using a standardized connection method in the connection pin instances. Drivers having different buffer requirements and capabilities may be queried and matched for easy data transition between the chained drivers requiring the least number of buffers and, hence the least expensive yet most efficient inter-buffer data transfer. Examples of buffer requirements include previous frame storage for adaptive processing, byte alignment, frame size, outstanding frames allowed, etc. The buffer requirements of an input connection pin instance may be queried by an application initializing the chained drivers.

Abstract: Methods are disclosed for forming shaped structures from silicon and/or germanium containing material with a material removal process that is selective to low stress portions of the material. In general, the method initially provides a layer of the material on a semiconductor substrate. The material, which has uniform stress therein, is then masked, and the stress in a portion of the material is reduced, such as by implanting ions into an unmasked portion. The mask is removed, and either the high stress masked portion or the low stress unmasked portion of the material is selectively removed, preferably by an etching process. The portion of the material not removed remains and forms a shaped structure. The various methods are used to form raised shaped structures, shaped openings, polysilicon plugs, capacitor storage nodes, surround-gate transistors, free-standing walls, interconnect lines, trench capacitors, and trench isolation regions.

Abstract: A stamp for forming customized designs and decorative edging in concrete surfaces of varying size and shape. The stamp has a smooth contact surface and a ridge that defines a pattern that is imprinted in sufficiently hardened concrete. The tool also has measurement markings and reference points that can be used for positioning the tool in a desired location. The stamp has the property of being able to be placed adjacent to another tool or imprint that is out of horizontal and vertical alignment without interfering with the adjacent tool or imprint. The stamp also has the property of being able to overlap a previous stamp placement without interfering with the imprint formed by the previous stamp placement.

Abstract: Methods are disclosed for forming shaped structures from silicon and/or germanium containing material with a material removal process that is selective to low stress portions of the material. In general, the method initially provides a layer of the material on a semiconductor substrate. The material, which has uniform stress therein, is then masked, and the stress in a portion of the material is reduced, such as by implanting ions into an unmasked portion. The mask is removed, and either the high stress masked portion or the low stress unmasked portion of the material is selectively removed, preferably by an etching process. The portion of the material not removed remains and forms a shaped structure. The various methods are used to form raised shaped structures, shaped openings, polysilicon plugs, capacitor storage nodes, surround-gate transistors, free-standing walls, interconnect lines, trench capacitors, and trench isolation regions.

Abstract: The present invention provides for automatic placement of typographical features such as vertical stems or horizontal segments of a character on high contrast pixel sub-component boundaries as part of a rendering process that uses separately controllable pixel sub-components of pixels to represent different portions of the character. In order to identify the typographical features of the character that are to be aligned with high contrast pixel sub-component boundaries, topology of the character is analyzed at runtime. In display devices having vertical stripes of same-colored pixel sub-components, it has been found that character legibility is increased when the left edges of stems are aligned with high contrast boundaries between pixel sub-components. Processing time and resources are conserved by performing a partial, rather than a full, topological analysis of the character.

Abstract: A contact to a semiconductor substrate including a contact opening extending through an insulating layer to a doped active region of the semiconductor substrate. The contact opening can have a relatively high aspect ratio of 2:1 or greater. The contact further includes a refractory metal germanosilicide region at the bottom of the contact opening, a refractory metal germanide layer at the sidewalls of the contact opening, and an overlying refractory metal nitride layer. The refractory metals of the invention include at least tantalum, titanium, cobalt and mixtures thereof. The contact is metallized, preferably using tungsten or aluminum. The method of manufacturing the contact comprises etching the contact opening. A germane gas is used to clean native silicon dioxide from the bottom of the contact opening and to deposit a germanium layer thereon. A refractory metal layer is deposited over the germanium layer. After annealing in a nitrogen atmosphere at a temperature of about 600° C.

Abstract: A method of making a contact plug and a metallization line structure is disclosed in which a substrate is provided with at least one contact hole within an insulation layer situated on a semiconductor substrate of a semiconductor wafer. A first metal layer is deposited upon the semiconductor wafer within the contact hole. A planarizing step isolates the first metal layer within the insulation layer in the form of a contact plug within the contact hole. A second metal layer is then deposited upon the semiconductor wafer over and upon the contact plug. Metallization lines are patterned and etched from the second metal layer. The contact hole may also be lined with a refractory metal nitride layer, with a refractory metal silicide interface being formed at the bottom of the contact hole as an interface between the contact plug and a silicon layer on the semiconductor substrate.

Abstract: A process, software and apparatus for eliminating from a video telephony signal information that is extraneous to the user's head, and replacing it with a monotonous data for transmission to the other end of the videophone link, is disclosed. The resulting video stream looks better upon subsequent viewing, and can be more efficiently transmitted and/or compressed for transmission or recording. Furthermore, the system provides for background setting replacement in video telephony encoding and decoding, wherein an image stored on the receiving end of the videophone link can be used to replace the monotonous data. Furthermore, the system provides for a sliding viewport that allows a user to position or adjust the source camera to provide a wide field of view, but ensures that the user's head will be automatically centered within the transmitted video signal.

Abstract: Disclosed is a process for analyzing the surface characteristics of opaque materials. The method comprises in one embodiment the use of a UV reflectometer to build a calibration matrix of data from a set of control samples and correlating a desired surface characteristic such as roughness or surface area to the set of reflectances of the control samples. The UV reflectometer is then used to measure the reflectances of a test sample of unknown surface characteristics. Reflectances are taken at a variety of angles of reflection for a variety of wavelengths, preferably between about 250 nanometers to about 400 nanometers. These reflectances are then compared against the reflectances of the calibration matrix in order to correlate the closest data in the calibration matrix. By so doing, a variety of information is thereby concluded, due to the broad spectrum of wavelengths and angles of reflection used.

Abstract: A method and apparatus for vaporizing and cracking chemical elements for use in a deposition process. The apparatus includes a vaporization cell integrally connected with a thermal cracker cell. The vaporization cell has an inlet section in communication with a valve section defining a heating chamber capable of holding a liquid or solid chemical material to be vaporized. A heat source is positioned in the heating chamber and is capable of providing sufficient thermal energy to evaporate or sublimate the chemical material. The thermal cracker cell is communicatively connected to an outlet of the vaporization cell, and includes an elongated tapered tube with a heating element associated therewith. The heating element is capable of providing sufficient thermal energy to dissociate molecular clusters of vaporized chemical material. This provides monomeric or dimeric chemical elements for use in a deposition process such as during semiconductor device fabrication.